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1. 发明授权

US5825120A Electronic component 失效
标题翻译：电子元器件
公开(公告)号：US5825120A
公开(公告)日：1998-10-20
申请号：US853447
申请日：1997-05-09
申请人： Michinobu Maesaka , Tetsuo Tatsumi , Masato Higuchi
发明人： Michinobu Maesaka , Tetsuo Tatsumi , Masato Higuchi
IPC分类号： H05K9/00 , H01L23/00 , H01L23/02 , H01L23/10 , H03H3/02 , H03H9/02 , H03H9/10 , H03H9/17 , H01L41/08
CPC分类号： H03H9/1014
摘要： An electronic component suppresses stray capacitance and exhibits a high electromagnetic shielding effect, and eliminates flowing of a conductive agent into inappropriate areas and occurrence of a poor electrical connection. Electronic-component devices are mounted on an insulating substrate having input and output electrodes and a ground electrode. Then, a metallic cap is bonded and sealed onto the substrate via an insulating layer to cover the electronic-component devices. A conductive layer connected to the ground electrode is disposed on part of the cap-mounting portion of the substrate and positioned at a level higher than the insulating layer so that the metallic cap is electrically connected via the conductive layer to the ground electrode.
摘要翻译：电子部件抑制杂散电容，并且具有高的电磁屏蔽效果，并且消除导电剂流入不适当的区域并发生不良的电连接。电子部件装置安装在具有输入和输出电极和接地电极的绝缘基板上。然后，通过绝缘层将金属盖接合并密封到基板上以覆盖电子部件装置。连接到接地电极的导电层设置在基板的盖安装部分的一部分上，并且位于比绝缘层高的位置，使得金属盖经由导电层电连接到接地电极。

2. 发明授权

US5875099A Electronic component 失效
标题翻译：电子元器件
公开(公告)号：US5875099A
公开(公告)日：1999-02-23
申请号：US82873
申请日：1998-05-21
申请人： Michinobu Maesaka , Tetsuo Tatsumi , Masato Higuchi
发明人： Michinobu Maesaka , Tetsuo Tatsumi , Masato Higuchi
IPC分类号： H03H9/10 , H05K1/18
CPC分类号： H03H9/1014
摘要： An electronic component suppresses stray capacitance and exhibits a high electromagnetic shielding effect, and eliminates flowing of a conductive agent into inappropriate areas and occurrence of a poor electrical connection. Electronic-component devices are mounted on an insulating substrate having input and output electrodes and a ground electrode. Then, a metallic cap is bonded and sealed onto the substrate via an insulating layer having holes formed therein so as to cover the electronic-component devices. A conductive layer connected to the ground electrode is disposed on part of the cap-mounting portion of the substrate and positioned at a level higher than the insulating layer so that the metallic cap is electrically connected via the conductive layer to the ground electrode.
摘要翻译：电子部件抑制杂散电容，并且具有高的电磁屏蔽效果，并且消除导电剂流入不适当的区域并发生不良的电连接。电子部件装置安装在具有输入和输出电极和接地电极的绝缘基板上。然后，通过形成有孔的绝缘层将金属盖接合并密封在基板上，以覆盖电子部件装置。连接到接地电极的导电层设置在基板的盖安装部分的一部分上，并且位于比绝缘层高的位置，使得金属盖经由导电层电连接到接地电极。

3. 发明授权

US06500483B1 Method and device for applying sealant to component 有权
标题翻译：用于将部件密封剂涂敷的方法和装置
公开(公告)号：US06500483B1
公开(公告)日：2002-12-31
申请号：US09512508
申请日：2000-02-24
申请人： Masato Higuchi , Atsushi Hirakawa , Michinobu Maesaka
发明人： Masato Higuchi , Atsushi Hirakawa , Michinobu Maesaka
IPC分类号： B05D512
CPC分类号： H01L21/50 , Y10T156/1798
摘要： A method for applying a sealant to a component, in which the sealant is applied to a part of or the entirety of a sealing surface of the component, comprises the steps of: disposing in the sealant, an abutting member approximately in parallel to a surface of the sealant, which is a liquid, formed into a film of a specified thickness; pressing the sealing surface of the component to the abutting member in the sealant formed into the film; and transferring the sealant to the sealing surface of the component by pulling the component apart from the sealant.
摘要翻译：将密封剂施加到部件的密封面的一部分或整体的部件上施加密封剂的方法包括以下步骤：在密封剂中设置大致平行于表面的抵接构件的密封剂，其是液体，形成为特定厚度的膜; 将所述部件的密封面压在形成所述膜的密封剂中的抵接部件上; 并且通过将部件从密封剂中分离而将密封剂转移到部件的密封表面。

