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    • 5. 发明授权
    • Moisture-curable hot melt silicone pressure-sensitive adhesives
    • 水溶性热熔硅胶压敏粘合剂
    • US5508360A
    • 1996-04-16
    • US414465
    • 1995-03-31
    • Martin E. CifuentesMichael R. StrongBernard VanWertMichael A. LutzRandall G. Schmidt
    • Martin E. CifuentesMichael R. StrongBernard VanWertMichael A. LutzRandall G. Schmidt
    • C09J183/08C09J183/00C09J183/04C09J183/14C08F283/12
    • C09J183/04C09J183/14
    • The present invention relates to a silicone pressure-sensitive adhesive composition which cure upon exposure to ambient moisture. The moisture-curable silicone pressure-sensitive adhesive composition of the instant invention comprise:(A) an organopolysiloxane resin containing curing radicals of the formula --SiY.sub.2 ZNY'ZSiR.sup.1.sub.x Y".sub.3-x wherein R.sup.1 is a monovalent hydrocarbon radical, each Z is a divalent linking group, each Y is independently selected from the group consisting of a monovalent organic radical, an enoloxy radical, an alkoxy radical, and an oximo radical; Y' is selected from the group consisting of a monovalent organic radical, a hydrogen atom, and --ZSiR.sup.1.sub.x Y".sub.3-x ; Y" is selected from the group consisting of an enoloxy radical, an alkoxy radical, and an oximo radical; and the subscript x has a value of 0 or 1; (B) a diorganopolysiloxane polymer, each terminal group thereof containing at least one silicon-bonded hydrolyzable functional radicals selected from the group consisting of hydroxyl radicals, alkoxy radicals having 1 to 4 carbon atoms, ketoxime radicals, enoloxy radicals, aminoxy radicals, acetamido radicals, N-methylacetamido radicals and acetoxy radicals; said polymer having a viscosity at 25.degree. C. of 20 to
    • 本发明涉及在暴露于环境水分时固化的硅氧烷压敏粘合剂组合物。 本发明的湿气固化型硅氧烷粘合剂组合物包含:(A)含有式-SiY 2 ZNY'ZSiR1 x Y'3-x固化基团的有机聚硅氧烷树脂,其中R 1为单价烃基,Z为二价 每个Y独立地选自一价有机基团,烯氧基,烷氧基和肟基; Y'选自单价有机基团,氢原子和-ZSiR1xY'3-x; Y“选自烯氧基,烷氧基和肟基; 下标x的值为0或1; (B)二有机聚硅氧烷聚合物,其每个末端基团含有至少一个选自羟基,具有1至4个碳原子的烷氧基,酮肟基,烯氧基,氨氧基,乙酰氨基的硅键合的可水解官能团 ,N-甲基乙酰氨基和乙酰氧基; 所述聚合物在25℃下的粘度为20至<100,000mm 2 / s,所述树脂与所述聚合物的重量比在5:95至90:10的范围内; (C)任选的足以加速所述组合物固化的催化剂; (D)任选的式R 24 -ySiXy的硅烷或其低聚反应产物,其中R 2选自烃基和具有1至6个碳原子的取代烃基,X是可水解基团,y是2 到4; 和(E)任选的填料。
    • 6. 发明授权
    • Moisture-curable hot melt silicone pressure-sensitive adhesives
    • 水溶性热熔硅胶压敏粘合剂
    • US5473026A
    • 1995-12-05
    • US262791
    • 1994-06-20
    • Michael R. StrongMartin E. CifuentesBernard VanWertWilliam J. Schoenherr
    • Michael R. StrongMartin E. CifuentesBernard VanWertWilliam J. Schoenherr
    • C09J183/00C09J183/04C09J183/14C08L83/06
    • C09J183/04C09J183/14
    • A moisture-curable silicone hot melt pressure sensitive adhesive composition is disclosed, said composition comprising: (A) a solid alkoxy functional organopolysiloxane resin containing curing radicals of the formula --ZSiR.sup.1.sub.x (OR.sup.2).sub.3-x ; wherein R.sup.1 is a monovalent hydrocarbon radical, R.sup.2 is selected from the group consisting of a alkyl radical and alkoxyalkyl radical, Z is a divalent linking radical, and the subscript x has a value of 0 or 1; (B) a diorganopolysiloxane polymer, each terminal group thereof containing at least one silicon-bonded hydrolyzable functional radical selected from the group consisting of alkoxy radicals having 1 to 4 carbon atoms, ketoxime radicals, aminoxy radicals, acetamido radicals, N-methylacetamido radicals and acetoxy radicals; said polymer having a viscosity at 25.degree. C. of 20 to
    • 公开了一种可湿气固化的硅氧烷热熔压敏粘合剂组合物,所述组合物包含:(A)含有式-ZSiR1x(OR2)3-x固化基团的固体烷氧基官能的有机聚硅氧烷树脂; 其中R1是一价烃基,R2选自烷基和烷氧基烷基,Z是二价连接基团,下标x具有0或1的值; (B)二有机聚硅氧烷聚合物,其每个末端基团含有至少一个选自具有1至4个碳原子的烷氧基,酮肟基,氨氧基,乙酰氨基,N-甲基乙酰胺基的硅键合的可水解的官能团, 乙酰氧基; 所述聚合物在25℃下的粘度为20至<100,000mm 2 / s,所述树脂与所述聚合物的重量比在40:60至80:20的范围内; 和(C)足够的催化剂以加速所述组合物的固化; 所述组合物在室温下是基本上无溶剂的非坍落度固体,其在暴露于水分时可固化成基本上非粘性的弹性体。