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1. 发明授权

US08966980B2 External force detecting device and external force detecting sensor 有权
标题翻译：外力检测装置和外力检测传感器
公开(公告)号：US08966980B2
公开(公告)日：2015-03-03
申请号：US13374769
申请日：2012-01-11
申请人： Mitsuaki Koyama , Takeru Mutoh , Hiroki Iwai , Yoshiaki Amano , Ryoichi Ichikawa
发明人： Mitsuaki Koyama , Takeru Mutoh , Hiroki Iwai , Yoshiaki Amano , Ryoichi Ichikawa
IPC分类号： G01H13/00 , G01P15/097 , G01P1/02 , G01P15/125 , G01L1/14 , G01L1/16 , G01P15/08
CPC分类号： G01P15/097 , G01L1/142 , G01L1/162 , G01P1/023 , G01P15/125 , G01P2015/0828 , G01P2015/0871
摘要： A device is provided for a detecting external force applied to piezoelectric piece. A crystal piece is cantilever-supported in a container. Excitation electrodes are formed on an upper face and lower face, respectively. A movable electrode, connected via a lead-out electrode to the excitation electrode, is formed on the lower face side at a front end of the crystal piece. A fixed electrode is provided on a bottom portion of the container to face this movable electrode. The excitation electrode on the upper face side and the fixed electrode are connected to an oscillation circuit. When the crystal piece bends in response to an applied external force, capacitance between the movable electrode and fixed electrode, changes. This capacitance change results in a corresponding change in oscillation frequency of the crystal piece.
摘要翻译：提供了用于检测施加到压电片的外力的装置。水晶片悬臂支撑在容器中。激励电极分别形成在上表面和下表面上。通过引出电极连接到激励电极的可动电极形成在晶片的前端的下表面侧。固定电极设置在容器的底部上以面对该可动电极。上侧激励电极和固定电极连接到振荡电路。当晶体片响应于施加的外力弯曲时，可动电极和固定电极之间的电容发生变化。该电容变化导致晶片的振荡频率的相应变化。

2. 发明授权

US08823247B2 Piezoelectric vibrating devices including respective packages in which castellations include respective connecting electrodes 有权
标题翻译：压电振动装置，其包括相应的封装，其中cast ations包括相应的连接电极
公开(公告)号：US08823247B2
公开(公告)日：2014-09-02
申请号：US13212030
申请日：2011-08-17
申请人： Ryoichi Ichikawa , Yoshiaki Amano
发明人： Ryoichi Ichikawa , Yoshiaki Amano
IPC分类号： H01L41/08 , H03H3/02 , H03H9/10
CPC分类号： H03H9/1014 , H03H3/02 , Y10T29/42
摘要： Piezoelectric vibrating devices are disclosed that lack base through-holes and that can be manufactured on a wafer scale. Also disclosed are methods for making same. An exemplary piezoelectric device has a package base having first and second opposing main surfaces. On the second (outer) first main surface is formed a pair of external electrodes. The first (inner) main surface defines a first recess and a peripheral first bonding surface. A pair of connecting electrodes are provided for connecting to the respective external electrodes via respective edge surfaces of the package base that extend between the first and second main surfaces. A piezoelectric vibrating piece is mounted in and contained within the package base. The vibrating piece includes a pair of excitation electrodes electrically connected to respective connecting electrodes. A package lid comprises first and second main surfaces, of which the second (inner) main surface defines a second recess that is larger than the first recess. The second main surface also defines a second bonding surface that peripherally surrounds the second recess. A sealing material is applied, over the width of the second bonding surface, circumferentially between the first bonding surface and the second bonding surface.
摘要翻译：公开了压电振动装置，其缺少基底通孔并且可以在晶片上制造。还公开了制备其的方法。示例性的压电装置具有具有第一和第二相对主表面的封装基座。在第二（外）第一主表面上形成一对外部电极。第一（内）主表面限定第一凹部和周边第一粘合表面。提供一对连接电极，用于经由在第一和第二主表面之间延伸的封装基座的相应边缘表面连接到各个外部电极。压电振动片安装在包装底座内并包含在包装基座内。振动片包括电连接到各个连接电极的一对激励电极。包装盖包括第一和第二主表面，其中第二（内）主表面限定大于第一凹部的第二凹部。第二主表面还限定了外围围绕第二凹部的第二粘合表面。在第一接合表面和第二接合表面之间周向地施加密封材料，在第二接合表面的宽度上。

