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1. 发明授权

US5015097A Method for inspecting filled state of via-holes filled with fillers and apparatus for carrying out the method 失效
标题翻译：用于检查填充有填充物的通孔的填充状态的方法和用于执行该方法的装置
公开(公告)号：US5015097A
公开(公告)日：1991-05-14
申请号：US416934
申请日：1989-10-04
申请人： Mineo Nomoto , Takanori Ninomiya , Hiroya Koshishiba , Toshimitsu Hamada , Yasuo Nakagawa
发明人： Mineo Nomoto , Takanori Ninomiya , Hiroya Koshishiba , Toshimitsu Hamada , Yasuo Nakagawa
IPC分类号： G01N21/88 , G01N21/956 , G06T7/00 , H05K3/00 , H05K3/40
CPC分类号： G06T7/0004 , G01N21/95692 , G06T7/604 , G01N2021/95653 , G01N21/8806 , G06T2207/30141
摘要： A method for inspecting the filled state of a plurality of via-holes which pass through a non-conductive circuit board and are filled with a conductive substance and an apparatus for carrying out the method are disclosed.The surface of the circuit board is illuminated in two directions to generate shadows depending on the concave or convex state of the fillers in a plurality of via-holes. An optical image of the illuminated surface of the circuit board is detected. Each edge of the two shadow areas, which exist in the detected optical image and are generated in one via-hole by light irradiation in two directions, is detected. Whether the filler in this one via-hole is in the concave state or convex state is identified according to the mutual position relationship of the detected edges. The length of each shadow area is detected, and whether the concave state or convex state of the filler is within a predetermined allowance is decided according to the detection results. The area of the image of the filler is detected according to differences between the brightness of the board surface or of the via-hole wall and the brightness of the filler in the via-hole in the detected optical image, and whether the filler is lacking or not is decided according to the detection result.
摘要翻译：公开了一种用于检查通过非导电电路板并填充有导电物质的多个通孔的填充状态的方法和用于实施该方法的装置。电路板的表面在两个方向上被照亮，以产生取决于多个通孔中的填料的凹凸状态的阴影。检测电路板的被照射表面的光学图像。检测存在于所检测的光学图像中并且在两个方向上通过光照射在一个通孔中产生的两个阴影区域的每个边缘。根据检测到的边缘的相互位置关系来识别该通孔中的填充物是处于凹状还是凸状状态。检测每个阴影区域的长度，根据检测结果确定填料的凹状或凸状状态是否处于预定的余量内。根据检测到的光学图像中的基板表面或通孔壁的亮度与通孔中的填充物的亮度之间的差异来检测填充物的图像的面积，以及填充材料是否缺乏是否根据检测结果决定。

2. 发明授权

US4772125A Apparatus and method for inspecting soldered portions 失效
标题翻译：用于检查焊接部分的装置和方法
公开(公告)号：US4772125A
公开(公告)日：1988-09-20
申请号：US875974
申请日：1986-06-19
申请人： Kazushi Yoshimura , Takashi Hiroi , Takanori Ninomiya , Toshimitsu Hamada , Yasuo Nakagawa , Kohichi Karasaki
发明人： Kazushi Yoshimura , Takashi Hiroi , Takanori Ninomiya , Toshimitsu Hamada , Yasuo Nakagawa , Kohichi Karasaki
IPC分类号： G01B11/24 , G01N21/64 , G01N21/88 , G01N21/956 , G06T7/00
CPC分类号： G06T7/0006 , G01N21/95684 , G01N2021/95646 , G01N21/64 , G06T2207/10064 , G06T2207/30152
摘要： An apparatus for inspecting an appearance of soldered portions connected between the pads formed on a printed circuit board and leads of an electronic body part. A slit light beam is directed to portions to be inspected and scanned thereon with a light fluorescent image generated from the substrate portion of the printed circuit board and a dark fluorescent image generated from the leads, pads and soldered portions being detected with an image signal being generated in accordance therewith. The image signal is binarized and different functions are extracted from the binarized signal which functions are utilized in connection with other functions and previously obtained data to determine whether an abnormal portion is present or not in a predetermined position on the circuit board.
摘要翻译：一种用于检查连接在形成在印刷电路板上的焊盘和电子主体部分的引线之间的焊接部分的外观的装置。利用从印刷电路板的基板部分产生的荧光图像将狭缝光束引导到要检查和扫描的部分，并且从引线，焊盘和焊接部分产生的暗荧光图像被图像信号检测到根据其产生。图像信号被二值化，并且从二值化信号中提取不同的功能，该功能与其他功能相关联使用，并且先前获得的数据用于确定在电路板上的预定位置是否存在异常部分。

