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1. 发明授权

US5266654A Resin composition 失效
标题翻译：树脂组成
公开(公告)号：US5266654A
公开(公告)日：1993-11-30
申请号：US736439
申请日：1991-07-26
申请人： Mikio Kitahara , Koichi Machida , Takayuki Kubo , Motoyuki Torikai , Koutarou Asahina , Junsuke Tanaka , Akihiro Yamaguchi
发明人： Mikio Kitahara , Koichi Machida , Takayuki Kubo , Motoyuki Torikai , Koutarou Asahina , Junsuke Tanaka , Akihiro Yamaguchi
IPC分类号： C08K5/3415 , C08L61/06 , C08L63/00 , C08L65/00 , C08L79/08 , H01B3/30 , H01B3/36 , H01B3/40 , C08G73/10 , C08L61/32
CPC分类号： H01B3/40 , C08K5/3415 , C08L61/06 , C08L63/00 , C08L65/00 , H01B3/30 , H01B3/36 , C08L79/08
摘要： A resin composition for sealing semiconductors which comprises an organic component (A) which contains (a) a polymaleimide compound represented by the formula (I): ##STR1## wherein R.sub.1 is a m-valent organic group having two or more carbon atoms and m is an integer of two or more and (b) a phenolic aralkyl resin represented by the formula (II): ##STR2## wherein X is a divalent group having the formula ##STR3## and n is an integer of from 0 to 100, or contains a mixture of the phenolic aralkyl resin and a phenol, and component (B) which contains an inorganic filler.

2. 发明授权

US5079331A Heat-resistant epoxy resin composition based on 2-(4-hydroxyphenyl)-2-(4-maleimidophenyl)propane 失效
标题翻译：基于2-（4-羟基苯基）-2-（4-马来酰亚胺基苯基）丙烷的耐热环氧树脂组合物
公开(公告)号：US5079331A
公开(公告)日：1992-01-07
申请号：US527267
申请日：1990-05-23
申请人： Mikio Kitahara , Koichi Machida , Takayuki Kubo , Motoyuki Torikai , Koutarou Asahina , Yoshimitsu Tanabe , Keizaburo Yamaguchi , Akihiro Yamaguchi
发明人： Mikio Kitahara , Koichi Machida , Takayuki Kubo , Motoyuki Torikai , Koutarou Asahina , Yoshimitsu Tanabe , Keizaburo Yamaguchi , Akihiro Yamaguchi
IPC分类号： H01L23/29 , C07D207/44 , C07D207/452 , C08G59/40 , C08K5/3415 , H01L23/31
CPC分类号： C07D207/452 , C08K5/3415
摘要： Heat-resistant epoxy resin composition obtained by incorporation of 2-(4-hydroxyphenyl)-2-(4-maleimidophenyl)propane in a resin composition consisting esssentially of epoxy resin and an epoxy hardener is disclosed.
摘要翻译：公开了通过在由环氧树脂和环氧固化剂组成的树脂组合物中引入2-（4-羟基苯基）-2-（4-马来酰亚胺基苯基）丙烷获得的耐热环氧树脂组合物。

3. 发明授权

US5015674A Composition of vinyl polymer-grafted, silicone polymer-modified epoxy resin and polymaleimide 失效
标题翻译：乙烯基聚合物接枝，硅氧烷聚合物改性环氧树脂和聚马来酰亚胺的组成
公开(公告)号：US5015674A
公开(公告)日：1991-05-14
申请号：US386700
申请日：1989-07-31
申请人： Koichi Machida , Mikio Kitahara , Takayuki Kubo , Motoyuki Torikai , Koutarou Asahina
发明人： Koichi Machida , Mikio Kitahara , Takayuki Kubo , Motoyuki Torikai , Koutarou Asahina
IPC分类号： C08G59/00 , C08G59/14 , C08G59/40 , C08K3/00 , C08L63/00 , H01B3/30 , H01B3/40 , H01L23/29 , H01L23/31
CPC分类号： H01B3/40 , C08G59/4042 , C08L63/00 , H01B3/306
摘要： A resin composition for sealing semiconductors which comprises (a) an epoxy resin, (b) a hardening agent, (c) an inorganic filler and (d) a polymaleimide having a specific structure is herein provided. Preferably, the resin composition comprises, as all of or a part of the epoxy resin, a modified epoxy resin composed of (i) a graft polymer of an epoxy resin and a vinyl polymer and (ii) a silicone polymer in an oily state or as particles having an average particle size of not more than 1.0 micron, which are uniformly dispersed in the graft polymer. The resin composition for sealing semiconductors exhibits a low thermal expansion coefficient and a low elastic modulus, generates low stress when thermal shock is applied thereto and exhibits high heat resistance during soldering even after moisture absorption. Therefore, if the composition is used to seal semiconductor devices on a large scale having degree of integration or small-sized, thin semiconductors such as flat packages, these semiconductors provide high reliability.