3. 发明申请

US20120306320A1 PIEZOELECTRIC DEVICE AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：压电器件及其制造方法
公开(公告)号：US20120306320A1
公开(公告)日：2012-12-06
申请号：US13485922
申请日：2012-06-01
申请人： Ryoichi Ichikawa , Yoshiaki Amano
发明人： Ryoichi Ichikawa , Yoshiaki Amano
IPC分类号： H01L41/053 , B32B37/12
CPC分类号： H03H9/0595 , H01L2224/16225 , H03H9/1021 , H03H9/1035
摘要： The present disclosure provides the piezoelectric devices in which the bonding condition of devices can be easily observed. The piezoelectric device (100) comprises: a piezoelectric vibrating piece that vibrates when electrically energized; a first plate (110) and a second plate (120) fabricated by transparent materials; and a sealing material (150a) formed in between the first plate and second plate and in periphery of the first plate and second plate, the sealing material having a slit (151b) within the predetermined width (WX, WZ) of the sealing material.
摘要翻译：本公开提供了其中可以容易地观察到器件的接合条件的压电器件。压电装置（100）包括：压电振动片，其在通电时振动; 由透明材料制成的第一板（110）和第二板（120）以及形成在所述第一板和第二板之间以及所述第一板和第二板的周围的密封材料（150a），所述密封材料在所述密封材料的预定宽度（WX，WZ）内具有狭缝（151b）。

4. 发明授权

US08618721B2 Method of manufacturing the piezoelectric device and the same 失效
标题翻译：压电装置的制造方法及其制造方法
公开(公告)号：US08618721B2
公开(公告)日：2013-12-31
申请号：US13208799
申请日：2011-08-12
申请人： Ryoichi Ichikawa , Yoshiaki Amano , Kenji Kamezawa
发明人： Ryoichi Ichikawa , Yoshiaki Amano , Kenji Kamezawa
IPC分类号： H01L41/08
CPC分类号： H03H3/02 , H01L2924/16152 , H03H9/1021 , H03H9/21 , H03H2003/026
摘要： To provide a piezoelectric device prevented from overflowing of sealing materials. The piezoelectric device (100) stores a piezoelectric vibrating piece (30) having a pair of excitation electrodes. The piezoelectric device comprises: a package lid (10), including a first bonding surface (M1) formed in periphery of the package lid in a circumferential pattern and a lid recess (10); a package base (30), including a second bonding surface (M2), a base recess surrounded by a second bonding surface that is higher than the second bonding surface, and a pair of seats that is protruding from the base recess, situated for mounting the piezoelectric piece; a piezoelectric piece mounted onto the pair of seats; and a non electric conductive sealing material (48) disposed peripherally in relative to the first bonding surface and the second bonding surface in a circumferential pattern, thus the adhesive bonding the first bonding surface and the second bonding surface. Furthermore, height of the second bonding surface and the pair of seats are same height.
摘要翻译：提供一种防止密封材料溢出的压电装置。压电装置（100）存储具有一对激励电极的压电振动片（30）。压电装置包括：包装盖（10），包括以周向图案形成在包装盖的周边的第一接合表面（M1）和盖凹部（10）; 包括第二接合面（M2）的封装基座（30），由比第二接合面高的第二接合面包围的基座凹部以及从基座凹部突出的一对座，压电片; 安装在所述一对座椅上的压电片; 和非导电性密封材料（48），其以圆周方式相对于所述第一接合面和所述第二接合面周边配置，由此所述粘合剂将所述第一接合面和所述第二接合面接合。此外，第二接合面和一对座的高度相同。

