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    • 5. 发明授权
    • Acceleration measuring apparatus
    • 加速度测量仪
    • US08919201B2
    • 2014-12-30
    • US13489421
    • 2012-06-05
    • Mitsuaki KoyamaTakeru MutohHiroki IwaiRyoichi Ichikawa
    • Mitsuaki KoyamaTakeru MutohHiroki IwaiRyoichi Ichikawa
    • G01P15/125G01P15/09G01P15/097G01P15/08
    • G01P15/125G01P15/097G01P2015/0817
    • An acceleration measuring apparatus that can easily detect acceleration with high accuracy is provided. In the apparatus, positional displacement of a swingable pendulum member is detected, feedback control is performed to maintain the pendulum member in a stationary state using an actuator, and acceleration is measured by measuring the output of the actuator at this time. A movable electrode is provided to the pendulum member, and a loop is formed in which a fixed electrode provided to oppose the movable electrode, and an oscillating circuit, a crystal unit, and the movable electrode are electrically connected in series. By measuring an oscillating frequency of the oscillating circuit at this time, a change in the size of a variable capacitance formed between the movable electrode and the fixed electrode is detected, and thereby the positional displacement of the pendulum member is detected.
    • 提供了能够以高精度容易地检测加速度的加速度测量装置。 在该装置中,检测出可摆动摆动构件的位置偏移,使用致动器进行反馈控制,使摆锤构件保持在静止状态,此时通过测量致动器的输出来测量加速度。 可动电极设置在摆动部件上,形成有与可动电极相对设置的固定电极以及振荡电路,晶体单元和可动电极串联电连接的环。 此时,通过测量振荡电路的振荡频率,检测出在可动电极和固定电极之间形成的可变电容的尺寸变化,从而检测摆锤构件的位置偏移。
    • 6. 发明授权
    • Piezoelectric vibrating devices including respective packages in which castellations include respective connecting electrodes
    • 压电振动装置,其包括相应的封装,其中cast ations包括相应的连接电极
    • US08823247B2
    • 2014-09-02
    • US13212030
    • 2011-08-17
    • Ryoichi IchikawaYoshiaki Amano
    • Ryoichi IchikawaYoshiaki Amano
    • H01L41/08H03H3/02H03H9/10
    • H03H9/1014H03H3/02Y10T29/42
    • Piezoelectric vibrating devices are disclosed that lack base through-holes and that can be manufactured on a wafer scale. Also disclosed are methods for making same. An exemplary piezoelectric device has a package base having first and second opposing main surfaces. On the second (outer) first main surface is formed a pair of external electrodes. The first (inner) main surface defines a first recess and a peripheral first bonding surface. A pair of connecting electrodes are provided for connecting to the respective external electrodes via respective edge surfaces of the package base that extend between the first and second main surfaces. A piezoelectric vibrating piece is mounted in and contained within the package base. The vibrating piece includes a pair of excitation electrodes electrically connected to respective connecting electrodes. A package lid comprises first and second main surfaces, of which the second (inner) main surface defines a second recess that is larger than the first recess. The second main surface also defines a second bonding surface that peripherally surrounds the second recess. A sealing material is applied, over the width of the second bonding surface, circumferentially between the first bonding surface and the second bonding surface.
    • 公开了压电振动装置,其缺少基底通孔并且可以在晶片上制造。 还公开了制备其的方法。 示例性的压电装置具有具有第一和第二相对主表面的封装基座。 在第二(外)第一主表面上形成一对外部电极。 第一(内)主表面限定第一凹部和周边第一粘合表面。 提供一对连接电极,用于经由在第一和第二主表面之间延伸的封装基座的相应边缘表面连接到各个外部电极。 压电振动片安装在包装底座内并包含在包装基座内。 振动片包括电连接到各个连接电极的一对激励电极。 包装盖包括第一和第二主表面,其中第二(内)主表面限定大于第一凹部的第二凹部。 第二主表面还限定了外围围绕第二凹部的第二粘合表面。 在第一接合表面和第二接合表面之间周向地施加密封材料,在第二接合表面的宽度上。
    • 7. 发明授权
    • Piezoelectric devices and methods for manufacturing same
    • 压电器件及其制造方法
    • US08382995B2
    • 2013-02-26
    • US12831142
    • 2010-07-06
    • Ryoichi IchikawaMitoshi Umeki
    • Ryoichi IchikawaMitoshi Umeki
    • C23F1/00
    • H03H9/1035H03H9/0595Y10T29/42
    • Methods are disclosed for manufacturing piezoelectric devices. In an exemplary method a base substrate is prepared that defines multiple device bases. Multiple cutting grooves are defined on a surface of the base substrate in a grid pattern to define therebetween the size of the devices. A frame substrate is also prepared from a piezoelectric material. The frame substrate defines multiple frames surrounding respective vibrating pieces and being alignable with respective bases in the base substrate. Also prepared is a lid substrate defining multiple lids being alignable with respective frames and bases. The three substrates are aligned and bonded together such that the frame substrate is between the lid and base substrates and the surface defining the cutting grooves faces outward. The base substrate is mounted on a dicing sheet such that cutting grooves face the dicing sheet. Cutting is performed, using a dicing blade, through the sandwich from the lid substrate to the cutting grooves.
