专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5895976A Microelectronic assembly including polymeric reinforcement on an integrated circuit die, and method for forming same 失效
标题翻译：包括集成电路芯片上的聚合物增强的微电子组件及其形成方法
公开(公告)号：US5895976A
公开(公告)日：1999-04-20
申请号：US657216
申请日：1996-06-03
申请人： Michelle J. Morrell , Steven C. Machuga , Grace M. O'Malley , George A. Carson , Andrew Skipor , Wen Xu Zhou , Karl W. Wyatt
发明人： Michelle J. Morrell , Steven C. Machuga , Grace M. O'Malley , George A. Carson , Andrew Skipor , Wen Xu Zhou , Karl W. Wyatt
IPC分类号： H01L21/56 , H01L23/31 , H01L23/48
CPC分类号： H01L23/3157 , H01L21/563 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/01322 , H01L2924/09701
摘要： A microelectronic assembly (10) includes an integrated circuit die (12) mounted onto a substrate (14) by solder bump interconnections (32). The die (12) and the substrate (14) are spaced apart by a gap (30) that is filled with a polymeric encapsulant (16). The die (12) includes a die perimeter (24) and a face (27) facing away from the substrate (14). A polymeric reinforcement (18) is disposed onto the die face (27) to protect the die (12) and to reduce the effects of thermally induced stresses on the die (12) and the solder bump interconnections (32). The polymeric reinforcement (18) is spaced apart from the die perimeter (24) to maintain a desired peripheral fillet geometry of the encapsulant (16).
摘要翻译：微电子组件（10）包括通过焊料凸块互连（32）安装到衬底（14）上的集成电路管芯（12）。模具（12）和衬底（14）被填充有聚合物密封剂（16）的间隙（30）间隔开。模具（12）包括模具周边（24）和面向背离衬底（14）的面（27）。聚合物加强件（18）设置在模具表面（27）上以保护模具（12）并且减少热引起的应力对模具（12）和焊料凸块互连（32）的影响。聚合物加强件（18）与模具周边（24）间隔开，以保持密封剂（16）的期望的外圆角几何形状。

2. 发明申请

US20060196579A1 High energy soldering composition and method of soldering 审中-公开
标题翻译：高能焊料组合物及焊接方法
公开(公告)号：US20060196579A1
公开(公告)日：2006-09-07
申请号：US11073919
申请日：2005-03-07
申请人： Andrew Skipor , Krishna Jonnalagadda , Steven Scheifers
发明人： Andrew Skipor , Krishna Jonnalagadda , Steven Scheifers
IPC分类号： B23K35/34
CPC分类号： H05K3/3484 , B23K35/0244 , B23K35/025 , H05K2201/0257 , H05K2201/0266
摘要： A low temperature, high energy soldering composition for joining metals together contains a fluxing agent and high energy metal particles that possess sufficiently high internal energy, suspended in the fluxing agent, such that the melting point of the high energy metal particles is depressed by at least three degrees Celsius below the normal bulk melting temperature of metal. A solder joint is effected by placing the high energy metal particles in contact with one or more of the metal surfaces and heating the high energy metal particles in the presence of a fluxing agent to melt the high energy metal particles and fuse them to the metal surface.
摘要翻译：用于将金属接合的低温，高能量焊接组合物含有助熔剂和具有足够高的内部能量的高能金属颗粒，悬浮在助熔剂中，使得高能金属颗粒的熔点至少被压下三摄氏度以下的正常体积熔融金属温度。通过将高能金属颗粒与一个或多个金属表面接触并且在助熔剂存在下加热高能金属颗粒来熔化高能金属颗粒并将其熔合到金属表面来实现焊接接头。