5. 发明申请

US20120068579A1 Method for Manufacturing a Piezoelectric Device and the Same 审中-公开
标题翻译：制造压电元件及其制造方法
公开(公告)号：US20120068579A1
公开(公告)日：2012-03-22
申请号：US13238770
申请日：2011-09-21
申请人： Ryoichi Ichikawa , Yoshiaki Amano , Kenji Kamezawa
发明人： Ryoichi Ichikawa , Yoshiaki Amano , Kenji Kamezawa
IPC分类号： H01L41/04 , H01L41/22
CPC分类号： H03H9/02086 , H01L2224/97 , H03H3/02 , H03H9/1014 , Y10T29/42
摘要： The present disclosure provides a method for manufacturing piezoelectric devices by using a base wafer having through-holes manufactured in precise size. In the method for manufacturing a piezoelectric device comprises: a step of: forming an anticorrosive film (S121) on a first surface and on a second surface opposing the first surface of the base wafer made of a glass or a piezoelectric material; after forming a photoresist on the anticorrosive film and exposing, metal-etching the anticorrosive film (S121, S122) corresponding to the through-hole; after the metal-etching step, applying an etching solution onto the glass or the piezoelectric material and wet-etching (S123) the first surface and the second surface of the base wafer until before completely cutting through the glass or the piezoelectric material; and applying an abrasive from the second surface with the anticorrosive film remaining in place on the second surface, by sand-blasting method (S124).
摘要翻译：本公开提供了一种通过使用具有以精确尺寸制造的通孔的基底晶片来制造压电器件的方法。在压电装置的制造方法中，包括：在与由玻璃或压电材料制成的基底晶片的第一面相对的第一面和第二面上形成防腐蚀膜（S121）在防腐蚀膜上形成光致抗蚀剂并对与通孔相对应的防腐蚀膜进行金属蚀刻（S121，S122）; 在金属蚀刻步骤之后，在玻璃或压电材料上施加蚀刻溶液，并且在完全切割玻璃或压电材料之前对基底晶片的第一表面和第二表面进行湿法蚀刻（S123）以及通过喷砂方法从第二表面施加研磨剂，其中防腐蚀膜保留在第二表面上的适当位置（S124）。

6. 发明申请

US20120043859A1 Method of Manufacturing the Piezoelectric Device and the Same 失效
标题翻译：制造压电元件及其制造方法
公开(公告)号：US20120043859A1
公开(公告)日：2012-02-23
申请号：US13208799
申请日：2011-08-12
申请人： Ryoichi Ichikawa , Yoshiaki Amano , Kenji Kamezawa
发明人： Ryoichi Ichikawa , Yoshiaki Amano , Kenji Kamezawa
IPC分类号： H01L41/053 , H01L41/22
CPC分类号： H03H3/02 , H01L2924/16152 , H03H9/1021 , H03H9/21 , H03H2003/026
摘要： To provide a piezoelectric device prevented from overflowing of sealing materials. The piezoelectric device (100) stores a piezoelectric vibrating piece (30) having a pair of excitation electrodes. The piezoelectric device comprises: a package lid (10), including a first bonding surface (M1) formed in periphery of the package lid in a circumferential pattern and a lid recess (10); a package base (30), including a second bonding surface (M2), a base recess surrounded by a second bonding surface that is higher than the second bonding surface, and a pair of seats that is protruding from the base recess, situated for mounting the piezoelectric piece; a piezoelectric piece mounted onto the pair of seats; and a non electric conductive sealing material (48) disposed peripherally in relative to the first bonding surface and the second bonding surface in a circumferential pattern, thus the adhesive bonding the first bonding surface and the second bonding surface. Furthermore, height of the second bonding surface and the pair of seats are same height.
摘要翻译：提供一种防止密封材料溢出的压电装置。压电装置（100）存储具有一对激励电极的压电振动片（30）。压电装置包括：包装盖（10），包括以周向图案形成在包装盖的周边的第一接合表面（M1）和盖凹部（10）; 包括第二接合面（M2）的封装基座（30），由比第二接合面高的第二接合面包围的基座凹部以及从基座凹部突出的一对座，压电片; 安装在所述一对座椅上的压电片; 和非导电性密封材料（48），其以圆周方式相对于所述第一接合面和所述第二接合面周边配置，由此所述粘合剂将所述第一接合面和所述第二接合面接合。此外，第二接合面和一对座的高度相同。

