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1. 再颁专利

USRE37179E1 Radiation sensitive resin composition 有权
标题翻译：辐射敏感树脂组合物
公开(公告)号：USRE37179E1
公开(公告)日：2001-05-15
申请号：US09420604
申请日：1999-10-21
申请人： Mikio Yamachika , Eiichi Kobayashi , Akira Tsuji , Toshiyuki Ota
发明人： Mikio Yamachika , Eiichi Kobayashi , Akira Tsuji , Toshiyuki Ota
IPC分类号： G03F7023
CPC分类号： G03F7/0045 , G03F7/039 , Y10S430/106 , Y10S430/11 , Y10S430/111
摘要： A radiation sensitive resin composition which comprises (A) a polymer which becomes alkali-soluble in the presence of an acid and (B) a radiation sensitive acid generator which generates an acid upon irradiation with a radiation, said polymer (A) comprising two recurring units represented by the general formulas (1) and (2) and a recurring unit which acts to reduce the solubility of the polymer is an alkali developer after the irradiation: wherein R1 represents a hydrogen atom or a methyl group and R2 represents a hydrogen atom or a methyl group. Said composition provides a chemically amplified positive resist which can give a fine pattern with a good pattern shape, and said resist is freed from volume shrinkage, peeling failure and adhesive failure, is excellent in dry etching resistance and effectively reacts with various radiations to give a good pattern shape which is excellent in photolithographic process stability, said pattern shape having no thinned portion at the upper part.
摘要翻译：一种辐射敏感性树脂组合物，其包含（A）在酸存在下变为碱溶性的聚合物和（B）辐射敏感的酸产生剂，其在辐射时产生酸，所述聚合物（A）包含两个重复由通式（1）和（2）表示的单元和降低聚合物溶解度的重复单元是照射后的碱显影剂：其中R1表示氢原子或甲基，R2表示氢原子或甲基。所述组合物提供化学放大的正性抗蚀剂，其可以产生具有良好图案形状的精细图案，并且所述抗蚀剂没有体积收缩，剥离破坏和粘合剂破坏，具有优异的耐干蚀刻性，并且与各种辐射有效反应以产生良好的图案形状，其光刻工艺稳定性优异，所述图案形状在上部没有变薄部分。

2. 发明授权

US5556734A Radiation sensitive resin composition comprising copolymer of isopropenylphenol and T-butyl(meth)acrylate 失效
标题翻译：包含异丙烯基苯酚与（甲基）丙烯酸叔丁酯的共聚物的辐射敏感性树脂组合物
公开(公告)号：US5556734A
公开(公告)日：1996-09-17
申请号：US363269
申请日：1994-12-23
申请人： Mikio Yamachika , Eiichi Kobayashi , Toshiyuki Ota , Akira Tsuji
发明人： Mikio Yamachika , Eiichi Kobayashi , Toshiyuki Ota , Akira Tsuji
IPC分类号： G03F7/004 , G03F7/039 , H01L21/027 , G03C1/73
CPC分类号： G03F7/039 , G03F7/0045 , Y10S430/111 , Y10S430/122
摘要： A radiation sensitive resin composition which comprises (A) a copolymer represented by the following general formula and (B) a radiation sensitive acid generator and, if necessary, (C) an alkali-soluble resin: ##STR1## wherein R represents a hydrogen atom or a methyl group and m and n are integers representing the numbers of the respective recurring units and satisfying the relations 0.1.gtoreq.m/(m+n)
摘要翻译：一种辐射敏感性树脂组合物，其包含（A）由以下通式表示的共聚物和（B）辐射敏感性酸产生剂，如果需要，其包含（C）碱溶性树脂：其中R表示氢原子或甲基，m和n是表示各个重复单元的数目的整数，并且满足关系式0.1> / = m /（m + n）<0.6和0.4