4. 发明授权

US5082880A Semiconductor sealing composition containing epoxy resin and polymaleimide 失效
标题翻译：含有环氧树脂和聚马来酰亚胺的半导体密封组合物
公开(公告)号：US5082880A
公开(公告)日：1992-01-21
申请号：US404575
申请日：1989-09-08
申请人： Mikio Kitahara , Koichi Machida , Takayuki Kubo , Motoyuki Torikai , Koutarou Asahina
发明人： Mikio Kitahara , Koichi Machida , Takayuki Kubo , Motoyuki Torikai , Koutarou Asahina
IPC分类号： C08F283/10 , C08G59/00 , C08G59/06 , C08G59/08 , C08G59/10 , C08G59/32 , C08G59/40 , C08K3/00 , C08L63/00 , C08L63/02 , C08L63/04 , C09K3/10 , H01L23/29 , H01L23/31 , C08L79/08
CPC分类号： C09K3/1018 , C08F283/10 , C08G59/3218 , C08G59/3227 , C08G59/4042 , C08L63/00 , C09K2200/0625 , C09K2200/0647 , C09K2200/0672 , C09K2200/0685
摘要： A resin composition for sealing semiconductors which comprises (a) an epoxy resin having a specific structure, a modified epoxy resin composed of (i) an epoxy resin having a specific structure or a graft polymer of an epoxy resin having a specific structure and a vinyl polymer and (ii) a silicone polymer in an oily state or as particles having an average particle size of not more than 1.0 micron, which are uniformly dispersed in the epoxy resin or the graft polymer, (b) a hardening agent (c) an inorganic filler and (d) a special polymaleimide is herein provided. The resin composition for sealing semiconductors exhibits a low thermal expansion coefficient and a low elastic modulus, generates low stress when thermal shock is applied thereto and exhibits high heat resistance during soldering even after moisture absorption. Therefore, if the composition is used to seal large-scale semiconductor devices having high degree of integration or small-sized, this semiconductors such as flat packages, there semiconductors provide high reliability.

5. 发明授权

US5120803A Resin compositions for sealing semiconductor 失效
标题翻译：用于密封半导体的树脂组合物
公开(公告)号：US5120803A
公开(公告)日：1992-06-09
申请号：US401841
申请日：1989-09-01
申请人： Mikio Kitahara , Koichi Machida , Takayuki Kubo , Motoyuki Torikai , Koutarou Asahina
发明人： Mikio Kitahara , Koichi Machida , Takayuki Kubo , Motoyuki Torikai , Koutarou Asahina
IPC分类号： C08G59/00 , C08G59/06 , C08G59/08 , C08G59/10 , C08G59/20 , C08G59/28 , C08G59/32 , C08K3/00 , C08L51/08 , C08L63/00 , C08L63/02 , C08L63/04 , H01L23/29 , H01L23/31
CPC分类号： C08L51/08 , C08G59/063 , C08G59/10 , C08G59/3218 , C08G59/3227 , C08L63/00
摘要： A resin composition for sealing semiconductors which comprises (a) a modified epoxy resin composed of (i) an epoxy resin having a specific structure or a graft polymer of an epoxy resin having a specific structure and a vinyl polymer and (ii) a silicone polymer in oily state or as particles having an average particle size of not more than 1.0 micron, which are uniformly dispersed in the epoxy resin or the graft polymer, (b) a hardening agent and (c) an inorganic filler, is herein provided. The resin composition for sealing semiconductors exhibits a low thermal expansion coefficient and a low elastic modulus, generates low stress when thermal shock is applied thereto and exhibits high heat resistance during soldering even after moisture absorption. Therefore, if the composition is used to seal large-scale semiconductor devices having high degree of integration or small-sized, thin semiconductors such as flat packages, these semiconductors provide high reliability.