7. 发明授权

US08729775B2 Piezoelectric vibrating devices and methods for manufacturing same 有权
标题翻译：压电振动装置及其制造方法
公开(公告)号：US08729775B2
公开(公告)日：2014-05-20
申请号：US13164494
申请日：2011-06-20
申请人： Mitoshi Umeki , Ryoichi Ichikawa , Yoshiaki Amano , Kenji Kamezawa , Kenichi Kikuchi , Noritsugu Matsukura
发明人： Mitoshi Umeki , Ryoichi Ichikawa , Yoshiaki Amano , Kenji Kamezawa , Kenichi Kikuchi , Noritsugu Matsukura
IPC分类号： H01L41/053
CPC分类号： H03H9/1021
摘要： An exemplary piezoelectric vibrating device includes a piezoelectric vibrating piece that vibrates when electrically energized. A first package plate has a main recess in which the piezoelectric vibrating piece is placed, and a peripheral surface surrounding the recess. A second package plate is bonded to the peripheral surface of the first package plate in airtight manner. A band of adhesive bonds the first package plate to the second package plate. The adhesive band surrounds the peripheral surface. Between the adhesive and the main recess is a band of metal film. The band of metal film prevents gas, generated from the adhesive, from flowing into the recess. The band of metal film surrounds the peripheral surface and is disposed inboard of the band of adhesive.
摘要翻译：示例性压电振动装置包括当电通电时振动的压电振动片。第一封装板具有放置压电振动片的主凹部和围绕凹部的周面。第二封装板以气密的方式结合到第一封装板的外围表面。粘合带将第一包装板粘合到第二包装板。粘合带围绕周边表面。在粘合剂和主凹槽之间是金属薄膜带。金属薄膜带防止由粘合剂产生的气体流入凹槽。金属薄膜带围绕周边表面并设置在粘合带的内侧。

8. 发明申请

US20120043860A1 PIEZOELECTRIC VIBRATING DEVICES AND METHODS FOR MANUFACTURING SAME 有权
标题翻译：压电振动装置及其制造方法
公开(公告)号：US20120043860A1
公开(公告)日：2012-02-23
申请号：US13212030
申请日：2011-08-17
申请人： Ryoichi Ichikawa , Yoshiaki Amano
发明人： Ryoichi Ichikawa , Yoshiaki Amano
IPC分类号： H01L41/053 , H01L41/22
CPC分类号： H03H9/1014 , H03H3/02 , Y10T29/42
摘要： Piezoelectric vibrating devices are disclosed that lack base through-holes and that can be manufactured on a wafer scale. Also disclosed are methods for making same. An exemplary piezoelectric device has a package base having first and second opposing main surfaces. On the second (outer) first main surface is formed a pair of external electrodes. The first (inner) main surface defines a first recess and a peripheral first bonding surface. A pair of connecting electrodes are provided for connecting to the respective external electrodes via respective edge surfaces of the package base that extend between the first and second main surfaces. A piezoelectric vibrating piece is mounted in and contained within the package base. The vibrating piece includes a pair of excitation electrodes electrically connected to respective connecting electrodes. A package lid comprises first and second main surfaces, of which the second (inner) main surface defines a second recess that is larger than the first recess. The second main surface also defines a second bonding surface that peripherally surrounds the second recess. A sealing material is applied, over the width of the second bonding surface, circumferentially between the first bonding surface and the second bonding surface.
摘要翻译：公开了压电振动装置，其缺少基底通孔并且可以在晶片上制造。还公开了制备其的方法。示例性的压电装置具有具有第一和第二相对主表面的封装基座。在第二（外）第一主表面上形成一对外部电极。第一（内）主表面限定第一凹部和周边第一粘合表面。提供一对连接电极，用于经由在第一和第二主表面之间延伸的封装基座的相应边缘表面连接到各个外部电极。压电振动片安装在包装底座内并包含在包装基座内。振动片包括电连接到各个连接电极的一对激励电极。包装盖包括第一和第二主表面，其中第二（内）主表面限定大于第一凹部的第二凹部。第二主表面还限定了外围围绕第二凹部的第二粘合表面。在第一接合表面和第二接合表面之间周向地施加密封材料，在第二接合表面的宽度上。

