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1. 发明授权

US07759778B2 Leaded semiconductor power module with direct bonding and double sided cooling 有权
标题翻译：带半导体的半导体功率模块，具有直接接合和双面冷却功能
公开(公告)号：US07759778B2
公开(公告)日：2010-07-20
申请号：US12283647
申请日：2008-09-15
申请人： Michael J. Lowry , Eric A. Brauer , Thomas A. Degenkolb , Victor C. M. Wong
发明人： Michael J. Lowry , Eric A. Brauer , Thomas A. Degenkolb , Victor C. M. Wong
IPC分类号： H01L23/495
CPC分类号： H01L23/49562 , H01L23/4334 , H01L23/49844 , H01L2924/0002 , H01L2924/00
摘要： A leaded semiconductor power module includes a first heatsink, an electrically insulated substrate thermally coupled to the first heatsink, one or more semiconductor chips, a leadframe substrate, and a second heatsink thermally coupled to the leadframe substrate, the assembly being overmolded with an encapsulant to expose the first heatsink, the second heatsink and peripheral terminals of the leadframe substrate. The semiconductor chips are electrically and structurally coupled to both the insulated substrate and the leadframe substrate, and conductive spacers electrically and structurally couple the insulated substrate to the leadframe substrate.
摘要翻译：引线半导体功率模块包括第一散热器，热耦合到第一散热器的电绝缘衬底，一个或多个半导体芯片，引线框架衬底和热耦合到引线框架衬底的第二散热器，该组件被封装剂包覆成型暴露引线框架基板的第一散热器，第二散热器和外围端子。半导体芯片在电气和结构上耦合到绝缘基板和引线框架基板两者，并且导电间隔物电连接和结构地将绝缘基板耦合到引线框架基板。

2. 发明申请

US20100065950A1 Leaded semiconductor power module with direct bonding and double sided cooling 有权
公开(公告)号：US20100065950A1
公开(公告)日：2010-03-18
申请号：US12283647
申请日：2008-09-15
申请人： Michael J. Lowry , Eric A. Brauer , Thomas A. Degenkolb , Victor C.M. Wong
发明人： Michael J. Lowry , Eric A. Brauer , Thomas A. Degenkolb , Victor C.M. Wong
IPC分类号： H01L23/34
CPC分类号： H01L23/49562 , H01L23/4334 , H01L23/49844 , H01L2924/0002 , H01L2924/00
摘要： A leaded semiconductor power module includes a first heatsink, an electrically insulated substrate thermally coupled to the first heatsink, one or more semiconductor chips, a leadframe substrate, and a second heatsink thermally coupled to the leadframe substrate, the assembly being overmolded with an encapsulant to expose the first heatsink, the second heatsink and peripheral terminals of the leadframe substrate. The semiconductor chips are electrically and structurally coupled to both the insulated substrate and the leadframe substrate, and conductive spacers electrically and structurally couple the insulated substrate to the leadframe substrate.

3. 发明授权

US08094454B2 Immersion cooling apparatus for a power semiconductor device 有权
标题翻译：一种用于功率半导体器件的浸入式冷却装置
公开(公告)号：US08094454B2
公开(公告)日：2012-01-10
申请号：US12624093
申请日：2009-11-23
申请人： Michael J. Lowry
发明人： Michael J. Lowry
IPC分类号： H05K7/20 , H01L23/473
CPC分类号： H01L23/433 , H01L23/44 , H01L23/473 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： An immersion cooling apparatus includes a multi-terminal thermally conductive module that supports and encloses a power semiconductor device and a housing defining a flow-through chamber in which the thermally conductive module is mounted and through which liquid coolant is circulated. The thermally conductive module has first and second oppositely disposed connector headers housing terminal pins or blades electrically coupled to the semiconductor device, and the connector headers protrude through openings in oppositely disposed sidewalls of the housing so that the portion of the thermally conductive module between the connector headers is suspended in the chamber and immersed in the circulating coolant. The thermally conductive module is sealed against the housing sidewalls around the openings, and one of the sidewalls is removable to facilitate installation of the thermally conductive module in the housing or its subsequent removal.
摘要翻译：浸入式冷却装置包括多端子导热模块，其支撑和封闭功率半导体器件，以及限定流通室的壳体，其中安装有导热模块并通过该液体冷却剂循环。导热模块具有第一和第二相对设置的连接器插头，其容纳端子销或叶片，电连接到半导体器件，并且连接器集管突出穿过壳体的相对设置的侧壁中的开口，使得导热模块的部分在连接器集管悬挂在室内并浸入循环冷却液中。导热模块围绕开口密封住壳体侧壁，并且其中一个侧壁是可去除的，以便于将热传导模块安装在壳体中或随后的移除中。