3. 发明授权

US5645351A Temperature measuring method using thermal expansion and an apparatus for carrying out the same 失效
标题翻译：使用热膨胀的温度测量方法及其执行装置
公开(公告)号：US5645351A
公开(公告)日：1997-07-08
申请号：US364777
申请日：1994-12-27
申请人： Toshihiko Nakata , Shigeki Hirasawa , Yoko Saito , Takanori Ninomiya , Mineo Nomoto
发明人： Toshihiko Nakata , Shigeki Hirasawa , Yoko Saito , Takanori Ninomiya , Mineo Nomoto
IPC分类号： G01K5/52 , G01N21/17 , G01N29/24 , G01N29/34 , G01J5/38
CPC分类号： G01N29/346 , G01K5/52 , G01N21/171 , G01N29/2418 , G01N2291/012
摘要： A temperature measuring method and apparatus for measuring temperature of at least one measuring point of a sample. At least one measuring point on a surface of a sample at least with a first light. A displacement of the at least one measuring point on the surface of the sample occurs from thermal expansion of the sample in response to the first light impinging thereon and a signal indicative of the displacement is produced. The temperature of the at least one measuring point of the sample is determined from the signal.
摘要翻译：一种用于测量样品的至少一个测量点的温度的温度测量方法和装置。至少一个样品表面上至少有一个测量点至少有一个第一个光。样品表面上的至少一个测量点的位移是由于样品响应于其上的第一个光的热膨胀而发生的，并且产生了表示位移的信号。根据信号确定样品的至少一个测量点的温度。

4. 发明授权

US5973777A Method and apparatus for inspecting defects of surface shape 失效
标题翻译：检查表面形状缺陷的方法和装置
公开(公告)号：US5973777A
公开(公告)日：1999-10-26
申请号：US880543
申请日：1997-06-23
申请人： Mineo Nomoto , Takanori Ninomiya , Yuji Takagi
发明人： Mineo Nomoto , Takanori Ninomiya , Yuji Takagi
IPC分类号： G01N21/88 , G01N21/00 , G01B11/24 , G01B11/30
CPC分类号： G01N21/88
摘要： In order to detect a local shape defect on an inner surface of an ordinary plane member with a high degree of accuracy as a state distinguished from a big waviness deformation, a surface-shape-defect inspecting method and apparatus for identifying the shape defect on the inner surface of the plane member is provided. The method and apparatus provides for scanning optically the entire area of the plane member, extracting a shape of the surface of the plane member as absolute height displacement data at scanning positions, finding a difference between a reference surface shape inferred from the extracted shape of the surface of the plane member and the shape of the surface, and using the difference as relative height displacement data with respect to the reference surface shape, and detecting the shape defect on the surface by identifying the location of the shape defect through comparison of the relative height displacement data with predetermined allowable displacement.
摘要翻译：为了高精度地检测普通平面构件的内表面上的局部形状缺陷作为与大波纹变形不同的状态，可以使用表面形状缺陷检查方法和装置来识别形状缺陷提供了平面构件的内表面。该方法和装置提供扫描平面构件的整个区域的光学扫描，将平面构件的表面的形状作为扫描位置处的绝对高度位移数据提取，从提取的形状推定出的参考表面形状之间的差异平面构件的表面和表面的形状，并且使用该差作为相对于参考表面形状的相对高度位移数据，并且通过相对于参考表面形状的比较来识别形状缺陷的位置来检测表面上的形状缺陷具有预定允许位移的高度位移数据。