6. 发明授权

US4904761A Resin composition for sealing semiconductors 失效
标题翻译：用于密封半导体的树脂组合物
公开(公告)号：US4904761A
公开(公告)日：1990-02-27
申请号：US275018
申请日：1988-11-22
申请人： Yuji Okitsu , Koichi Machida , Motoyuki Torikai , Junko Tsuji , Kotaro Asahina , Kazuya Shinkoda , Takayuki Kubo , Mikio Kitahara
发明人： Yuji Okitsu , Koichi Machida , Motoyuki Torikai , Junko Tsuji , Kotaro Asahina , Kazuya Shinkoda , Takayuki Kubo , Mikio Kitahara
IPC分类号： C08G59/00 , C08G59/14 , C08G59/18 , C08G59/20 , C08G59/32 , C08L51/08 , C08L63/00 , C09J151/08 , H01L23/29 , H01L23/31
CPC分类号： H01L23/296 , C09J151/08 , H01L23/293 , H01L2924/0002
摘要： A semiconductor sealing resin composition which comprises (a) a modified epoxy resin which is a graft copolymer of a epoxy resin and a vinyl polymer having dispersed therein a silicone rubber with an average particle diameter less than 1.0.mu.; (b) a curing agent; and (c) an inorganic filler. The sealing composition has a low elastic modulus, a low heat expansion coefficient, a high resistance to heat and a high resistance to thermal expansion.
摘要翻译：一种半导体密封树脂组合物，其包含（a）改性环氧树脂，其是分散有平均粒径小于1.0μm的硅橡胶的环氧树脂和乙烯基聚合物的接枝共聚物; （b）固化剂; 和（c）无机填料。密封组合物具有低弹性模量，低热膨胀系数，高耐热性和高耐热膨胀性。

7. 发明授权

US5134204A Resin composition for sealing semiconductors 失效
标题翻译：用于密封半导体的树脂组合物
公开(公告)号：US5134204A
公开(公告)日：1992-07-28
申请号：US516718
申请日：1990-05-01
申请人： Motoyuki Toriakai , Koutarou Asahina , Mikio Kitahara , Koichi Machida , Takayuki Kubo
发明人： Motoyuki Toriakai , Koutarou Asahina , Mikio Kitahara , Koichi Machida , Takayuki Kubo
IPC分类号： C08G59/20 , C08G59/32 , C08G59/40 , C08G59/62 , H01L23/29 , H01L23/31
CPC分类号： C08G59/621 , C08G59/3218 , C08G59/4042 , H01L23/293 , H01L2924/0002 , H01L2924/12044
摘要： A resin composition for sealing semiconductors which shows high heat resistance and is suitable for sealing semiconductor devices, etc., and which comprises an organic component containing a polymaleimide compound represented by the general formula: ##STR1## where R.sub.1 is a m-valent organic group having at least 2 carbon atoms and m is a positive integer of 2 or more, epoxy compounds mainly consisting of an epoxy compound represented by the general formula: ##STR2## where n is a positive integer of 3-16 and a compound having two or more phenolic hydroxyl groups, and an inorganic filler.

8. 发明授权

US07497889B2 Exhaust emission control device 失效
标题翻译：废气排放控制装置
公开(公告)号：US07497889B2
公开(公告)日：2009-03-03
申请号：US10558705
申请日：2004-06-02
申请人： Takatoshi Furukawa , Yoshihide Takenaka , Koichi Machida
发明人： Takatoshi Furukawa , Yoshihide Takenaka , Koichi Machida
IPC分类号： B03C3/49 , B01D46/00 , F01N3/022 , F01N3/023
CPC分类号： B03C3/363 , B03C3/366 , B03C3/49 , B03C2201/30 , F01N3/01 , Y02T10/20 , Y10S55/10 , Y10S55/30 , Y10S55/38
摘要： Arranged within a cylindrical housing are capturing cells each including a cylindrical outer electrode capable of capturing particulates and an inner electrode inserted into the outer electrode and lined at its outer surface with a dielectric. A divergent exhaust unit is arranged on an end of the housing so as to guide exhaust to interiors in the respective capturing cells. A convergent exhaust unit is arranged on the other end of the housing so as to communicate with a gap between an inner surface of the housing and outer surfaces of the outer electrodes in the respective cells. The inner and outer electrodes are connected to an electric discharge controller.
摘要翻译：在圆柱形壳体内布置的是每个捕获单元，每个单元包括能够捕获微粒的圆柱形外部电极和插入到外部电极中的内部电极并且在其外表面上用电介质排列。发散排气单元设置在壳体的端部上，以将排气引导到各个捕获单元内部。收纳排气单元设置在壳体的另一端，以便与壳体的内表面和各个单元中的外电极的外表面之间的间隙连通。内电极和外电极连接到放电控制器。

