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    • 1. 发明授权
    • Complementary field effect transistor and its manufacturing method
    • 互补场效应晶体管及其制造方法
    • US07087969B2
    • 2006-08-08
    • US10760501
    • 2004-01-21
    • Akira NishiyamaMizuki OnoMasato KoyamaTakamitsu Ishihara
    • Akira NishiyamaMizuki OnoMasato KoyamaTakamitsu Ishihara
    • H01L29/76H01L31/119
    • H01L21/28185H01L21/28202H01L21/823842H01L29/518
    • A complementary field effect transistor comprises: a semiconductor substrate; an n-type field effect transistor provided on the semiconductor substrate; and a p-type field effect transistor provided on the semiconductor substrate. The n-type field effect transistor has: a first gate insulating film containing an oxide including an element selected from the group consisting of group IV metals and Lanthanoid metals, and further containing a compound of the element and a group III element; a first gate electrode provided on the first gate insulating film; and n-type source and drain regions formed on both sides of the first gate electrode. The p-type field effect transistor has: a second gate insulating film containing an oxide including an element selected from the group consisting of group IV metals and Lanthanoid metals, and including substantially no positive charge; a second gate electrode provided on the second gate insulating film; and p-type source and drain regions provided on both sides of the second gate electrode.
    • 互补场效应晶体管包括:半导体衬底; 设置在半导体衬底上的n型场效应晶体管; 以及设置在半导体基板上的p型场效应晶体管。 n型场效应晶体管具有:包含含有选自IV族金属和镧系金属的元素的氧化物的第一栅极绝缘膜,并且还含有元素和III族元素的化合物; 设置在所述第一栅极绝缘膜上的第一栅电极; 以及形成在第一栅电极的两侧上的n型源区和漏区。 p型场效应晶体管具有:第二栅极绝缘膜,其含有包含选自第Ⅳ族金属和镧系金属的元素的氧化物,并且基本上不含正电荷; 设置在所述第二栅极绝缘膜上的第二栅电极; 以及设置在第二栅电极的两侧的p型源区和漏区。
    • 2. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08053300B2
    • 2011-11-08
    • US11841817
    • 2007-08-20
    • Reika IchiharaYoshinori TsuchiyaMasato KoyamaAkira Nishiyama
    • Reika IchiharaYoshinori TsuchiyaMasato KoyamaAkira Nishiyama
    • H01L21/8238
    • H01L21/823857H01L21/823462
    • A semiconductor device includes a semiconductor substrate, an nMISFET formed on the substrate, the nMISFET including a first dielectric formed on the substrate and a first metal gate electrode formed on the first dielectric and formed of one metal element selected from Ti, Zr, Hf, Ta, Sc, Y, a lanthanoide and actinide series and of one selected from boride, silicide and germanide compounds of the one metal element, and a pMISFET formed on the substrate, the pMISFET including a second dielectric formed on the substrate and a second metal gate electrode formed on the second dielectric and made of the same material as that of the first metal gate electrode, at least a portion of the second dielectric facing the second metal gate electrode being made of an insulating material different from that of at least a portion of the first dielectric facing the first metal gate electrode.
    • 半导体器件包括半导体衬底,形成在衬底上的nMISFET,nMISFET包括形成在衬底上的第一电介质和形成在第一电介质上的第一金属栅极,并由选自Ti,Zr,Hf, Ta,Sc,Y,镧系元素和锕系和选自所述一种金属元素的硼化物,硅化物和锗化合物的一种,以及形成在所述衬底上的pMISFET,所述pMISFET包括形成在所述衬底上的第二电介质和第二金属 栅电极形成在第二电介质上并由与第一金属栅电极相同的材料制成,第二电介质面向第二金属栅电极的至少一部分由绝缘材料制成,绝缘材料与至少一部分 的第一电介质面向第一金属栅电极。
    • 3. 发明申请
    • Semiconductor device
    • 半导体器件
    • US20100171184A1
    • 2010-07-08
    • US12654490
    • 2009-12-22
    • Reika IchiharaYoshinori TsuchiyaMasato KoyamaAkira Nishiyama
    • Reika IchiharaYoshinori TsuchiyaMasato KoyamaAkira Nishiyama
    • H01L27/092
    • H01L21/823857H01L21/823462
    • A semiconductor device includes a semiconductor substrate, an nMISFET formed on the substrate, the nMISFET including a first dielectric formed on the substrate and a first metal gate electrode formed on the first dielectric and formed of one metal element selected from Ti, Zr, Hf, Ta, Sc, Y, a lanthanoide and actinide series and of one selected from boride, silicide and germanide compounds of the one metal element, and a pMISFET formed on the substrate, the pMISFET including a second dielectric formed on the substrate and a second metal gate electrode formed on the second dielectric and made of the same material as that of the first metal gate electrode, at least a portion of the second dielectric facing the second metal gate electrode being made of an insulating material different from that of at least a portion of the first dielectric facing the first metal gate electrode.
    • 半导体器件包括半导体衬底,形成在衬底上的nMISFET,nMISFET包括形成在衬底上的第一电介质和形成在第一电介质上的第一金属栅极,并由选自Ti,Zr,Hf, Ta,Sc,Y,镧系元素和锕系和选自所述一种金属元素的硼化物,硅化物和锗化合物的一种,以及形成在所述衬底上的pMISFET,所述pMISFET包括形成在所述衬底上的第二电介质和第二金属 栅电极形成在第二电介质上并由与第一金属栅电极相同的材料制成,第二电介质面向第二金属栅电极的至少一部分由绝缘材料制成,绝缘材料与至少一部分 的第一电介质面向第一金属栅电极。
    • 10. 发明申请
    • Semiconductor Device
    • 半导体器件
    • US20070296043A1
    • 2007-12-27
    • US11841757
    • 2007-08-20
    • Reika IchiharaYoshinori TsuchiyaMasato KoyamaAkira Nishiyama
    • Reika IchiharaYoshinori TsuchiyaMasato KoyamaAkira Nishiyama
    • H01L29/76
    • H01L21/823857H01L21/823462
    • A semiconductor device includes a semiconductor substrate, an nMISFET formed on the substrate, the nMISFET including a first dielectric formed on the substrate and a first metal gate electrode formed on the first dielectric and formed of one metal element selected from Ti, Zr, Hf, Ta, Sc, Y, a lanthanoide and actinide series and of one selected from boride, silicide and germanide compounds of the one metal element, and a pMISFET formed on the substrate, the pMISFET including a second dielectric formed on the substrate and a second metal gate electrode formed on the second dielectric and made of the same material as that of the first metal gate electrode, at least a portion of the second dielectric facing the second metal gate electrode being made of an insulating material different from that of at least a portion of the first dielectric facing the first metal gate electrode.
    • 半导体器件包括半导体衬底,形成在衬底上的nMISFET,nMISFET包括形成在衬底上的第一电介质和形成在第一电介质上的第一金属栅极,并由选自Ti,Zr,Hf, Ta,Sc,Y,镧系元素和锕系和选自所述一种金属元素的硼化物,硅化物和锗化合物的一种,以及形成在所述衬底上的pMISFET,所述pMISFET包括形成在所述衬底上的第二电介质和第二金属 栅电极形成在第二电介质上并由与第一金属栅电极相同的材料制成,第二电介质面向第二金属栅电极的至少一部分由绝缘材料制成,绝缘材料与至少一部分 的第一电介质面向第一金属栅电极。