5. 发明授权

US5463667A Inspection method for soldered joints using x-ray imaging and apparatus therefor 失效
标题翻译：使用X射线成像的焊接接头的检查方法及其设备
公开(公告)号：US5463667A
公开(公告)日：1995-10-31
申请号：US53240
申请日：1993-04-28
申请人： Toshiaki Ichinose , Takanori Ninomiya , Asahiro Kuni , Kozo Nakahata , Toshimitsu Hamada , Toshihiko Ayabe
发明人： Toshiaki Ichinose , Takanori Ninomiya , Asahiro Kuni , Kozo Nakahata , Toshimitsu Hamada , Toshihiko Ayabe
IPC分类号： G01N23/04 , H01L21/66 , H01L23/50 , H05K3/34 , H05K13/08
CPC分类号： H05K13/08 , G01N23/04
摘要： A method and an apparatus for inspecting a soldered joint with an X-ray, the soldered joint being formed by soldering a lead to a surface of a substrate. The method may include moving the substrate so as to move the surface of the substrate in an XY plane to position the soldered joint at a desired position in the XY plane, rotating the substrate so as to rotate the surface of the substrate in the XY plane to position the soldered joint at a desired orientation in the XY plane, rotating an X-ray source and a detector about the soldered joint in both of two mutually perpendicular planes perpendicular to the XY plane while maintaining the X-ray source and the detector at fixed positions relative to each other to establish a desired oblique irradiation angle between an X-ray from the X-ray source and the lead on the surface of the substrate, irradiating the soldered joint with the X-ray from the X-ray source at the desired oblique irradiation angle such that the X-ray is transmitted through the soldered joint and the substrate, detecting the X-ray transmitted through the soldered joint and the substrate with the detector, the detector producing an output signal indicative of the detected X-ray, and determining a condition of the soldered joint based on the output signal of the detector. The apparatus may operate in the same fashion.
摘要翻译：一种用X射线检测焊接接头的方法和装置，所述焊接接头通过将引线焊接到基板的表面而形成。该方法可以包括移动基板以使基板的表面在XY平面中移动，以将焊接接头定位在XY平面中的期望位置，旋转基板以使基板的表面在XY平面中旋转将焊接接头定位在XY平面中所需的取向上，使X射线源和检测器围绕焊接接头在与XY平面垂直的两个相互垂直的平面中旋转，同时将X射线源和检测器保持在固定位置，以建立来自X射线源的X射线与衬底表面上的铅之间的期望的倾斜照射角度，用X射线源的X射线照射焊接接头所需的倾斜照射角度，使得X射线透射通过焊接接头和基板，通过检测器检测透过焊接接头和基板的X射线，检测器产品选择表示检测到的X射线的输出信号，以及基于检测器的输出信号确定焊接接头的状态。该装置可以以相同的方式操作。

6. 发明授权

US5930382A Wiring pattern inspecting method and system for carrying out the same 失效
标题翻译：接线方式检查方法和系统进行
公开(公告)号：US5930382A
公开(公告)日：1999-07-27
申请号：US645475
申请日：1996-05-13
申请人： Yoko Irie , Hideaki Doi , Yasuhiko Hara , Tadashi Iida , Yasuhiro Fujishita , Yasuo Nakagawa , Takanori Ninomiya
发明人： Yoko Irie , Hideaki Doi , Yasuhiko Hara , Tadashi Iida , Yasuhiro Fujishita , Yasuo Nakagawa , Takanori Ninomiya
IPC分类号： G01N23/04 , G01N21/88 , G01N21/956 , G01N29/04 , G01R31/02 , G06T7/00 , H05K3/00 , G06K9/00 , G06K9/32 , G06K9/42
CPC分类号： G06T7/0004 , G06T2207/10116 , G06T2207/20044 , G06T2207/30141
摘要： A wiring pattern inspecting method comprises irradiating a test object provided with wiring patterns formed in a plurality of layers with x-rays, obtaining a variable-density image signal corresponding to the thickness of the wiring patterns superposed in a plurality of layers including superposed sections of the wiring patterns, extracting a plurality of image signals, the number of which corresponding to that of the superposed wiring patterns, from the variable-density image signal, and comparing end point information or isolated point information about the wiring patterns obtained from image signal representing a larger number of superposed wiring patterns, and branch information about the end points or the isolated points on the wiring points, obtained from the extracted image signal representing a smaller number of superposed wiring patterns to inspect the wiring patterns for defects in the wiring patterns. The wiring pattern inspecting method is carried out by a wiring pattern inspecting system.
摘要翻译：布线图案检查方法包括用X射线照射设置有多层的布线图案的测试对象，获得与叠加在多个层中的布线图案的厚度相对应的可变密度图像信号，所述多个层包括叠加部分布线图案，从可变密度图像信号中提取与叠加布线图案的数量相对应的多个图像信号的数量，以及比较从表示的图像信号获得的布线图案的终点信息或孤立点信息从提取的图像信号中获得的表示较少数量的叠加布线图案以检查布线图案中的布线图案中的缺陷的叠加布线图案的数量以及关于布线点上的端点或隔离点的分支信息。布线图形检查方法由布线图形检查系统进行。

