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    • 2. 发明授权
    • Semi-aromatic polyamide and a method for preparation with low wastewater discharge
    • 半芳族聚酰胺和低排放废水的制备方法
    • US08420772B2
    • 2013-04-16
    • US12743452
    • 2008-07-11
    • Min CaoShiyong XiaXianbo HuangTongmin CaiXiangbin Zeng
    • Min CaoShiyong XiaXianbo HuangTongmin CaiXiangbin Zeng
    • C08G69/26
    • C08G69/26C08G69/265C08G69/28C08G69/30C08J11/02C08L77/06
    • The present invention relates to a semi-aromatic polyamide and a method for preparing it with low wastewater discharge. The semi-aromatic polyamide for the present invention is obtained by introducing aromatic dicarboxylic acid, aliphatic diamine containing 4˜14 carbon atoms and the wastewater generated during the previous prepolymerization into an autoclave for prepolymerization reaction and then further polymerizing the prepolymer. In this preparation method, the wastewater generated during polymerization is recycled, thus greatly reducing the wastewater discharge; the raw materials in the wastewater are effectively recycled, thus improving the utilization rate of raw materials; meanwhile, the diamine in the wastewater compensates that lost along with water discharge during prepolymerization, thus ensuring the Mole ratio balance between dicarboxylic acid monomer and diamine monomer.
    • 本发明涉及一种半芳族聚酰胺及其制备方法,废水排放量低。 本发明的半芳族聚酰胺通过将芳香族二羧酸,含有4〜14个碳原子的脂族二胺和前述预聚合中产生的废水引入高压釜中进行预聚合反应,然后进一步聚合预聚物而得到。 在这种制备方法中,聚合过程中产生的废水回收利用,大大减少了废水排放; 废水中的原料被有效回收,从而提高了原料的利用率; 同时,废水中的二胺补偿了预聚合过程中随着排水的流失,保证了二元羧酸单体与二胺单体之间的摩尔比平衡。
    • 5. 发明授权
    • Method and system for parallel processing of IC design layouts
    • IC设计布局并行处理方法与系统
    • US07657856B1
    • 2010-02-02
    • US11520487
    • 2006-09-12
    • Mathew KoshyRoland RuehlMin CaoLi-Ling MaEitan CadouriTianhao Zhang
    • Mathew KoshyRoland RuehlMin CaoLi-Ling MaEitan CadouriTianhao Zhang
    • G06F17/50
    • G06F17/5081
    • Disclosed is a method and system for processing the tasks performed by an IC layout processing tool in parallel. In some approaches, the IC layout is divided into a plurality of layout portions and one or more of the layout portions are processed in parallel, where geometric select operations are performed in which data for different layout portions may be shared between different processing entities. One approach includes the following actions: select phase one operation for performing initial select actions within layout portions; distributed regioning action for local regioning; distributed regioning action for global regioning and binary select; count select aggregation for count-based select operations; and select phase two operations for combining results of selecting of internal shapes and interface shapes.
    • 公开了一种用于并行处理由IC布局处理工具执行的任务的方法和系统。 在一些方法中,IC布局被划分为多个布局部分,并且一个或多个布局部分被并行处理,其中执行几何选择操作,其中用于不同布局部分的数据可以在不同处理实体之间共享。 一种方法包括以下操作:选择在布局部分内执行初始选择动作的第一阶段操作; 分布式区域划分行动; 全局分区和二进制选择的分布式分区动作; 对于基于计数的选择操作的计数选择聚合; 并选择第二阶段操作来组合内部形状和界面形状的选择结果。
    • 9. 发明授权
    • Self-aligned metal electrode structure for elevated sensors
    • 用于升高传感器的自对准金属电极结构
    • US06384460B1
    • 2002-05-07
    • US09326340
    • 1999-06-07
    • Jeremy A. TheilMin Cao
    • Jeremy A. TheilMin Cao
    • H01L310376
    • H01L27/14609H01L27/14603H01L27/14665
    • A self-aligned metal electrode sensor structure. The self-aligned metal electrode sensor structure includes a substrate which includes electronic circuitry. An interconnect structure is formed adjacent to the substrate. The interconnect structure includes conductive interconnect vias which pass through the interconnect structure. A sensor is formed adjacent to the interconnect structure. The sensor includes a pixel metallization section and a doped layer electrode. The pixel metallization section is electrically connected to the interconnect via. The pixel metallization section includes an outer surface which is substantially planar. The doped layer electrode includes an inner surface adjacent to the outer surface of the pixel metallization section. The entire inner surface of the doped layer electrode is substantially planar. A transparent conductive layer is formed adjacent to the sensor. The interconnect via and the transparent conductive layer electrically connect the electronic circuitry to the sensor. An embodiment includes the outer surface of the pixel metallization section having an outer surface area which is substantially equal to an inner surface area of the inner surface of the doped layer electrode. Another embodiment includes the outer surface of the pixel metallization section having an outer surface area which is less than an inner surface area of the inner surface of the doped layer electrode.
    • 自对准金属电极传感器结构。 自对准金属电极传感器结构包括包括电子电路的基板。 在衬底附近形成互连结构。 互连结构包括通过互连结构的导电互连通孔。 邻近互连结构形成传感器。 传感器包括像素金属化部分和掺杂层电极。 像素金属化部分电连接到互连通孔。 像素金属化部分包括基本上平面的外表面。 掺杂层电极包括与像素金属化部分的外表面相邻的内表面。 掺杂层电极的整个内表面基本上是平面的。 在传感器附近形成透明导电层。 互连通孔和透明导电层将电子电路电连接到传感器。 一个实施例包括像素金属化部分的外表面,其外表面积基本上等于掺杂层电极的内表面的内表面积。 另一个实施例包括像素金属化部分的外表面具有小于掺杂层电极的内表面的内表面积的外表面积。