4. 发明申请

US20130237330A1 SHELL-TYPE NEEDLE BEARING AND CROSS-TYPE UNIVERSAL JOINT 有权
标题翻译：壳型轴承和交叉型通用接头
公开(公告)号：US20130237330A1
公开(公告)日：2013-09-12
申请号：US13699674
申请日：2012-01-25
申请人： Masato Higuchi , Eisho Watanabe
发明人： Masato Higuchi , Eisho Watanabe
IPC分类号： F16D3/41 , F16C19/44 , F16C33/58 , F16C19/26
CPC分类号： F16D3/41 , F16C19/225 , F16C19/26 , F16C19/44 , F16C21/005 , F16C33/58 , F16C33/586 , F16C33/588 , F16C33/64 , F16C33/7809 , F16C33/7823 , F16C33/7886 , F16C33/7889 , F16C2361/41 , F16D3/385 , Y02T10/865
摘要： Construction is achieved of a cross-type universal joint and a shell-type needle bearing that is used therein for which cost can be lowered and durability can be maintained by suitably maintaining the seal performance even when used in severe operating conditions. The portions on the outer surface of the shell-type outer ring 9a for which there is a possible of coming in sliding contact with the tip end edges of at least two seal lips 17, 18 of a plurality of seal lips of a seal ring 14 are selectively covered with a corrosion resistant coating. Preferably, the entire outer surface of the shell-type outer ring is covered by a chemically treated film having anti-corrosion properties.
摘要翻译：通过使用十字型万向接头和壳型滚针轴承来实现，即使在苛刻的操作条件下使用时也可以适当地保持密封性能，可以降低成本并保持耐久性。壳型外圈9a的外表面上的可能与密封环14的多个密封唇的至少两个密封唇17,18的前端缘滑动接触的部分选择性地覆盖有耐腐蚀涂层。优选地，壳型外圈的整个外表面被具有防腐蚀性能的化学处理膜覆盖。

5. 发明授权

US07752747B2 Manufacturing method of electronic component 有权
标题翻译：电子元件制造方法
公开(公告)号：US07752747B2
公开(公告)日：2010-07-13
申请号：US10595988
申请日：2004-12-07
申请人： Masato Higuchi , Hideki Shinkai , Osamu Ishikawa
发明人： Masato Higuchi , Hideki Shinkai , Osamu Ishikawa
IPC分类号： H05K3/30
CPC分类号： H03H9/1085 , H01L21/561 , H01L21/566 , H01L21/67126 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01012 , H01L2924/0102 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/181 , Y10T29/42 , Y10T29/435 , Y10T29/4913 , Y10T29/49146 , Y10T29/49158 , Y10T29/49171 , Y10T29/49172 , H01L2224/81 , H01L2924/00 , H01L2224/0401
摘要： A method of manufacturing an electronic component minimizes the occurrence of voids and degradation of characteristics in a resin-sealed portion, while reducing the costs thereof. A sealing step for sealing surface acoustic wave elements by a sealing resin member formed from a resin film is performed by mounting the surface acoustic wave elements on a collective mounting substrate and the resin film in a bag with a gas-barrier property, and causing the resin film to infiltrate between the surface acoustic wave elements mounted on the reduce-pressured-packed collective mounting substrate to be hermetically sealed by the pressure difference between the inside and the outside of the bag.
摘要翻译：电子部件的制造方法使树脂密封部的空隙的发生和特性的劣化最小化，同时降低成本。通过由树脂膜形成的密封树脂构件来密封声表面波元件的密封步骤是通过将表面声波元件安装在集体安装基板上，并将树脂膜安装在具有阻气性的袋中，在安装在减压加压集合安装基板上的声表面波元件之间渗透的树脂膜被气袋内外的压力差气密密封。