7. 发明授权

US5278012A Method for producing thin film multilayer substrate, and method and apparatus for detecting circuit conductor pattern of the substrate 失效
标题翻译：薄膜多层基板的制造方法以及检测基板电路导体图案的方法和装置
公开(公告)号：US5278012A
公开(公告)日：1994-01-11
申请号：US938516
申请日：1992-09-02
申请人： Chie Yamanaka , Toshiaki Ichinose , Takanori Ninomiya , Hisafumi Iwata , Yasuo Nakagawa , Nobuyuki Akiyama
发明人： Chie Yamanaka , Toshiaki Ichinose , Takanori Ninomiya , Hisafumi Iwata , Yasuo Nakagawa , Nobuyuki Akiyama
IPC分类号： G01N21/956 , H01L21/00 , H01L21/48 , H01L21/66 , H05K3/22 , G01N21/88 , G01N21/64
CPC分类号： H01L21/67121 , G01N21/95684 , H01L21/4857 , H01L22/20 , H05K3/225 , G01N2021/8825
摘要： A method for producing a thin film multilayer substrate having a base substrate, and, which a plurality of conductor pattern layers superposed thereon through dielectric layers therebetween comprises the steps of: optically detecting the uppermost conductor pattern layer whenever the conductor pattern layer is formed on the base substrate; inspecting an absence and/or presence of a fault of the conductor pattern layer; and repairing a faulty portion in accordance with fault position data detected by the inspecting. According to this method, it is possible to enhance a production yield of relatively large size of thin film multilayer substrates which needs a relatively small amount of production at a high production cost, for mounting LSI chips thereon.
摘要翻译：一种制造具有基底基板的薄膜多层基板的方法，其中通过介电层叠置在其上的多个导体图案层之间包括以下步骤：每当在导体图案层上形成导体图案层时，光学检测最上面的导体图案层基底; 检查导体图案层的缺陷和/或存在故障; 并根据检查检测到的故障位置数据修复故障部分。根据这种方法，可以提高生产成本较高的相对大尺寸薄膜多层基板的生产成本，以便在其上安装LSI芯片。

8. 发明授权

US4791586A Method of and apparatus for checking geometry of multi-layer patterns for IC structures 失效
标题翻译：用于检查IC结构的多层图案几何的方法和装置
公开(公告)号：US4791586A
公开(公告)日：1988-12-13
申请号：US812928
申请日：1985-12-23
申请人： Shunji Maeda , Hitoshi Kubota , Satoru Fushimi , Hiroshi Makihira , Takanori Ninomiya , Yasuo Nakagawa
发明人： Shunji Maeda , Hitoshi Kubota , Satoru Fushimi , Hiroshi Makihira , Takanori Ninomiya , Yasuo Nakagawa
IPC分类号： H01L21/66 , G06T7/00 , G06K9/00
CPC分类号： G06T7/001 , G06T2207/10056 , G06T2207/30148
摘要： Method of and apparatus for checking the geometry of multi-layer patterns for IC structures having identical functions, each of the multi-layer patterns including layer patterns arranged in different level layers, wherein electrical image signals corresponding to any two of the multi-layer patterns and having more than two levels are registered with each other and then compared to determine unmatched and matched portions. The comparison of the registered electric image signals may be performed with respect to their amplitude or their gradients. The registration and comparison of two electric image signals may be repeated for all of the layer patterns with the matched portions being no longer subjected to the registration and comparison. A defect detection signal is produced from finally unmatched portions, if any, of the electric image signals having undergone the said registration and comparison.
摘要翻译：用于检查具有相同功能的IC结构的多层图案的几何形状的方法和装置，每个多层图案包括布置在不同层级中的层图案，其中对应于多层图案中的任何两个的电图像信号并且具有两个以上的级别彼此登记，然后进行比较以确定不匹配和匹配的部分。登记的电图像信号的比较可以相对于它们的振幅或梯度进行。对于所有的层图案，可以对匹配的部分不再进行注册和比较来重复两个电图像信号的配准和比较。如果有的话，经过所述登记和比较的电子图像信号的最终不匹配的部分产生缺陷检测信号。