4. 发明授权

US07808788B2 Multi-layer electrically isolated thermal conduction structure for a circuit board assembly 失效
标题翻译：用于电路板组件的多层电隔离导热结构
公开(公告)号：US07808788B2
公开(公告)日：2010-10-05
申请号：US11824019
申请日：2007-06-29
申请人： Kevin M. Gertiser , Richard A. Ripple , Michael J. Lowry , Karl A. Schten , Ronald M. Shearer , Jim M. Spall
发明人： Kevin M. Gertiser , Richard A. Ripple , Michael J. Lowry , Karl A. Schten , Ronald M. Shearer , Jim M. Spall
IPC分类号： H05K7/20 , H01L23/34 , H01L23/495 , F28F7/00
CPC分类号： H05K7/205 , H05K1/0206 , H05K1/0207 , H05K3/429 , H05K2201/09309
摘要： A thermal conduction structure is integrated into a multi-layer circuit board to thermally couple a power electronic device to a heatsink while electrically isolating the power electronic device from the heatsink. The thermal conduction structure includes a stack of alternatingly insulative and conductive layers, a first set of vertical vias that thermally and electrically join the power electronic device to a first set of conductive layers, and a second set of vertical vias that thermally and electrically join the heatsink to a second set of conductive layers that are interleaved with the first set of conductive layers.
摘要翻译：将热传导结构集成到多层电路板中，以将电力电子设备热耦合到散热器，同时将电力电子设备与散热器电隔离。热传导结构包括交替绝缘和导电层的堆叠，将电力电子器件热和电连接到第一组导电层的第一组垂直通孔，以及第二组垂直通孔，其热和电连接散热到与第一组导电层交错的第二组导电层。

5. 发明申请

US20090002950A1 Multi-layer electrically isolated thermal conduction structure for a circuit board assembly 失效
标题翻译：用于电路板组件的多层电隔离导热结构
公开(公告)号：US20090002950A1
公开(公告)日：2009-01-01
申请号：US11824019
申请日：2007-06-29
申请人： Kevin M. Gertiser , Richard A. Ripple , Michael J. Lowry , Karl A. Schten , Ronald M. Shearer , Jim M. Spall
发明人： Kevin M. Gertiser , Richard A. Ripple , Michael J. Lowry , Karl A. Schten , Ronald M. Shearer , Jim M. Spall
IPC分类号： H05K7/20
CPC分类号： H05K7/205 , H05K1/0206 , H05K1/0207 , H05K3/429 , H05K2201/09309
摘要： A thermal conduction structure is integrated into a multi-layer circuit board to thermally couple a power electronic device to a heatsink while electrically isolating the power electronic device from the heatsink. The thermal conduction structure includes a stack of alternatingly insulative and conductive layers, a first set of vertical vias that thermally and electrically join the power electronic device to a first set of conductive layers, and a second set of vertical vias that thermally and electrically join the heatsink to a second set of conductive layers that are interleaved with the first set of conductive layers.
摘要翻译：将热传导结构集成到多层电路板中，以将电力电子设备热耦合到散热器，同时将电力电子设备与散热器电隔离。热传导结构包括交替绝缘和导电层的堆叠，将电力电子器件热和电连接到第一组导电层的第一组垂直通孔，以及第二组垂直通孔，其热和电连接散热到与第一组导电层交错的第二组导电层。

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