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1. 发明授权

US6049463A Microelectronic assembly including an antenna element embedded within a polymeric card, and method for forming same 失效
标题翻译：包括嵌入聚合物卡内的天线元件的微电子组件及其形成方法
公开(公告)号：US6049463A
公开(公告)日：2000-04-11
申请号：US900403
申请日：1997-07-25
申请人： Grace M. O'Malley , Lillian C. Thompson , George Amos Carson , Iwona Turlik
发明人： Grace M. O'Malley , Lillian C. Thompson , George Amos Carson , Iwona Turlik
IPC分类号： G06K19/077 , H05K7/02
CPC分类号： G06K19/0775 , G06K19/07745 , G06K19/07749 , H01L2224/48091 , H01L2924/01078 , H01L2924/01322
摘要： A microelectronic assembly (10) includes a polymeric card (12) that includes a substantially planar major surface (18). An integrated circuit component (14) is embedded in the polymeric card (12) and has a first contact (20) and a second contact (22). An antenna element (16) is formed of a singular metallic strip and includes a first terminal (26) electrically connected to the first contact (20), a second terminal (28) electrically connected to the second contact (22), and a loop (30) intermediate the first terminal (26) and the second terminal (28). The first terminal (26) includes a first outer surface (32) and the second terminal (28) includes a second outer surface (34). The first outer surface (32) and the second outer surface (34) are exposed at the major surface (18) and are coextensive therewith. The loop (30) is embedded within the polymeric card (12) and spaced apart from the major surface (18).
摘要翻译：微电子组件（10）包括聚合卡（12），其包括基本上平面的主表面（18）。集成电路部件（14）嵌入在聚合物卡（12）中并且具有第一接触件（20）和第二接触件（22）。天线元件（16）由单个金属条形成，并且包括电连接到第一触点（20）的第一端子（26），与第二触点（22）电连接的第二端子（28）（30）在第一端子（26）和第二端子（28）之间。第一端子（26）包括第一外表面（32），第二端子（28）包括第二外表面（34）。第一外表面（32）和第二外表面（34）在主表面（18）处暴露并与其共同延伸。环（30）嵌入在聚合物卡（12）内并且与主表面（18）间隔开。

2. 发明授权

US5898215A Microelectronic assembly with connection to a buried electrical element, and method for forming same 失效
标题翻译：与埋地电气元件连接的微电子组件及其形成方法
公开(公告)号：US5898215A
公开(公告)日：1999-04-27
申请号：US766653
申请日：1996-12-16
申请人： Dennis Brian Miller , Grace M. O'Malley , Brian R. Kemper
发明人： Dennis Brian Miller , Grace M. O'Malley , Brian R. Kemper
IPC分类号： G06K19/077 , H01L21/60 , H01L23/498 , H05K1/18 , H05K3/28 , H05K3/32 , H05K3/34 , H01L23/02 , H01L23/48
CPC分类号： H01L24/80 , G06K19/07745 , G06K19/0775 , H01L23/49855 , H05K3/321 , H01L2224/45147 , H01L2224/48091 , H01L2924/01029 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H05K1/183 , H05K2201/0367 , H05K2201/09472 , H05K2201/10477 , H05K2201/10689 , H05K2201/10931 , H05K3/28 , H05K3/3426
摘要： A microelectronic assembly (10), such as a smart card, is formed by attaching a component subassembly (34) to a substrate (12). The substrate (12) includes a face (26) and defines a via (28) having a via opening (30) at the face (26). The substrate (12) further defines a component cavity (32) at the face (26) that is spaced apart from the via (28). An electrical element (14), such as a wound antenna, is disposed within the substrate (12) and includes a terminal (24) at the via (28). The component subassembly (34) is formed by mounting an integrated circuit component (16) onto a metallic lead (18). The integrated circuit component (16) is electrically connected to the metallic lead (18) by a wire lead (36). A protuberance (20) is connected to the metallic lead (18), preferably by forming a loop from a wire bond. A polymeric body (56) is formed about the component (16) and wire leads (36). The component subassembly (34) is superposed onto the substrate (12), and the component (16) is received in the component cavity (32). The metallic lead (18) is affixed to the face (26) and overlies the via opening (30). The protuberance (20) extends into the via (28) and contacts a conductive body (22) within the via (28). The conductive body (22) electrically connects the protuberance (20) and the terminal (24).
摘要翻译：诸如智能卡的微电子组件（10）通过将部件子组件（34）附接到基板（12）而形成。衬底（12）包括面（26）并且限定了在面（26）处具有通孔开口（30）的通孔（28）。基板（12）还在与通孔（28）间隔开的面（26）处限定一个部件空腔（32）。诸如伤口天线的电气元件（14）设置在衬底（12）内，并且在通孔（28）处包括端子（24）。组件子组件（34）通过将集成电路部件（16）安装到金属引线（18）上而形成。集成电路部件（16）通过引线（36）与金属引线（18）电连接。突起（20）连接到金属引线（18），优选地通过从引线接合形成环。围绕组件（16）和导线（36）形成聚合体（56）。组件子组件（34）重叠在基板（12）上，并且部件（16）被容纳在部件空腔（32）中。金属引线（18）固定在面（26）上并覆盖通孔（30）。突起（20）延伸到通孔（28）中并与通孔（28）内的导电体（22）接触。导电体（22）电连接突起（20）和端子（24）。