3. 发明授权

US5679495A Radiation sensitive resin composition 失效
标题翻译：辐射敏感树脂组合物
公开(公告)号：US5679495A
公开(公告)日：1997-10-21
申请号：US352848
申请日：1994-12-02
申请人： Mikio Yamachika , Eiichi Kobayashi , Toshiyuki Ota , Akira Tsuji
发明人： Mikio Yamachika , Eiichi Kobayashi , Toshiyuki Ota , Akira Tsuji
IPC分类号： G03F7/004 , G03F7/028 , G03F7/039 , H01L21/027 , G03F7/023
CPC分类号： G03F7/0045 , G03F7/039 , Y10S430/106 , Y10S430/11 , Y10S430/111
摘要： A radiation sensitive resin composition which comprises (A) a polymer which becomes alkali-soluble in the presence of an acid and (B) a radiation sensitive acid generator which generates an acid upon irradiation with a radiation, said polymer (A) comprising two recurring units represented by the general formulas (1) and (2) and a recurring unit which acts to reduce the solubility of the polymer in an alkali developer after the irradiation: ##STR1## wherein R.sup.1 represents a hydrogen atom or a methyl group and R.sup.2 represents a hydrogen atom or a methyl group. Said composition provides a chemically amplified positive resist which can give a fine pattern with a good pattern shape, and said resist is freed from volume shrinkage, peeling failure and adhesive failure, is excellent in dry etching resistance and effectively reacts with various radiations to give a good pattern shape which is excellent in photolithographic process stability, said pattern shape having no thinned portion at the upper part.
摘要翻译：一种辐射敏感性树脂组合物，其包含（A）在酸存在下变为碱溶性的聚合物和（B）辐射敏感的酸产生剂，其在辐射时产生酸，所述聚合物（A）包含两个重复由通式（1）和（2）表示的单元和反应单元，其用于降低聚合物在照射后的碱显影剂中的溶解度：其中R1表示氢原子或甲基，R 2表示氢原子或甲基。所述组合物提供化学放大的正性抗蚀剂，其可以产生具有良好图案形状的精细图案，并且所述抗蚀剂没有体积收缩，剥离破坏和粘合剂破坏，具有优异的耐干蚀刻性，并且与各种辐射有效反应以产生良好的图案形状，其光刻工艺稳定性优异，所述图案形状在上部没有变薄部分。

4. 发明授权

US5629135A Chemically amplified resist composition 失效
标题翻译：化学扩增抗蚀剂组合物
公开(公告)号：US5629135A
公开(公告)日：1997-05-13
申请号：US590677
申请日：1996-01-29
申请人： Eiichi Kobayashi , Makoto Murata , Toshiyuki Ota , Akira Tsuji
发明人： Eiichi Kobayashi , Makoto Murata , Toshiyuki Ota , Akira Tsuji
IPC分类号： G03F7/004 , G03F7/039
CPC分类号： G03F7/039 , G03F7/0048 , G03F7/0045 , Y10S430/106 , Y10S430/111
摘要： Positive-tone and negative-tone chemically amplified resist compositions comprising: (a-1) a blocked resin, (a-2) a combination of an alkali-soluble resin and a dissolution controlling agents, or (a-3) a combination of an alkali-soluble resin and a crosslinking agent, (b) a photoacid generator, and (c) specific kinds of solvents. The both positive-tone and negative-tone resist compositions exhibits superior sensitivity, high resolution capability, and excellent storage stability, and can be excellently applied especially to large sized substrates by spincoating for producing excellently shaped patterns by irradiation. The compositions can be used with advantage as a chemically amplified resist for the manufacture of semiconductor devices or integrated circuits (ICs).
摘要翻译：正色调和负色度化学放大抗蚀剂组合物，其包含：（a-1）封端树脂，（a-2）碱溶性树脂和溶解控制剂的组合，或（a-3）碱溶性树脂和交联剂，（b）光致酸发生剂，和（c）特定种类的溶剂。正色调和负色调抗蚀剂组合物显示出优异的灵敏度，高分辨能力和优异的储存稳定性，并且可以通过旋涂来优异地应用于大尺寸基材，以通过照射制造出优异的图案。组合物可以有利地用作制造半导体器件或集成电路（IC）的化学放大抗蚀剂。