6. 发明申请

US20090005540A1 Method For Removing Sialic Acid and Method For Producing Asialoerythropoietin 审中-公开
标题翻译：去除唾液酸的方法和生产Asialo促红细胞生成素的方法
公开(公告)号：US20090005540A1
公开(公告)日：2009-01-01
申请号：US12087945
申请日：2007-01-18
申请人： Masato Higuchi
发明人： Masato Higuchi
IPC分类号： C07K14/00 , C07H1/06
CPC分类号： C07K14/505
摘要： The object is to provide a method for removing a sialic acid that can be carried out simply at a low cost and a method for producing asialoerythropoietin using the same. The method for removing a sialic acid according to the present invention includes an acidifying and heating process of acidifying and heating a solution containing erythropoietin so as to remove a sialic acid bonded to an erythropoietin molecule. Further, the method for producing asialoerythropoietin according to the present invention includes a sialic acid removing process of removing a sialic acid bonded to an erythropoietin molecule by the method for removing a sialic acid according to the present invention.
摘要翻译：本发明的目的是提供一种可以简单地以低成本除去唾液酸的方法，以及使用该方法制备唾液促红细胞生成素的方法。根据本发明的除去唾液酸的方法包括酸化和加热含有促红细胞生成素的溶液的酸化和加热方法，以除去与红细胞生成素分子结合的唾液酸。此外，本发明的唾液酸促生成素的制造方法包括通过本发明的除去唾液酸的方法除去与红细胞生成素分子结合的唾液酸的唾液酸去除方法。

7. 发明授权

US08834034B2 Outer ring for a shell-type radial needle bearing and manufacturing method thereof 有权
标题翻译：壳型径向滚针轴承外圈及其制造方法
公开(公告)号：US08834034B2
公开(公告)日：2014-09-16
申请号：US13391933
申请日：2011-09-22
申请人： Masato Higuchi , Noriyuki Takeo , Yoshiaki Komura
发明人： Masato Higuchi , Noriyuki Takeo , Yoshiaki Komura
IPC分类号： F16C33/58 , F16C33/34 , F16D3/41 , F16C33/64 , F16C19/46 , F16D3/38
CPC分类号： B21D53/12 , B21D53/10 , B24C1/10 , F16C19/466 , F16C21/005 , F16C33/588 , F16C33/64 , F16C2220/40 , F16C2220/42 , F16C2240/18 , F16C2361/41 , F16D3/385 , F16D3/41 , Y10T29/49689
摘要： An outer ring 6a for a shell-type radial needle bearing having a cylindrical shape with a bottom is achieved for which fatigue life of the bottom plate section 9a and the continuous section between the bottom plate section 9a and the cylindrical section 8a is improved, as well as the anti-corrosion characteristic of the outer ring 6a is improved and the outer ring 6a can be prevented from coming out of the bearing without an increase in cost. After obtaining an intermediate raw material 35 having a cylindrical section and a bottom plate section from a metal raw material, shot peening is performed on the intermediate material 35 to create residual compressive stress in the surface and surface layer section on the outer surface side of the cylindrical section 8a and the bottom plate section 9a such that the residual compressive stress in the surface layer section on the outer surface side is greater than the in the surface layer section on the inner surface side, and from the surface to a depth of 0.03 mm is 700 MPa to 1600 MPa.
摘要翻译：实现了具有底部圆柱形的壳型径向滚针轴承的外圈6a，底板部9a和底板部9a与圆筒部8a之间的连续部分的疲劳寿命得到改善，如并且外圈6a的防锈特性得到改善，并且可以防止外圈6a从轴承中脱出而不增加成本。在从金属原料获得具有圆筒形部分和底板部分的中间原料35之后，对中间材料35进行喷丸硬化，以在中间材料35的外表面侧的表面和表层部分产生残留的压缩应力圆筒部8a和底板部9a，使得外表面侧的表层部的残留压缩应力大于内表面侧的表层部，并且从表面到0.03mm的深度为700MPa〜1600MPa。

