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1. 发明授权

US07062729B2 Method and system for obtaining a feasible integer solution from a half-integer solution in hierarchical circuit layout optimization 有权
标题翻译：在分层电路布局优化中从半整数解求解可行整数解的方法和系统
公开(公告)号：US07062729B2
公开(公告)日：2006-06-13
申请号：US10946677
申请日：2004-09-22
申请人： Michael S. Gray , Jason D. Hibbeler , Gustavo E. Tellez , Robert F. Walker
发明人： Michael S. Gray , Jason D. Hibbeler , Gustavo E. Tellez , Robert F. Walker
IPC分类号： G06F17/50
CPC分类号： G06F17/5068
摘要： A method (300) and system (500) for optimizing a circuit layout based on layout constraints (308) and objectives (312). The method includes solving a linear program so as to obtain a rational solution whose variables are either whole or half integer. The tight constraints and objectives involving variables whose solution are a half integer are reduced to a 2-SAT problem, which is analyzed to determine its satisfiability. If the 2-SAT problem is not satisfiable, one or more objectives are removed so as to make the 2-SAT problem satisfiable. Any half-integer results of the linear program are rounded according to the truth assignment that satisfies the 2-SAT problem. The rounded results are used to create the circuit layout.
摘要翻译：一种用于基于布局约束（308）和目标（312）优化电路布局的方法（300）和系统（500）。该方法包括求解线性程序，以获得变量为整数或整数的理性解。解决方案为半整数的变量的严格约束和目标简化为2-SAT问题，进行分析以确定其可满足性。如果2-SAT问题不可满足，则删除一个或多个目标，以使2-SAT问题满足。线性程序的任何半整数结果根据满足2-SAT问题的真值赋值进行舍入。圆形的结果用于创建电路布局。

2. 发明授权

US07117456B2 Circuit area minimization using scaling 失效
标题翻译：电路面积缩小使用缩放
公开(公告)号：US07117456B2
公开(公告)日：2006-10-03
申请号：US10707287
申请日：2003-12-03
申请人： Michael S. Gray , Kevin W. McCullen , Gustavo E. Tellez , Robert F. Walker
发明人： Michael S. Gray , Kevin W. McCullen , Gustavo E. Tellez , Robert F. Walker
IPC分类号： G06F17/50 , G06F9/45
CPC分类号： G06F17/5068
摘要： A method, system and program product that implements area minimization of a circuit design while respecting the explicit and implicit design constraints, in the form of ground rules and user intent. A longest path algorithm is used to generate a scaling factor. The scaling factor is used to reduce the size of the circuit design to the minimum legal size. The scaling may be followed by application of minpert analysis to correct any errors introduced by the scaling. The resulting design is shrunk (or expanded) with all elements shrinking (or growing) together by the same factor, and with the relative relationships of elements maintained. In addition, the invention is operational in the presence of a positive cycle, can be run with scaling that freezes the sizes of any structure or ground rule, and can be applied to technology migration.
摘要翻译：一种方法，系统和程序产品，其以基本规则和用户意图的形式实现电路设计的区域最小化，同时遵守显式和隐式设计约束。最长路径算法用于生成比例因子。缩放因子用于将电路设计的尺寸减小到最小法律尺寸。缩放可能之后是应用minpert分析来校正由缩放引入的任何错误。所产生的设计缩小（或扩展），所有元素都通过相同的因素一起缩减（或增长），并保持元素的相对关系。此外，本发明在存在正循环的情况下是可操作的，可以用缩放来运行，其结冰或冻结规则的尺寸，并且可以应用于技术迁移。