5. 发明授权

US6114086A Chemically amplified resist composition 有权
标题翻译：化学放大抗蚀剂组合物
公开(公告)号：US6114086A
公开(公告)日：2000-09-05
申请号：US288848
申请日：1999-04-09
申请人： Eiichi Kobayashi , Makoto Murata , Toshiyuki Ota , Akira Tsuji
发明人： Eiichi Kobayashi , Makoto Murata , Toshiyuki Ota , Akira Tsuji
IPC分类号： G03F7/004 , G03F7/039
CPC分类号： G03F7/039 , G03F7/0048 , G03F7/0045 , Y10S430/106 , Y10S430/111
摘要： Positive-tone and negative-tone chemically amplified resist compositions comprising: (a-1) a blocked resin, (a-2) a combination of an alkali-soluble resin and a dissolution controlling agents, or (a-3) a combination of an alkali-soluble resin and a crosslinking agent, (b) a photoacid generator, and (c) specific kinds of solvents. The both positive-tone and negative-tone resist compositions exhibits superior sensitivity, high resolution capability, and excellent storage stability, and can be excellently applied especially to large sized substrates by spincoating for producing excellently shaped patterns by irradiation. The compositions can be used with advantage as a chemically amplified resist for the manufacture of semiconductor devices or integrated circuits (ICs).
摘要翻译：正色调和负色度化学放大抗蚀剂组合物，其包含：（a-1）封端树脂，（a-2）碱溶性树脂和溶解控制剂的组合，或（a-3）碱溶性树脂和交联剂，（b）光致酸发生剂，和（c）特定种类的溶剂。正色调和负色调抗蚀剂组合物显示出优异的灵敏度，高分辨能力和优异的储存稳定性，并且可以通过旋涂来优异地应用于大尺寸基材，以通过照射制造出优异的图案。组合物可以有利地用作制造半导体器件或集成电路（IC）的化学放大抗蚀剂。

6. 发明授权

US5916729A Chemically amplified resist composition 失效
公开(公告)号：US5916729A
公开(公告)日：1999-06-29
申请号：US799566
申请日：1997-02-12
申请人： Eiichi Kobayashi , Makoto Murata , Toshiyuki Ota , Akira Tsuji
发明人： Eiichi Kobayashi , Makoto Murata , Toshiyuki Ota , Akira Tsuji
IPC分类号： G03F7/004 , G03F7/039 , G03F7/016 , G03C1/54
CPC分类号： G03F7/039 , G03F7/0048 , G03F7/0045 , Y10S430/106 , Y10S430/111
摘要： Positive-tone and negative-tone chemically amplified resist compositions comprising: (a-1) a blocked resin, (a-2) a combination of an alkali-soluble resin and a dissolution controlling agents, or (a-3) a combination of an alkali-soluble resin and a crosslinking agent, (b) a photoacid generator, and (c) specific kinds of solvents. The both positive-tone and negative-tone resist compositions exhibits superior sensitivity, high resolution capability, and excellent storage stability, and can be excellently applied especially to large sized substrates by spincoating for producing excellently shaped patterns by irradiation. The compositions can be used with advantage as a chemically amplified resist for the manufacture of semiconductor devices or integrated circuits (ICs).