9. 发明授权

US5635259A Resin composition for sealing film-made liquid crystal cells 失效
标题翻译：用于密封薄膜制造的液晶单元的树脂组合物
公开(公告)号：US5635259A
公开(公告)日：1997-06-03
申请号：US487889
申请日：1995-06-07
申请人： Syuji Tahara , Koichi Machida , Seiji Itami , Masayuki Horiuchi
发明人： Syuji Tahara , Koichi Machida , Seiji Itami , Masayuki Horiuchi
IPC分类号： C08G59/30 , C08G59/40 , C08G59/68 , C08L63/00 , C09J151/08 , G02F1/1339 , C08L63/10 , C09K19/00
CPC分类号： G02F1/1339 , C08G59/302 , C08G59/4035 , C08G59/686 , C08L63/00 , C09J151/08 , Y10T428/1073 , Y10T428/31511 , Y10T428/31525
摘要： A resin composition for sealing liquid crystal cells comprising as principal ingredients epoxy resin containing a polysulfide modified epoxy resin, hydrazide compounds and fillers.The said epoxy resin contains a polysulfide modified epoxy resin expressed by the general formula (1) in an amount of 20 to 100% by weight in the entire epoxy resin and the average molecular weight of the entire epoxy resin is between 300 and 3000. Formula (1) is defined as follows: ##STR1## where each of R.sup.1 and R.sup.3 represents at least one organic group selected from a group consisting of bisphenol structures, aliphatic oxyether structures and aliphatic thioether structures and R.sup.2 represents a polysulfide structure expressed by --(C.sub.2 H.sub.4 OCH.sub.2 OC.sub.2 H.sub.4 S.sub.m).sub.n --, wherein m represents the number of sulfur atoms contained in a polysulfide structure, which is 1 or 2, and n represents the average number of polysulfide structures contained in the above formula, which is between 1 and 50.A film-made liquid crystal cell made by using the resin composition is excellent in adhesion, flexibility, electric properties and has high reliability.
摘要翻译：一种用于密封液晶单元的树脂组合物，其包含含有多硫化物改性环氧树脂，酰肼化合物和填料的作为主要成分的环氧树脂。所述环氧树脂在整个环氧树脂中含有由通式（1）表示的多硫化物改性环氧树脂，其量为20〜100重量％，整个环氧树脂的平均分子量为300-3000。式（1）定义如下：其中R1和R3各自表示选自双酚结构，脂族氧醚结构和脂族硫醚结构中的至少一种有机基团，R 2表示由下式表示的多硫结构： - （C 2 H 4 OCH 2 OC 2 H 4 Sm）n - ，其中m表示多硫化物结构中所含的硫原子数，其为1或2，n表示上式中所含的多硫化物结构的平均数，介于1和50之间。通过使用该树脂组合物制成的薄膜液晶单元具有优异的粘合性，柔韧性，电性能，并具有高可靠性。

10. 发明申请

US20120148012A1 CONTROL ROD 失效
标题翻译：控制杆
公开(公告)号：US20120148012A1
公开(公告)日：2012-06-14
申请号：US12019103
申请日：2008-01-24
申请人： Takayuki ARAKAWA , Koichi Machida , Norio Kawashima , Kazuki Kobayashi , Yoshiharu Kikuchi
发明人： Takayuki ARAKAWA , Koichi Machida , Norio Kawashima , Kazuki Kobayashi , Yoshiharu Kikuchi
IPC分类号： G21C7/06
CPC分类号： G21C7/113 , G21C7/10 , Y02E30/39
摘要： A control rod includes a tie-rod, a handle mounted to an upper end portion of the tie-rod, either a connector plate or a fall velocity limiter mounted to a lower end portion of the tie-rod, sheaths having a U-shaped cross-section, welded intermittently to the tie-rod at a plurality of locations in the axial direction of the tie-rod, and having an upper end welded to the handle and a lower end welded to either the connector plate or the fall velocity limiter, and a neutron absorbing member disposed inside each of the sheaths. An upper end of a weld portion located at uppermost position in an axial direction of the tie-rod among a plurality of weld portions between the tie-rod and the sheath is disposed at a position within a range between 0.8 and 13% of total axial length Ls of the sheath below an upper end of the sheath.
摘要翻译：控制杆包括拉杆，安装到拉杆的上端部分的手柄，安装到拉杆的下端部分的连接板或下落速度限制器，具有U形的护套横截面，在连杆的轴向方向上的多个位置处间断地焊接到拉杆，并且具有焊接到手柄的上端，以及焊接到连接器板或下落速度限制器的下端以及设置在每个护套内的中子吸收构件。位于拉杆和护套之间的多个焊接部分中的位于拉杆的轴向方向上的最上位置处的焊接部分的上端设置在总轴向的0.8和13％之间的范围内的位置在鞘的上端下方的鞘的长度Ls。

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