3. 发明授权

US07725864B2 Systematic yield in semiconductor manufacture 失效
标题翻译：半导体制造系统产量
公开(公告)号：US07725864B2
公开(公告)日：2010-05-25
申请号：US11854000
申请日：2007-09-12
申请人： Paul H. Bergeron , Jason D. Hibbeler , Gustavo E. Tellez
发明人： Paul H. Bergeron , Jason D. Hibbeler , Gustavo E. Tellez
IPC分类号： G06F17/50
CPC分类号： G06F17/5068
摘要： Three-dimensional structures are provided which improve manufacturing yield for certain structures in semiconductor devices. The three-dimensional structures take into account the interaction between an upper layer and a lower layer where the lower layer has a tendency to form a non-planar surface due to its design. Accordingly, design changes are performed to make structures more likely to function, either by forming a more planar surface on the lower layer or by compensating in the upper layer for the lack of planarity. The changes to improve manufacturing yield are made at the design stage rather than at the fabrication stage.
摘要翻译：提供三维结构，其提高半导体器件中某些结构的制造成品率。三维结构考虑到上层和下层之间的相互作用，其中下层由于其设计而具有形成非平面表面的倾向。因此，通过在下层上形成更平坦的表面或者通过在上层补偿缺乏平面性，进行设计变更以使结构更有可能起作用。提高制造产量的变化是在设计阶段而不是在制造阶段进行的。

4. 发明授权

US07657859B2 Method for IC wiring yield optimization, including wire widening during and after routing 失效
标题翻译： IC布线产量优化方法，包括布线期间和之后的线宽
公开(公告)号：US07657859B2
公开(公告)日：2010-02-02
申请号：US11275076
申请日：2005-12-08
申请人： John M. Cohn , Jason D. Hibbeler , Gustavo E. Tellez
发明人： John M. Cohn , Jason D. Hibbeler , Gustavo E. Tellez
IPC分类号： G06F17/50
CPC分类号： G06F17/5077
摘要： Disclosed are embodiments of a method, service, and computer program product for performing yield-aware IC routing for a design. The method performs an initial global routing which satisfies wiring congestion constraints. Next, the method performs wire spreading and wire widening on the global route, layer by layer, based on, for example, a quadratic congestion optimization. Following this, timing closure is performed on the global route using results of the wire spreading and wire widening. Post-routing wiring width and wire spreading adjustments are made using the critical area yield model. In addition, the method allows for the optimization of already-routed data.
摘要翻译：公开了用于为设计执行屈服感知IC路由的方法，服务和计算机程序产品的实施例。该方法执行满足布线拥塞约束的初始全局路由。接下来，该方法基于例如二次拥塞优化来逐层地在全局路由上执行线扩展和线拓宽。之后，使用电线扩展和线宽加工的结果，在全局路线上执行定时关闭。使用关键区域产量模型进行布线后布线宽度和布线调整。此外，该方法允许优化已经路由的数据。

5. 发明授权

US07337415B2 Systematic yield in semiconductor manufacture 有权
标题翻译：半导体制造系统产量
公开(公告)号：US07337415B2
公开(公告)日：2008-02-26
申请号：US10711978
申请日：2004-10-18
申请人： Paul H. Bergeron , Jason D. Hibbeler , Gustavo E. Tellez
发明人： Paul H. Bergeron , Jason D. Hibbeler , Gustavo E. Tellez
IPC分类号： G06F17/50
CPC分类号： G06F17/5068
摘要： Three-dimensional structures are provided which improve manufacturing yield for certain structures in semiconductor devices. The three-dimensional structures take into account the interaction between an upper layer and a lower layer where the lower layer has a tendency to form a non-planar surface due to its design. Accordingly, design changes are performed to make structures more likely to function, either by forming a more planar surface on the lower layer or by compensating in the upper layer for the lack of planarity. The changes to improve manufacturing yield are made at the design stage rather than at the fabrication stage.
摘要翻译：提供三维结构，其提高半导体器件中某些结构的制造成品率。三维结构考虑到上层和下层之间的相互作用，其中下层由于其设计而具有形成非平面表面的倾向。因此，通过在下层上形成更平坦的表面或者通过在上层补偿缺乏平面性，进行设计变更以使结构更有可能起作用。提高制造产量的变化是在设计阶段而不是在制造阶段进行的。