3. 发明授权

US5856912A Microelectronic assembly for connection to an embedded electrical element, and method for forming same 失效
标题翻译：用于连接到嵌入式电气元件的微电子组件及其形成方法
公开(公告)号：US5856912A
公开(公告)日：1999-01-05
申请号：US811561
申请日：1997-03-04
申请人： Dennis Brian Miller , Grace M. O'Malley , Brian R. Kemper
发明人： Dennis Brian Miller , Grace M. O'Malley , Brian R. Kemper
IPC分类号： G06K19/077 , H05K3/34 , H05K7/02 , G06K19/07
CPC分类号： G06K19/07743 , H05K3/3426 , H01L2224/45147 , H01L2224/48091 , H01L2924/181 , Y02P70/613
摘要： A microelectronic assembly (10) is formed by attaching a component subassembly (34) to a substrate (12). The substrate (12) includes a face (26) and defines a via (28) having a via opening (30) at the face (26). The substrate (12) further defines a component cavity (32) at the face (26). An electrical element (14) is disposed within the substrate (12) and includes a terminal (24) at the via (28). The component subassembly (34) is formed by mounting an integrated circuit component (16) onto a metallic lead (18). The integrated circuit component (16) is electrically connected to the metallic lead (18) by a wire lead (36). A leg (20) is formed by deforming a portion of the metallic lead (18). A polymeric body (56) is formed about the component (16) and wire leads (36). The component subassembly (34) is superposed onto the substrate (12), and the component (16) is received in the component cavity (32). The metallic lead (18) is affixed to the face (26). The leg (20) extends into the via (28) and contacts a conductive body (22) within the via (28). The conductive body (22) electrically connects the leg (20) and the terminal (24).
摘要翻译：微电子组件（10）通过将部件子组件（34）附接到衬底（12）而形成。衬底（12）包括面（26）并且限定了在面（26）处具有通孔开口（30）的通孔（28）。衬底（12）还在面（26）处限定一个部件空腔（32）。电气元件（14）设置在衬底（12）内，并且在通孔（28）处包括端子（24）。组件子组件（34）通过将集成电路部件（16）安装到金属引线（18）上而形成。集成电路部件（16）通过引线（36）与金属引线（18）电连接。腿部（20）通过使金属引线（18）的一部分变形来形成。围绕组件（16）和导线（36）形成聚合体（56）。组件子组件（34）重叠在基板（12）上，并且部件（16）被容纳在部件空腔（32）中。金属引线（18）固定在面（26）上。腿部（20）延伸到通孔（28）中并与通孔（28）内的导电体（22）接触。导电体（22）电连接腿部（20）和端子（24）。