3. 发明申请

US20070089626A1 Functional ink apparatus and method 审中-公开
标题翻译：功能性油墨装置及方法
公开(公告)号：US20070089626A1
公开(公告)日：2007-04-26
申请号：US11259580
申请日：2005-10-26
申请人： Amjad Rasul , Paul Brazis , Daniel Gamota , Andrew Skipor , Jie Zhang
发明人： Amjad Rasul , Paul Brazis , Daniel Gamota , Andrew Skipor , Jie Zhang
IPC分类号： B41F31/00
CPC分类号： H05K1/162 , H05K2201/0209 , H05K2201/0257 , H05K2203/013
摘要： A functional ink (200) suitable for use as a dielectric layer (303) in a printed semiconductor device (300) comprises a dielectric carrier (201) and a plurality of dielectric particles (202) sized less than about 1,000 nanometers that are disposed within the dielectric carrier. In a preferred approach the dielectric carrier comprises a dielectric resin and the dielectric particles comprise a ferroelectric material (such as, but not limited to, BaTiO3. So provided, this functional ink can be applied to a substrate (301) of choice through a printing technique of choice to thereby provide a resultant printed semiconductor device, such as a field effect transistor, having a relatively thin dielectric layer comprised of this functional ink.
摘要翻译：适合用作印刷半导体器件（300）中的电介质层（303）的功能油墨（200）包括电介质载体（201）和尺寸小于约1000纳米的多个电介质颗粒（202）电介质载体。在优选的方法中，电介质载体包括电介质树脂，并且电介质颗粒包含铁电材料（例如但不限于BaTiO 3 N 3）。因此，该功能性油墨可以应用于基底（301），通过选择的打印技术来选择，从而提供具有由该功能性墨水组成的相对薄的介电层的所得印刷半导体器件，例如场效应晶体管。

4. 发明授权

US5229070A Low temperature-wetting tin-base solder paste 失效
标题翻译：低温润湿锡基锡膏
公开(公告)号：US5229070A
公开(公告)日：1993-07-20
申请号：US908109
申请日：1992-07-02
申请人： Cynthia M. Melton , Andrew Skipor , William M. Beckenbaugh
发明人： Cynthia M. Melton , Andrew Skipor , William M. Beckenbaugh
IPC分类号： B23K35/02 , B23K35/26 , H05K3/34
CPC分类号： B23K35/025 , B23K35/262 , H05K3/3484 , H05K2201/0272 , H05K3/3463
摘要： A low temperature-wetting solder paste for forming a tin-base solder connection comprises a mixture of compositionally distinct first and second solder powders. The first solder is formed predominantly of tin, preferably at least 90 weight percent. The second powder is formed of a tin alloy containing indium or bismuth and having a melting temperature less than the first powder. During soldering, the second powder melts during the early stages of the heating cycle to initiate wetting of the faying surfaces and promote dissolution of the first powder, thereby reducing the time and temperature required to form the solder connection.
摘要翻译：用于形成锡基焊料连接的低温润湿焊膏包括组成上不同的第一和第二焊料粉末的混合物。第一焊料主要由锡形成，优选至少为90重量％。第二粉末由含有铟或铋的锡合金形成，并且具有小于第一粉末的熔化温度。在焊接期间，第二粉末在加热循环的早期阶段熔化，引发熔融表面的润湿，促进第一粉末的溶解，从而减少形成焊料连接所需的时间和温度。