6. 发明申请

US20100023913A1 METHOD FOR IC WIRING YIELD OPTIMIZATION, INCLUDING WIRE WIDENING DURING AND AFTER ROUTING 有权
标题翻译： IC接线优化方法，包括在路由和之后的线路宽带化
公开(公告)号：US20100023913A1
公开(公告)日：2010-01-28
申请号：US12572297
申请日：2009-10-02
申请人： John M. Cohn , Jason D. Hibbeler , Gustavo E. Tellez
发明人： John M. Cohn , Jason D. Hibbeler , Gustavo E. Tellez
IPC分类号： G06F17/50
CPC分类号： G06F17/5077
摘要： Disclosed are embodiments of a method, service, and computer program product for performing yield-aware IC routing for a design. The method performs an initial global routing which satisfies wiring congestion constraints. Next, the method performs wire spreading and wire widening on the global route, layer by layer, based on, for example, a quadratic congestion optimization. Following this, timing closure is performed on the global route using results of the wire spreading and wire widening. Post-routing wiring width and wire spreading adjustments are made using the critical area yield model. In addition, the method allows for the optimization of already-routed data.
摘要翻译：公开了用于为设计执行屈服感知IC路由的方法，服务和计算机程序产品的实施例。该方法执行满足布线拥塞约束的初始全局路由。接下来，该方法基于例如二次拥塞优化来逐层地在全局路由上执行线扩展和线拓宽。之后，使用电线扩展和线宽加工的结果，在全局路线上执行定时关闭。使用关键区域产量模型进行布线后布线宽度和布线调整。此外，该方法允许优化已经路由的数据。

7. 发明授权

US06941528B2 Use of a layout-optimization tool to increase the yield and reliability of VLSI designs 失效
标题翻译：使用布局优化工具来提高VLSI设计的产出和可靠性
公开(公告)号：US06941528B2
公开(公告)日：2005-09-06
申请号：US10604962
申请日：2003-08-28
申请人： Robert J. Allen , Jason D. Hibbeler , Gustavo E. Tellez
发明人： Robert J. Allen , Jason D. Hibbeler , Gustavo E. Tellez
IPC分类号： G06F9/45 , G06F17/50
CPC分类号： G06F17/5068
摘要： The invention provides a method and structure for optimizing placement of redundant vias within an integrated circuit design. The invention first locates target vias by determining which vias do not have a redundant via. Then, the invention draws marker shapes on or adjacent to the target vias. The marker shapes are only drawn in a horizontal or vertical direction from each of the target vias. The invention simultaneously expands all of the marker shapes in the first direction to a predetermined length or until the marker shapes reach the limits of a ground rule. During the expanding, different marker shapes will be expanded to different lengths. The invention determines which of the marker shapes were expanded sufficiently to form a valid redundant via to produce a first set of potential redundant vias and the invention eliminates marker shapes that could not be expanded sufficiently to form a valid redundant via.
摘要翻译：本发明提供了一种用于优化集成电路设计中的冗余通孔的布置的方法和结构。本发明首先通过确定哪些通孔没有冗余通孔来定位目标通孔。然后，本发明在目标通孔上或附近绘制标记物形状。标记形状仅在每个目标通孔的水平或垂直方向绘制。本发明同时将第一方向上的所有标记形状扩展到预定长度，或者直到标记形状达到接地规则的极限。在扩展期间，不同的标记形状将被扩展到不同的长度。本发明确定哪些标记形状被充分扩展以形成有效的冗余通路以产生第一组潜在的冗余通孔，并且本发明消除了不能充分扩展以形成有效的冗余通路的标记形状。

8. 发明授权

US08230378B2 Method for IC wiring yield optimization, including wire widening during and after routing 有权
标题翻译： IC布线产量优化方法，包括布线期间和之后的线宽
公开(公告)号：US08230378B2
公开(公告)日：2012-07-24
申请号：US12572297
申请日：2009-10-02
申请人： John M. Cohn , Jason D. Hibbeler , Gustavo E. Tellez
发明人： John M. Cohn , Jason D. Hibbeler , Gustavo E. Tellez
IPC分类号： G06F17/50
CPC分类号： G06F17/5077
摘要： Disclosed are embodiments of a method, service, and computer program product for performing yield-aware IC routing for a design. The method performs an initial global routing which satisfies wiring congestion constraints. Next, the method performs wire spreading and wire widening on the global route, layer by layer, based on, for example, a quadratic congestion optimization. Following this, timing closure is performed on the global route using results of the wire spreading and wire widening. Post-routing wiring width and wire spreading adjustments are made using the critical area yield model. In addition, the method allows for the optimization of already-routed data.
摘要翻译：公开了用于为设计执行屈服感知IC路由的方法，服务和计算机程序产品的实施例。该方法执行满足布线拥塞约束的初始全局路由。接下来，该方法基于例如二次拥塞优化来逐层地在全局路由上执行线扩展和线拓宽。之后，使用电线扩展和线宽加工的结果，在全局路线上执行定时关闭。使用关键区域产量模型进行布线后布线宽度和布线调整。此外，该方法允许优化已经路由的数据。