    • 公开了用于制造压电装置的方法。 在示例性方法中,制备定义多个器件基底的基底衬底。 在基底基板的表面上以网格图案限定多个切割凹槽,以在其间限定装置的尺寸。 框架基板也由压电材料制成。 框架基板限定围绕相应振动片的多个框架,并且可与底座基板中的各个基座对准。 还准备了盖子基板,其限定与各个框架和基座对准的多个盖子。 三个基板被对准并结合在一起,使得框架基板在盖和基底之间,并且限定切割槽的表面面向外。 基底基板安装在切割片上,使得切割凹槽面对切割片。 使用切割刀片通过从盖基板到切割槽的夹层进行切割。
    • 9. 发明申请
    • SURFACE-MOUNTABLE PIEZOELECTRIC DEVICES INCLUDING EUTECTIC-BONDED PACKAGES
    • 包括保护性粘合包装的表面安装压电装置
    • US20110260585A1
    • 2011-10-27
    • US13092871
    • 2011-04-22
    • Ryoichi IchikawaShuichi Mizusawa
    • Ryoichi IchikawaShuichi Mizusawa
    • H01L41/053
    • H03H9/1035H03H9/0519
    • Piezoelectric devices are disclosed that are mountable on the surface of a printed circuit board or the like. An exemplary device comprises a piezoelectric vibrating piece enclosed and sealed within a package including at least a cover and a base-substrate formed of glass or piezoelectric material. The package includes frame-shaped metallic films formed in peripheral regions of inner main surfaces of the cover and/or the base substrate. The frame-shaped metallic films are used for sealing the package using a eutectic material (e.g., solder). At least one mounting terminal is provided on the outer (bottom) main surface of the base-substrate. At least one of the frame-shaped metallic films and mounting terminals includes a chromium foundation layer formed on the surface of the glass or piezoelectric material, a middle layer of NiW alloy formed on the surface of the chromium layer, and a gold layer formed on the surface of the middle layer.
    • 公开了可安装在印刷电路板等的表面上的压电器件。 示例性装置包括封装并密封在包括至少由玻璃或压电材料形成的盖和基底基板的封装内的压电振动片。 该封装包括形成在盖和/或基底基板的内主表面的周边区域中的框状金属膜。 框状金属膜用于使用共晶材料(例如焊料)密封封装。 至少一个安装端子设置在基底基板的外(底)主表面上。 框状金属膜和安装端子中的至少一个包括形成在玻璃或压电材料的表面上的铬基底层,形成在铬层的表面上的NiW合金的中间层和形成在铬层上的金层 中间层的表面。
    • 10. 发明申请
    • PIEZOELECTRIC VIBRATING DEVICES AND METHODS FOR MANUFACTURING SAME
    • 压电振动装置及其制造方法
    • US20110068659A1
    • 2011-03-24
    • US12888656
    • 2010-09-23
    • Ryoichi Ichikawa
    • Ryoichi Ichikawa
    • H01L41/053H01L41/22
    • H03H9/21H01L2224/97H01L2924/16152H03H3/02H03H9/1021H03H2003/026Y10T29/42
    • Methods are disclosed for manufacturing piezoelectric vibrating devices. An exemplary method includes preparing a base wafer defining multiple bases each including stripes of a first bonding film extending along respective edges of the bases and first indents adjacent to and contacting respective stripes of the first bonding film. Also prepared is a lid wafer defining multiple lids each including stripes of a second bonding film extending along respective edges of the lids and second indents adjacent to and contacting respective stripes of the second bonding film. A unit of bonding material (e.g., a bonding “ball”) is applied to each of the first indents or to each of the second indents. Bonding together the base wafer and lid wafer is completed by melting the bonding material to flow the bonding material along the stripes, followed by solidifying the bonding material.
    • 公开了用于制造压电振动装置的方法。 一种示例性方法包括制备限定多个基底的基底晶片,每个基底包括沿着基底的相应边缘延伸的第一接合膜的条带和与第一接合膜的相应条纹相邻并接触的第一印痕。 还制备了限定多个盖子的盖子晶片,每个盖子包括沿着盖子的相应边缘延伸的第二粘结膜的条带,以及与第二接合膜的相应条纹相邻并接触的第二印痕。 将粘合材料单元(例如,粘合“球”)施加到每个第一缩进或每个第二缩进。 通过熔化粘合材料使基底晶片和盖晶片粘合在一起,使结合材料沿着条纹流动,随后固化接合材料。