4. 发明授权

US06200829B1 Microelectronic assembly with connection to a buried electrical element, and method for forming same 有权
标题翻译：与埋地电气元件连接的微电子组件及其形成方法
公开(公告)号：US06200829B1
公开(公告)日：2001-03-13
申请号：US09299158
申请日：1999-04-22
申请人： Dennis Brian Miller , Grace M. O'Malley , Brian R. Kemper
发明人： Dennis Brian Miller , Grace M. O'Malley , Brian R. Kemper
IPC分类号： H01L2144
CPC分类号： H01L24/80 , G06K19/07745 , G06K19/0775 , H01L23/49855 , H01L2224/48091 , H01L2924/01029 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H05K1/183 , H05K3/28 , H05K3/321 , H05K3/3426 , H05K2201/0367 , H05K2201/09472 , H05K2201/10477 , H05K2201/10689 , H05K2201/10931 , H01L2924/00014
摘要： A microelectronic assembly (10), such as a smart card, is formed by attaching a component subassembly (34) to a substrate (12). The substrate (12) includes a face (26) and defines a via (28) having a via opening (30) at the face (26). The substrate (12) further defines a component cavity (32) at the face (26) that is spaced apart from the via (28). An electrical element (14), such as a wound antenna, is disposed within the substrate (12) and includes a terminal (24) at the via (28). The component subassembly (34) is formed by mounting an integrated circuit component (16) onto a metallic lead (18). The integrated circuit component (16) is electrically connected to the metallic lead (18) by a wire lead (36). A protuberance (20) is connected to the metallic lead (18), preferably by forming a loop from a wire bond. A polymeric body (56) is formed about the component (16) and wire leads (36). The component subassembly (34) is superposed onto the substrate (12), and the component (16) is received in the component cavity (32). The metallic lead (18) is affixed to the face (26) and overlies the via opening (30). The protuberance (20) extends into the via (28) and contacts a conductive body (22) within the via (28). The conductive body (22) electrically connects the protuberance (20) and the terminal (24).
摘要翻译：诸如智能卡的微电子组件（10）通过将部件子组件（34）附接到基板（12）而形成。衬底（12）包括面（26）并且限定了在面（26）处具有通孔开口（30）的通孔（28）。基板（12）还在与通孔（28）间隔开的面（26）处限定一个部件空腔（32）。诸如伤口天线的电气元件（14）设置在衬底（12）内，并且在通孔（28）处包括端子（24）。组件子组件（34）通过将集成电路部件（16）安装到金属引线（18）上而形成。集成电路部件（16）通过引线（36）与金属引线（18）电连接。突起（20）连接到金属引线（18），优选地通过从引线接合形成环。围绕组件（16）和导线（36）形成聚合体（56）。组件子组件（34）重叠在基板（12）上，并且部件（16）被容纳在部件空腔（32）中。金属引线（18）固定在面（26）上并覆盖通孔（30）。突起（20）延伸到通孔（28）中并与通孔（28）内的导电体（22）接触。导电体（22）电连接突起（20）和端子（24）。

5. 发明授权

US5895976A Microelectronic assembly including polymeric reinforcement on an integrated circuit die, and method for forming same 失效
标题翻译：包括集成电路芯片上的聚合物增强的微电子组件及其形成方法
公开(公告)号：US5895976A
公开(公告)日：1999-04-20
申请号：US657216
申请日：1996-06-03
申请人： Michelle J. Morrell , Steven C. Machuga , Grace M. O'Malley , George A. Carson , Andrew Skipor , Wen Xu Zhou , Karl W. Wyatt
发明人： Michelle J. Morrell , Steven C. Machuga , Grace M. O'Malley , George A. Carson , Andrew Skipor , Wen Xu Zhou , Karl W. Wyatt
IPC分类号： H01L21/56 , H01L23/31 , H01L23/48
CPC分类号： H01L23/3157 , H01L21/563 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/01322 , H01L2924/09701
摘要： A microelectronic assembly (10) includes an integrated circuit die (12) mounted onto a substrate (14) by solder bump interconnections (32). The die (12) and the substrate (14) are spaced apart by a gap (30) that is filled with a polymeric encapsulant (16). The die (12) includes a die perimeter (24) and a face (27) facing away from the substrate (14). A polymeric reinforcement (18) is disposed onto the die face (27) to protect the die (12) and to reduce the effects of thermally induced stresses on the die (12) and the solder bump interconnections (32). The polymeric reinforcement (18) is spaced apart from the die perimeter (24) to maintain a desired peripheral fillet geometry of the encapsulant (16).
摘要翻译：微电子组件（10）包括通过焊料凸块互连（32）安装到衬底（14）上的集成电路管芯（12）。模具（12）和衬底（14）被填充有聚合物密封剂（16）的间隙（30）间隔开。模具（12）包括模具周边（24）和面向背离衬底（14）的面（27）。聚合物加强件（18）设置在模具表面（27）上以保护模具（12）并且减少热引起的应力对模具（12）和焊料凸块互连（32）的影响。聚合物加强件（18）与模具周边（24）间隔开，以保持密封剂（16）的期望的外圆角几何形状。

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