9. 发明授权

US07721240B2 Systematic yield in semiconductor manufacture 失效
标题翻译：半导体制造系统产量
公开(公告)号：US07721240B2
公开(公告)日：2010-05-18
申请号：US11966135
申请日：2007-12-28
申请人： Paul H Bergeron , Jason D. Hibbeler , Gustavo E. Tellez
发明人： Paul H Bergeron , Jason D. Hibbeler , Gustavo E. Tellez
IPC分类号： G06F17/50
CPC分类号： G06F17/5068
摘要： Three-dimensional structures are provided which improve manufacturing yield for certain structures in semiconductor devices. The three-dimensional structures take into account the interaction between an upper layer and a lower layer where the lower layer has a tendency to form a non-planar surface due to its design. Accordingly, structures built on a layer above the lower layer are formed on a more planar surface and thus are more likely to function properly. The changes to improve manufacturing yield are made at the design stage rather than at the fabrication stage.
摘要翻译：提供三维结构，其提高半导体器件中某些结构的制造成品率。三维结构考虑到上层和下层之间的相互作用，其中下层由于其设计而具有形成非平面表面的倾向。因此，构建在下层上方的层上的结构形成在更平坦的表面上，因此更有可能正常地起作用。提高制造产量的变化是在设计阶段而不是在制造阶段进行的。

10. 发明授权

US08347257B2 Detailed routability by cell placement 有权
标题翻译：细胞放置的详细路线
公开(公告)号：US08347257B2
公开(公告)日：2013-01-01
申请号：US12796501
申请日：2010-06-08
申请人： Charles J. Alpert , Andrew D. Huber , Zhuo Li , Gi-Joon Nam , Shyam Ramji , Jarrod A. Roy , Taraneh E. Taghavi , Gustavo E. Tellez , Paul G. Villarrubia , Natarajan Viswanathan
发明人： Charles J. Alpert , Andrew D. Huber , Zhuo Li , Gi-Joon Nam , Shyam Ramji , Jarrod A. Roy , Taraneh E. Taghavi , Gustavo E. Tellez , Paul G. Villarrubia , Natarajan Viswanathan
IPC分类号： G06F17/50
CPC分类号： G06F17/5072
摘要： A computer implemented method, data processing system, and computer program product for reworking a plurality of cells initially placed in a circuit design. An expander allocates cells to tiles, wherein some tiles have cells. The expander determines a high detailed routing cost tile class, wherein the high detailed routing cost tile class is a class of tiles that are high detailed routing cost tiles. The expander selects a cell within a tile of the high detailed routing cost tile class to form a selected cell and a selected tile. The expander places an expanded bounding box around the selected cell, wherein the bounding box extends to at least one tile adjacent the selected tile. The expander expands the selected cell within the bounding box to form a modified design, determines an aggregate routing cost among other steps, and affirms the modified design for further processing.
摘要翻译：一种计算机实现的方法，数据处理系统和用于重新设计最初放置在电路设计中的多个单元的计算机程序产品。扩展器将单元格分配给图块，其中某些图块具有单元格。扩展器确定高详细路由成本瓦片类，其中高详细路由成本瓦片类是作为高详细路由成本瓦片的瓦片类。扩展器选择高详细路由代价块类别的块内的单元，以形成所选择的单元和所选择的块。扩展器将扩展的边界框放置在所选择的单元周围，其中边界框延伸到与所选择的瓦片相邻的至少一个瓦片。扩展器在边界框内扩展所选单元格以形成修改的设计，确定其他步骤之间的汇总路由成本，并确认修改后的设计以进行进一步处理。

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