7. 发明授权

US06506537B2 Radiation-sensitive resin composition 有权
标题翻译：辐射敏感树脂组合物
公开(公告)号：US06506537B2
公开(公告)日：2003-01-14
申请号：US09878274
申请日：2001-06-12
申请人： Eiichi Kobayashi , Jun Numata , Mikio Yamachika , Masafumi Yamamoto
发明人： Eiichi Kobayashi , Jun Numata , Mikio Yamachika , Masafumi Yamamoto
IPC分类号： G03F7004
CPC分类号： G03F7/0758 , G03F7/0045 , G03F7/039 , Y10S430/106 , Y10S430/111
摘要： A positive-type radiation-sensitive resin composition is provided. The composition includes: (A) a low-molecular compound comprising a compound having at least one amino group having one or two hydrogen atom(s) bonded to the nitrogen atom; at least one hydrogen atom the amino group has having been substituted with a t-butoxycarbonyl group; (B) a radiation-sensitive acid generator; and (C) a silicon-atom-containing resin comprising an alkali-insoluble or alkali-slightly-soluble resin having been protected with an acid-cleavable group; the resin being capable of turning soluble in alkali upon cleavage of the acid-cleavable group. This radiation-sensitive resin composition is effectively responsive to radiations of various types, has superior sensitivity and resolution and also a superior long-term storage stability, and is useful as a positive-type chemically amplified resist.
摘要翻译：提供正型辐射敏感性树脂组合物。该组合物包括：（A）包含具有至少一个具有与氮原子键合的一个或两个氢原子的氨基的化合物的低分子化合物; 至少一个氢原子已经被叔丁氧基羰基取代;（B）辐射敏感性酸产生剂; 和（C）含有硅原子的树脂，其包含用酸可裂解基团保护的碱不溶性或碱 - 微溶性树脂; 该树脂在切割酸可分解基团时能够转变为碱溶性。该辐射敏感性树脂组合物对各种辐射有效响应，具有优异的灵敏度和分辨率，并且还具有优异的长期储存稳定性，并且可用作正型化学放大抗蚀剂。

8. 发明授权

US5580695A Chemically amplified resist 失效
标题翻译：化学放大抗蚀剂
公开(公告)号：US5580695A
公开(公告)日：1996-12-03
申请号：US339289
申请日：1994-11-10
申请人： Makoto Murata , Takao Miura , Yoshiji Yumoto , Toshiyuki Ota , Eiichi Kobayashi
发明人： Makoto Murata , Takao Miura , Yoshiji Yumoto , Toshiyuki Ota , Eiichi Kobayashi
IPC分类号： G03F7/004 , G03C1/73 , G03F7/038
CPC分类号： G03F7/0045 , Y10S430/118 , Y10S430/121
摘要： A chemically amplified resist comprising an alkali-soluble resin or a resin having at least one acid-dissociable group which is alkali-insoluble or -sprairingly soluble but becomes alkali-soluble upon dissociation of said acid dissociable group due to an acid; a radiation-sensitive, acid-generating agent; and an optional component in which resist, the radiation-sensitive, acid-generating agent generates an acid upon irradiation with a radiation in the irradiated portion and the solubility of the resin component and optional component in a developing solution is varied in the irradiated portion by a chemical reaction caused by the catalytic action of the acid, whereby a pattern is formed, characterized in that a compound having a nitrogen-containing basic group is contained in the resist. Said resist is superior in developability, pattern form, resolution, focus tolerance and yield of residual film thickness, has good process stability, and can be suitably used even in irradiation with, in particular, a radiation having a wavelength equal to or smaller than far ultraviolet rays, for example, an excimer laser or the like.
摘要翻译：一种化学放大抗蚀剂，其包含碱溶性树脂或具有至少一种酸解离基团的树脂，所述酸解离基团是由于酸而导致的所述酸解离基团的解离时为碱不溶性或易溶性但是变得碱溶性的; 辐射敏感的酸产生剂; 以及任选的组分，其中抗辐射敏感的酸产生剂在照射部分中的辐射照射时产生酸，并且树脂组分和任选组分在显影溶液中的溶解度在照射部分中变化由酸的催化作用引起的化学反应，由此形成图案，其特征在于在抗蚀剂中含有具有含氮碱性基团的化合物。所述抗蚀剂的显影性，图案形式，分辨率，聚焦容限和残留膜厚度的产率优异，具有良好的工艺稳定性，并且可以适用于特别是具有等于或小于远的波长的辐射紫外线，例如准分子激光等。

