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2. 发明授权

US06518660B2 Semiconductor package with ground projections 有权
标题翻译：具有地面投影的半导体封装
公开(公告)号：US06518660B2
公开(公告)日：2003-02-11
申请号：US10017801
申请日：2001-12-12
申请人： Heung Kyu Kwon , Tae Je Cho , Young Hoon Ro
发明人： Heung Kyu Kwon , Tae Je Cho , Young Hoon Ro
IPC分类号： H01L2312
CPC分类号： H01L23/49838 , H01L23/10 , H01L23/50 , H01L23/552 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/01079 , H01L2924/15312 , H01L2924/16152 , H01L2924/16251 , H01L2924/16315 , H01L2924/166 , H01L2924/00
摘要： A semiconductor package includes: a substrate having an upper surface and a lower surface; an integrated circuit chip having bond pads; a lid attached on the upper surface of the substrate so as to cover the chip; and one or more projections that electrically connect the lid to a plurality of ground patterns. The substrate has substrate pads formed on the upper surface, and one or more of the substrate pads extend to form the ground patterns. The chip is bonded on the upper surface of the substrate. One or more of the bond pads are ground bond pads, and the bond pads are electrically connected to the corresponding substrate pads. An electrically nonconductive adhesive is used for the attachment of the lid to the substrate, and the projections are connected to the ground patterns by an electrically conductive adhesive. The ground projections are positioned at four corners of a cavity that is formed between the substrate and the lid. The semiconductor package further includes: external connection terminals formed on the lower surface of the substrate and electrically connected to the corresponding substrate pads; and a thermal interface material is interposed between lid and the chip, the thermal interface material transmitting heat generated by the chip to the lid.
摘要翻译：半导体封装包括：具有上表面和下表面的衬底; 具有接合焊盘的集成电路芯片; 安装在所述基板的上表面上以覆盖所述芯片的盖; 以及将盖子电连接到多个接地图案的一个或多个突起。衬底具有形成在上表面上的衬底焊盘，并且一个或多个衬底焊盘延伸以形成接地图案。芯片结合在基板的上表面上。一个或多个接合焊盘是接地焊盘，并且接合焊盘电连接到相应的衬底焊盘。使用非导电粘合剂来将盖子附接到基板，并且突起通过导电粘合剂连接到接地图案。地面突起位于形成在基板和盖之间的空腔的四个角处。半导体封装还包括：外部连接端子，其形成在基板的下表面上并电连接到相应的基板焊盘; 并且热界面材料插入在盖和芯片之间，热界面材料将由芯片产生的热量传递到盖子。

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