8. 发明申请

US20090280094A1 Treatment of Ischemic Diseases Using Erythropoietin 审中-公开
标题翻译：用红细胞生成素治疗缺血性疾病
公开(公告)号：US20090280094A1
公开(公告)日：2009-11-12
申请号：US12303669
申请日：2007-06-07
申请人： Toshio Matsumoto , Tetsuya Kitagawa , Masahiro Abe , Masashi Akaike , Kazunari Nagayoshi , Kaname Yamamoto , Masato Higuchi
发明人： Toshio Matsumoto , Tetsuya Kitagawa , Masahiro Abe , Masashi Akaike , Kazunari Nagayoshi , Kaname Yamamoto , Masato Higuchi
IPC分类号： A61K35/12 , A61K38/22
CPC分类号： A61K38/1816 , A61K35/28 , C12N5/0634 , C12N2501/14
摘要： Disclosed is a method for stimulating revascularization in a subject comprising the steps of: (a) administering erythropoietin to the subject; (b) collecting peripheral blood mononuclear cells from the subject; and (c) administering the collected peripheral blood mononuclear cells to a target site of the subject. Peripheral blood mononuclear cells, and particularly CD34-positive cells, are mobilized into the peripheral blood of a subject by the administration of erythropoietin to the subject. The method of the present invention is useful for the treatment of ischemic diseases, such as peripheral vascular disorder.
摘要翻译：公开了一种刺激受试者血运重建的方法，包括以下步骤：（a）向受试者施用促红细胞生成素; （b）从受试者收集外周血单核细胞; 和（c）将收集的外周血单核细胞给予受试者的靶位点。外周血单核细胞，特别是CD34阳性细胞通过向受试者施用促红细胞生成素而被动员到受试者的外周血中。本发明的方法可用于治疗缺血性疾病，例如外周血管病变。

9. 发明授权

US06437412B1 Surface acoustic wave device having a package including a conductive cap that is coated with sealing material 失效
标题翻译：表面声波装置具有包括涂覆有密封材料的导电盖的封装
公开(公告)号：US06437412B1
公开(公告)日：2002-08-20
申请号：US09592517
申请日：2000-06-12
申请人： Masato Higuchi , Atsushi Hirakawa , Shinobu Uesugi , Koichi Kanryo
发明人： Masato Higuchi , Atsushi Hirakawa , Shinobu Uesugi , Koichi Kanryo
IPC分类号： H03H925
CPC分类号： H03H9/1071 , H01L2224/48091 , H01L2924/16195 , H01L2924/00014
摘要： A surface acoustic wave device includes a surface acoustic wave element and a package. The package has a base member and a conductive cap member which are joined together by a sealing material so as to hermetically seal the surface acoustic wave element therein. The conductive cap member is coated with the sealing material on the entire surface thereof that is disposed opposite to the base member.
摘要翻译：表面声波装置包括表面声波元件和封装。该封装具有通过密封材料接合在一起的基部构件和导电盖构件，以便将表面声波元件气密地密封。导电盖构件在与基座构件相对设置的整个表面上涂覆有密封材料。

10. 发明申请

US20120236500A1 WIRING BOARD AND POWER CONVERSION DEVICE 失效
标题翻译：接线板和电源转换器件
公开(公告)号：US20120236500A1
公开(公告)日：2012-09-20
申请号：US13329423
申请日：2011-12-19
申请人： Masato Higuchi , Yasuhiko Kawanami , Katsushi Terazono , Koji Higashikawa , Akira Sasaki , Takayuki Morihara , Takashi Aoki , Tetsuya Ito , Yukihisa Nakabayashi , Tasuku Isobe , Kiyonori Koguma
发明人： Masato Higuchi , Yasuhiko Kawanami , Katsushi Terazono , Koji Higashikawa , Akira Sasaki , Takayuki Morihara , Takashi Aoki , Tetsuya Ito , Yukihisa Nakabayashi , Tasuku Isobe , Kiyonori Koguma
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L25/112 , H01L2224/16225 , H01L2224/32225 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/3011 , H02M7/003 , H01L2924/00
摘要： A wiring board includes a conductor plate including a wiring portion and an electrode portion connected to a power conversion semiconductor element, a liquid-cooling pipe mounted near the conductor plate and causing a cooling liquid to be supplied therethrough, and an insulating resin material arranged at least between the conductor plate and the liquid-cooling pipe.
摘要翻译：布线基板包括：导体板，包括布线部分和连接到功率转换半导体元件的电极部分;液体冷却管，安装在导体板附近并使冷却液供应到其中;以及绝缘树脂材料，布置在至少在导体板和液体冷却管之间。

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