9. 发明授权

US5376498A Negative type radiation-sensitive resin composition 失效
标题翻译：负型辐射敏感树脂组合物
公开(公告)号：US5376498A
公开(公告)日：1994-12-27
申请号：US975713
申请日：1992-11-13
申请人： Toru Kajita , Eiichi Kobayashi , Toshiyuki Ota , Takao Miura
发明人： Toru Kajita , Eiichi Kobayashi , Toshiyuki Ota , Takao Miura
IPC分类号： C07C37/16 , G03F7/004 , G03F7/022 , G03F7/029 , G03F7/038 , G03F7/075 , H01L21/027 , G03C1/52
CPC分类号： G03F7/0755 , C07C37/16 , C07C37/20 , G03F7/0045 , G03F7/0226 , G03F7/038
摘要： A negative type radiation-sensitive resin composition which comprises (A) an alkali-soluble resin, (B) a compound which generates an acid upon irradiation, and (C) an aromatic compound having, as functional groups, an --OR group and a --CH.sub.2 OX group, both directly bonded to the aromatic ring in which R represents a substituted methyl group, a substituted ethyl group, a silyl group, an alkoxycarbonyl group or an acyl group and in which X represents a hydrogen atom, an alkyl group having 1-5 carbon atoms or an R group which is as defined above, said aromatic compound being capable of cross-linking the alkali-soluble resin (A) in the presence of an acid, and optionally (D) a specific phenolic compound. The negative type radiation-sensitive resin composition is excellent in developability, pattern-formation, resolution and thermal durability.
摘要翻译：一种负型辐射敏感性树脂组合物，其包含（A）碱溶性树脂，（B）照射时产生酸的化合物和（C）具有作为官能团的-OR基团和 -CH 2 X基团，其直接键合到其中R表示取代的甲基，取代的乙基，甲硅烷基，烷氧基羰基或酰基的芳环，其中X表示氢原子，具有1个 -5个碳原子或如上所定义的R基团，所述芳香族化合物能够在酸的存在下交联碱溶性树脂（A），和任选地（D）特定的酚类化合物。负型辐射敏感性树脂组合物的显影性，图案形成，分辨率和热耐久性优异。

10. 发明授权

US08604992B2 Magnetic material antenna and antenna device 有权
标题翻译：磁性材料天线和天线装置
公开(公告)号：US08604992B2
公开(公告)日：2013-12-10
申请号：US12816100
申请日：2010-06-15
申请人： Eiichi Kobayashi , Takuma Sawaya , Hiroyuki Kubo
发明人： Eiichi Kobayashi , Takuma Sawaya , Hiroyuki Kubo
IPC分类号： H01Q7/08 , H01Q7/06
CPC分类号： H01Q7/06 , G06K7/10316 , G06K7/10336 , H01Q1/2225
摘要： A spiral coil conductor defining its winding central section as a conductor opening section is formed on a flexible substrate. The flexible substrate has a U shaped bend along a line passing through the conductor opening section so as to envelop a magnetic material core. The magnetic material core is arranged in a state where its end face faces the bend of the flexible substrate, and the magnetic material core includes cut shapes provided at a portion of the end face. The portion at the end face faces coil conductor sections at the bend of the flexible substrate, and the cut shapes separate the portion apart from the coil conductor sections.
摘要翻译：在柔性基板上形成将其卷绕中心部分定义为导体开口部分的螺旋线圈导体。柔性基板沿着穿过导体开口部分的线具有U形弯曲部，以包围磁性材料芯。磁性材料芯以其端面朝向柔性基板的弯曲部的状态配置，磁性材料芯包括设置在端面的一部分的切割形状。端面处的部分面对在柔性基板的弯曲部处的线圈导体部分，并且切割形状将与线圈导体部分分开的部分分开。

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