9. 发明授权

US4654583A Method and apparatus for detecting defects of printed circuit patterns 失效
标题翻译：用于检测印刷电路图案的缺陷的方法和装置
公开(公告)号：US4654583A
公开(公告)日：1987-03-31
申请号：US600957
申请日：1984-04-16
申请人： Takanori Ninomiya , Yasuo Nakagawa , Keiya Saito
发明人： Takanori Ninomiya , Yasuo Nakagawa , Keiya Saito
IPC分类号： G01N21/956 , G06T7/00 , G01R15/12 , G01B11/00
CPC分类号： G06T7/0006 , G01N21/956 , G06T2207/30141
摘要： A printed circuit pattern inspection system, in which the optical image of circuit patterns is transformed into an electrical signal, the signal is converted into a binary digital signal, the connectivity relationship between selected two points of pattern in the form of binary signal is examined, connection data representative of the connectivity relationship and expressed by a pair of numbers given to the points is generated, and the connection data is compared with design data which is produced from design information and expressed in the form of a circulation list of numbers given to points in linkage relationship, whereby determination of defectiveness of patterns is made basing on the result of comparison.
摘要翻译：一种印刷电路图形检查系统，其中电路图案的光学图像被变换为电信号，该信号被转换为二进制数字信号，检查二进制信号形式的所选择的两个点之间的连接关系，连接数据表示连接关系，并且由给予点的一对数字表示，并将连接数据与从设计信息产生的设计数据进行比较，并以给定给点的数字的循环列表的形式表示在连接关系中，由此根据比较结果确定图案的缺陷。

10. 发明授权

US4575304A Robot system for recognizing three dimensional shapes 失效
标题翻译：用于识别三维形状的机器人系统
公开(公告)号：US4575304A
公开(公告)日：1986-03-11
申请号：US482730
申请日：1983-04-07
申请人： Yasuo Nakagawa , Takanori Ninomiya
发明人： Yasuo Nakagawa , Takanori Ninomiya
IPC分类号： B25J19/04 , B25J9/10 , B25J13/08 , B25J19/02 , G06K9/00 , G06K9/20 , G06T1/00 , B66C1/00
CPC分类号： B25J19/023 , B25J9/1015 , G06K9/00201 , G06K9/2036 , G06T1/0014
摘要： The present invention consists in a robot wherein a slit-light detector which is constructed of a light projector for projecting light so as to form a slit-light on an object to-be-handled and an image detector for detecting an image of the light-section waveform, is mounted on an operating member of the robot; means for scanning the slit-light detector is disposed; and the slit-light detector detects range data, on the basis of which a position, posture, inclination etc. of the object in a three-dimensional shape are detected, so that the robot can handle the object.
摘要翻译：本发明在于一种机器人，其中由用于投射光以在待处理物体上形成狭缝光的投光器构成的狭缝光检测器和用于检测光的图像的图像检测器分段波形安装在机器人的操作部件上; 布置扫描狭缝光检测器的装置; 并且狭缝光检测器检测范围数据，基于该范围数据检测到三维形状的物体的位置，姿势，倾斜度等，从而机器人可以处理物体。

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