9. 发明申请

US20110316390A1 PIEZOELECTRIC VIBRATING DEVICES AND METHODS FOR MANUFACTURING SAME 有权
标题翻译：压电振动装置及其制造方法
公开(公告)号：US20110316390A1
公开(公告)日：2011-12-29
申请号：US13164494
申请日：2011-06-20
申请人： Mitoshi Umeki , Ryoichi Ichikawa , Yoshiaki Amano , Kenji Kamezawa , Kenichi Kikuchi , Noritsugu Matsukura
发明人： Mitoshi Umeki , Ryoichi Ichikawa , Yoshiaki Amano , Kenji Kamezawa , Kenichi Kikuchi , Noritsugu Matsukura
IPC分类号： H01L41/053 , H01L41/22
CPC分类号： H03H9/1021
摘要： An exemplary piezoelectric vibrating device includes a piezoelectric vibrating piece that vibrates when electrically energized. A first package plate has a main recess in which the piezoelectric vibrating piece is placed, and a peripheral surface surrounding the recess. A second package plate is bonded to the peripheral surface of the first package plate in airtight manner. A band of adhesive bonds the first package plate to the second package plate. The adhesive band surrounds the peripheral surface. Between the adhesive and the main recess is a band of metal film. The band of metal film prevents gas, generated from the adhesive, from flowing into the recess. The band of metal film surrounds the peripheral surface and is disposed inboard of the band of adhesive.
摘要翻译：示例性压电振动装置包括当电通电时振动的压电振动片。第一封装板具有放置压电振动片的主凹部和围绕凹部的周面。第二封装板以气密的方式结合到第一封装板的外围表面。粘合带将第一包装板粘合到第二包装板。粘合带围绕周边表面。在粘合剂和主凹槽之间是金属薄膜带。金属薄膜带防止由粘合剂产生的气体流入凹槽。金属薄膜带围绕周边表面并设置在粘合带的内侧。

10. 发明授权

US08059265B2 Finger identification apparatus 有权
标题翻译：手指识别装置
公开(公告)号：US08059265B2
公开(公告)日：2011-11-15
申请号：US13064496
申请日：2011-03-29
申请人： Akio Nagasaka , Takafumi Miyatake , Naoto Miura , Yoshiaki Amano , Yoshimi Kasai , Shinichiro Umemura , Miyuki Kono
发明人： Akio Nagasaka , Takafumi Miyatake , Naoto Miura , Yoshiaki Amano , Yoshimi Kasai , Shinichiro Umemura , Miyuki Kono
IPC分类号： G06K9/74 , G06K9/00
CPC分类号： G06K9/00067 , G06K9/00013 , G06K9/00362 , G06K9/00919 , G06K2009/00932
摘要： An identification apparatus that keeps the conditions for imaging uniform among successive identifications and requires a user to perform only a series of simple maneuvers. An identification apparatus comprising a guide member, a light source, and an imaging unit. The guide member includes a pattern or a structure that inspires a user to position his/her finger thereon or to approach his/her specific finger region thereto. A contact member such as a button switch is preferably located at a position in the guide member at which a fingertip is to be positioned. An optical opening is formed at a position coincident with a position at which a portion of a finger to be imaged for identification should be placed. The light source radiates near-infrared light through the portion of the finger to be imaged. The imaging means acquires an image of the finger, and the apparatus compares the image to previously registered images. The apparatus may also include dual light sources power saving functionality, and means for limiting the interference of external light sources.
摘要翻译：一种识别装置，其在连续标识之间保持成像的条件均匀，并且要求用户仅执行一系列简单的操作。一种识别装置，包括导向件，光源和成像单元。引导构件包括启动使用者将他/她的手指放置在其上或用于接近他/她的特定手指区域的图案或结构。诸如按钮开关的接触构件优选地位于引导构件中位于指尖处的位置。在与待成像的手指的一部分要被放置的位置重合的位置处形成光学开口。光源通过要被成像的手指的部分辐射近红外光。成像装置获取手指的图像，并且该装置将图像与先前登记的图像进行比较。该装置还可以包括双光源节电功能，以及用于限制外部光源的干扰的装置。

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