5. 发明申请

US20090059554A1 APPARATUS FOR SELECTIVELY BACKLIGHTING A MATERIAL 有权
标题翻译：选择材料选择的装置
公开(公告)号：US20090059554A1
公开(公告)日：2009-03-05
申请号：US11846360
申请日：2007-08-28
申请人： Andrew Skipor , Rick Latella , Steven Scheifers
发明人： Andrew Skipor , Rick Latella , Steven Scheifers
IPC分类号： F21V9/16 , F21V9/08 , G01D11/28
CPC分类号： G06F1/3218 , G02F1/1336 , G02F1/133617 , G02F2001/133614 , H01H13/83 , H01H2219/018 , H01H2219/052
摘要： A backlighting device (300, 400, 500, 600) emitting light having a first wavelength includes a first radiation emission device (302), e.g., an electroluminescent lamp, for emitting radiation having a second wavelength. A layer (306) of a plurality of photon emitting particles (308), e.g., free standing quantum dots or phosphorus particles, emits light having the first wavelength in response to the first radiation emission device (302), the first wavelength being larger than the second wavelength. A transparent material (116, 120, 122) overlies the layer of a plurality of photon emitting particles (308), wherein the light having a first wavelength passes through the transparent material (116, 120, 122). Optionally, a filter (402) may be placed over the layer (306) to block the radiation having a second wavelength, and a scattering layer (604) may be placed over the layer (306) to scatter wavelength other than the first wavelength.
摘要翻译：发射具有第一波长的光的背光装置（300,400,500,600）包括用于发射具有第二波长的辐射的第一辐射发射装置（302），例如电致发光灯。多个光子发射粒子（308）的层（306）（例如，独立量子点或磷粒子）响应于第一辐射发射装置（302）发射具有第一波长的光，第一波长大于第二波长。透明材料（116,120,122）覆盖多个光子发射颗粒（308）的层，其中具有第一波长的光通过透明材料（116,120,122）。可选地，过滤器（402）可以放置在层（306）上以阻挡具有第二波长的辐射，并且可以在层（306）上方布置散射层（604）以散射除第一波长之外的波长。

6. 发明申请

US20090054752A1 METHOD AND APPARATUS FOR PHOTOPLETHYSMOGRAPHIC SENSING 审中-公开
标题翻译：光电子感测方法与装置
公开(公告)号：US20090054752A1
公开(公告)日：2009-02-26
申请号：US11843187
申请日：2007-08-22
申请人： Krishna Jonnalagadda , Di-An Hong , Xun Luo , Francesca Schuler , Andrew Skipor
发明人： Krishna Jonnalagadda , Di-An Hong , Xun Luo , Francesca Schuler , Andrew Skipor
IPC分类号： A61B5/02
CPC分类号： A61B5/721 , A61B5/02433 , A61B5/11 , A61B5/14552 , A61B2562/0219 , A61B2562/164
摘要： A photoplethysmographic sensing system for determining a user's pulse rate includes a light emitting device (100, 201, 310, 500) including a first plurality of light emitting particles (108, 208, 317) having a first diameter and emitting light having a first wavelength. A detector (118, 218, 500) is positioned to receive light emitted from the plurality of light emitting particles (108, 208, 317) and a processing device (500) determines the pulse rate. The light emitting device (100, 201, 310, 500) and the detector (118, 218, 500) are disposed on a flexible polymeric material (102, 202, 334). The light emitting device (100, 201, 310, 500) may include a second plurality of light emitting particles (108, 208, 317) having a second diameter and emitting light having a second wavelength, wherein the processing device (500) determines the user's blood oxygen level. The light emitting particles (108, 208, 317) may comprise one of quantum dots, electroluminescent particles, or organic particles.
摘要翻译：一种用于确定用户脉搏率的光电容积摄影感测系统包括：发光器件（100,201,310,500），包括具有第一直径的第一多个发光粒子（108,208,317），并且发射具有第一波长。定位检测器（118,218,500）以接收从多个发光颗粒（108,208,317）发射的光，并且处理装置（500）确定脉率。发光器件（100,201,310,500）和检测器（118,218,500）设置在柔性聚合物材料（102,202,334）上。发光器件（100,201,310,500）可以包括具有第二直径并发射具有第二波长的光的第二多个发光颗粒（108,208,317），其中处理装置（500）确定用户的血氧水平。发光粒子（108,208,317）可以包括量子点，电致发光粒子或有机粒子之一。

7. 发明授权

US07108914B2 Self-healing polymer compositions 有权
标题翻译：自愈聚合物组合物
公开(公告)号：US07108914B2
公开(公告)日：2006-09-19
申请号：US10195858
申请日：2002-07-15
申请人： Andrew Skipor , Steve Scheifer , Bill Olson
发明人： Andrew Skipor , Steve Scheifer , Bill Olson
IPC分类号： B32B5/16 , C08K9/02 , C08K9/00 , C08K9/10
CPC分类号： B29C73/163 , B01J13/02 , B29C73/22 , B82Y30/00 , H01L23/145 , H01L23/293 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/29101 , H01L2224/2919 , H01L2224/29339 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/4554 , H01L2224/45611 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/8319 , H01L2224/83855 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01041 , H01L2924/01044 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01075 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H01L2924/19042 , Y10T428/249995 , Y10T428/2985 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/3512
摘要： A self-healing polymer composition 10 contains a polymer media 12 and a plurality of microcapsules of flowable polymerizable material 16 dispersed in the polymer media 12, where the microcapsules of flowable polymerizable material 16 contain a flowable polymerizable material 15 and have an outer surface 142 upon which at least one polymerization agent 13 is chemically attached. The microcapsules 16 are effective for rupturing with a failure of the polymeric media 12, and the flowable polymerizable material 15 reacts with the polymerization agent 13 when the polymerizable material 15 makes contact with the polymerization agent 13 upon rupture of the microcapsules 14. There is also provided a method of using the self-healing polymeric composition 10 to repair fractures in polymers, as well as articles of manufacture including the self-healing system, and the microencapsulated polymerizable particles 16 themselves.
摘要翻译：自修复聚合物组合物10包含聚合物介质12和分散在聚合物介质12中的可流动的可聚合材料16的多个微胶囊，其中可流动的可聚合材料16的微胶囊包含可流动的可聚合材料15并具有外表面142 其中至少一种聚合剂13化学连接。微胶囊16在聚合物介质12的破坏时破裂是有效的，并且当可聚合材料15在微囊14破裂时与聚合剂13接触时，可流动的可聚合材料15与聚合剂13反应。还提供了使用自修复聚合物组合物10修复聚合物中的裂缝的方法，以及包括自愈系统的制品和微囊化的可聚合颗粒16本身。

8. 发明授权

US5221038A Method for forming tin-indium or tin-bismuth solder connection having increased melting temperature 失效
标题翻译：用于形成具有增加的熔融温度的锡铟或锡 - 铋焊料连接的方法
公开(公告)号：US5221038A
公开(公告)日：1993-06-22
申请号：US956236
申请日：1992-10-05
申请人： Cynthia M. Melton , Andrew Skipor
发明人： Cynthia M. Melton , Andrew Skipor
IPC分类号： B23K1/00 , B23K35/00 , B23K35/02 , B23K35/26 , H05K3/24 , H05K3/34
CPC分类号： H05K3/3484 , B23K1/0016 , B23K35/001 , B23K35/262 , B23K35/264 , H05K3/3463 , B23K35/025 , H05K2201/10636 , H05K2201/10992 , H05K2203/0723 , H05K3/244 , H05K3/3442 , H05K3/3473 , Y02P70/611
摘要： A solder connection (30) is formed based upon a tinindium or tin-bismuth alloy, but having a melting temperature greater than the melting temperature of the initial solder alloy. A deposit (26) of solder alloy is placed against a tin plate (24) applied, preferably by electrodeposition, to a first faying surface (18). Following assembling with a second faying surface (22), the assembly is heated to melt the solder deposit, whereupon tin from the tin plate dissolves into the solder liquid to form a tin-enriched alloy having an increased melting temperature.
摘要翻译：基于锡或铋合金形成焊接连接（30），但熔化温度大于初始焊料合金的熔化温度。将焊料合金沉积物（26）放置在抵靠最好通过电沉积施加的锡板（24）上的第一接合表面（18）上。在与第二贴合表面（22）组装之后，加热组件以熔化焊料沉积物，于是来自锡板的锡溶解到焊料液体中以形成具有增加的熔融温度的富锡合金。

9. 发明申请

US20120195022A1 APPARATUS FOR SELECTIVELY BACKLIGHTING A MATERIAL 审中-公开
标题翻译：选择材料选择的装置
公开(公告)号：US20120195022A1
公开(公告)日：2012-08-02
申请号：US13367149
申请日：2012-02-06
申请人： Andrew Skipor , Rick Latella , Steven Scheifers
发明人： Andrew Skipor , Rick Latella , Steven Scheifers
IPC分类号： F21V9/16
CPC分类号： G06F1/3218 , G02F1/1336 , G02F1/133617 , G02F2001/133614 , H01H13/83 , H01H2219/018 , H01H2219/052
摘要： A backlighting device (300, 400, 500, 600) emitting light having a first wavelength includes a first radiation emission device (302), e.g., an electroluminescent lamp, for emitting radiation having a second wavelength. A layer (306) of a plurality of photon emitting particles (308), e.g., free standing quantum dots or phosphorus particles, emits light having the first wavelength in response to the first radiation emission device (302), the first wavelength being larger than the second wavelength. A transparent material (116, 120, 122) overlies the layer of a plurality of photon emitting particles (308), wherein the light having a first wavelength passes through the transparent material (116, 120, 122). Optionally, a filter (402) may be placed over the layer (306) to block the radiation having a second wavelength, and a scattering layer (604) may be placed over the layer (306) to scatter wavelength other than the first wavelength.
摘要翻译：发射具有第一波长的光的背光装置（300,400,500,600）包括用于发射具有第二波长的辐射的第一辐射发射装置（302），例如电致发光灯。多个光子发射粒子（308）的层（306）（例如，独立量子点或磷粒子）响应于第一辐射发射装置（302）发射具有第一波长的光，第一波长大于第二波长。透明材料（116,120,122）覆盖多个光子发射颗粒（308）的层，其中具有第一波长的光通过透明材料（116,120,122）。可选地，过滤器（402）可以放置在层（306）上以阻挡具有第二波长的辐射，并且可以在层（306）上方布置散射层（604）以散射除第一波长之外的波长。

10. 发明申请

US20050189537A1 Encapsulated organic semiconductor device and method 有权
标题翻译：封装有机半导体器件及方法
公开(公告)号：US20050189537A1
公开(公告)日：2005-09-01
申请号：US11108025
申请日：2005-04-15
申请人： Steven Scheifers , Daniel Gamota , Andrew Skipor , Krishna Kalyanasundaram
发明人： Steven Scheifers , Daniel Gamota , Andrew Skipor , Krishna Kalyanasundaram
IPC分类号： H01L51/05 , H01L51/52 , H01L29/08 , H01L21/8234 , H01L35/24 , H01L51/00
CPC分类号： H01L51/107 , H01L51/0516 , H01L51/524 , H01L51/5243 , H01L51/5253 , H01L51/5259 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor device comprising organic semiconductor material (14) has one or more barrier layers (16) disposed at least partially thereabout to protect the organic semiconductor material (14) from environment-driven changes that typically lead to inoperability of a corresponding device. If desired, the barrier layer can be comprised of partially permeable material that allows some substances therethrough to thereby effect disabling of the encapsulated organic semiconductor device after a substantially predetermined period of time. Getterers (141) may also be used to protect, at least for a period of time, such organic semiconductor material.
摘要翻译：包括有机半导体材料（14）的半导体器件具有至少部分设置在其周围的一个或多个阻挡层（16），以保护有机半导体材料（14）免受通常导致相应器件的不可操作性的环境驱动的变化。如果需要，阻挡层可以由允许一些物质通过其的部分渗透性材料构成，从而在基本上预定的时间段之后使封装的有机半导体器件失效。乞丐（141）也可用于至少在一段时间内保护这种有机半导体材料。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式