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1. 发明授权

US07808788B2 Multi-layer electrically isolated thermal conduction structure for a circuit board assembly 失效
标题翻译：用于电路板组件的多层电隔离导热结构
公开(公告)号：US07808788B2
公开(公告)日：2010-10-05
申请号：US11824019
申请日：2007-06-29
申请人： Kevin M. Gertiser , Richard A. Ripple , Michael J. Lowry , Karl A. Schten , Ronald M. Shearer , Jim M. Spall
发明人： Kevin M. Gertiser , Richard A. Ripple , Michael J. Lowry , Karl A. Schten , Ronald M. Shearer , Jim M. Spall
IPC分类号： H05K7/20 , H01L23/34 , H01L23/495 , F28F7/00
CPC分类号： H05K7/205 , H05K1/0206 , H05K1/0207 , H05K3/429 , H05K2201/09309
摘要： A thermal conduction structure is integrated into a multi-layer circuit board to thermally couple a power electronic device to a heatsink while electrically isolating the power electronic device from the heatsink. The thermal conduction structure includes a stack of alternatingly insulative and conductive layers, a first set of vertical vias that thermally and electrically join the power electronic device to a first set of conductive layers, and a second set of vertical vias that thermally and electrically join the heatsink to a second set of conductive layers that are interleaved with the first set of conductive layers.
摘要翻译：将热传导结构集成到多层电路板中，以将电力电子设备热耦合到散热器，同时将电力电子设备与散热器电隔离。热传导结构包括交替绝缘和导电层的堆叠，将电力电子器件热和电连接到第一组导电层的第一组垂直通孔，以及第二组垂直通孔，其热和电连接散热到与第一组导电层交错的第二组导电层。

2. 发明申请

US20090002950A1 Multi-layer electrically isolated thermal conduction structure for a circuit board assembly 失效
标题翻译：用于电路板组件的多层电隔离导热结构
公开(公告)号：US20090002950A1
公开(公告)日：2009-01-01
申请号：US11824019
申请日：2007-06-29
申请人： Kevin M. Gertiser , Richard A. Ripple , Michael J. Lowry , Karl A. Schten , Ronald M. Shearer , Jim M. Spall
发明人： Kevin M. Gertiser , Richard A. Ripple , Michael J. Lowry , Karl A. Schten , Ronald M. Shearer , Jim M. Spall
IPC分类号： H05K7/20
CPC分类号： H05K7/205 , H05K1/0206 , H05K1/0207 , H05K3/429 , H05K2201/09309
摘要： A thermal conduction structure is integrated into a multi-layer circuit board to thermally couple a power electronic device to a heatsink while electrically isolating the power electronic device from the heatsink. The thermal conduction structure includes a stack of alternatingly insulative and conductive layers, a first set of vertical vias that thermally and electrically join the power electronic device to a first set of conductive layers, and a second set of vertical vias that thermally and electrically join the heatsink to a second set of conductive layers that are interleaved with the first set of conductive layers.
摘要翻译：将热传导结构集成到多层电路板中，以将电力电子设备热耦合到散热器，同时将电力电子设备与散热器电隔离。热传导结构包括交替绝缘和导电层的堆叠，将电力电子器件热和电连接到第一组导电层的第一组垂直通孔，以及第二组垂直通孔，其热和电连接散热到与第一组导电层交错的第二组导电层。

3. 发明申请

US20090091889A1 Power electronic module having improved heat dissipation capability 审中-公开
标题翻译：功率电子模块具有改善的散热能力
公开(公告)号：US20090091889A1
公开(公告)日：2009-04-09
申请号：US11973518
申请日：2007-10-09
申请人： Todd P. Oman , Kevin M. Gertiser , Ronald M. Shearer
发明人： Todd P. Oman , Kevin M. Gertiser , Ronald M. Shearer
IPC分类号： H05K7/20
CPC分类号： H05K1/18 , H05K1/0209 , H05K2201/0949 , H05K2201/09781 , H05K2201/10166 , H05K2201/10189 , H05K2201/10446 , H05K2201/10515 , H05K2201/10522
摘要： A power electronic module includes heat generating power electronic devices mounted on a circuit board within a connector outline circumscribing circuit board through-holes for receiving pin terminals of a connector assembly. The power electronic devices are thermally and electrically coupled to the circuit board through-holes and connector pin terminals to dissipate heat generated by the power electronic devices.
摘要翻译：电力电子模块包括安装在连接器轮廓外接电路板通孔内的电路板上的发热电力电子装置，用于接收连接器组件的针端子。电力电子设备被热和电耦合到电路板通孔和连接器引脚端子，以散发由电力电子设备产生的热量。

4. 发明授权

US06831471B2 Configurable interface circuit for exhaust gas oxygen sensors 有权
标题翻译：可配置的废气氧传感器接口电路
公开(公告)号：US06831471B2
公开(公告)日：2004-12-14
申请号：US10294380
申请日：2002-11-14
申请人： Kevin M. Gertiser , James A. Kinley , Ashraf K. Kamel , Gregory J. Manlove
发明人： Kevin M. Gertiser , James A. Kinley , Ashraf K. Kamel , Gregory J. Manlove
IPC分类号： G01R2708
CPC分类号： F02D41/1441 , F02D41/1479 , F02D41/1495 , F02D41/1496 , F02D41/2474 , F02D2041/2075 , F02D2041/2089 , F02D2041/2093 , F02D2200/503
摘要： An oxygen sensor interface circuit is configurable on the fly by an electronic controller such as an engine controller to support oxygen sensors having unique interface requirements, to reliably identify various oxygen sensor faults, and to enable rapid detection of a warmed up sensor. The interface circuit is configurable in a first respect to enable operation with any of a number of different sensors, and in a second respect to enable more reliable fault detection, including measurement of leakage to ground or battery.
摘要翻译：氧传感器接口电路可以由诸如发动机控制器的电子控制器在飞行中配置，以支持具有独特接口要求的氧传感器，以可靠地识别各种氧传感器故障，并且能够快速检测加热传感器。接口电路在第一方面是可配置的，以使得能够与多个不同传感器中的任何一个进行操作，并且在第二方面能够实现更可靠的故障检测，包括测量对接地或电池的泄漏。

5. 发明授权

US07352585B2 Flip chip heat sink package and method 有权
标题翻译：倒装芯片散热片封装及方法
公开(公告)号：US07352585B2
公开(公告)日：2008-04-01
申请号：US11583316
申请日：2006-10-19
申请人： Larry M Mandel , Kevin M. Gertiser , Suresh K. Chengalva , Dwadasi H. Sarma , David W. Zimmerman
发明人： Larry M Mandel , Kevin M. Gertiser , Suresh K. Chengalva , Dwadasi H. Sarma , David W. Zimmerman
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L21/4878 , H01L21/4882 , H01L21/563 , H01L23/3675 , H01L23/3677 , H01L23/42 , H01L2224/16 , H01L2224/73204 , H01L2224/73253 , Y10T29/49144
摘要： An electronic package having enhanced heat dissipation is provided exhibiting dual conductive heat paths in opposing directions. The package includes a substrate having electrical conductors thereon and a flip chip mounted to the substrate. The flip chip has a first surface, solder bumps on the first surface, and a second surface oppositely disposed from the first surface. The flip chip is mounted to the substrate such that the solder bumps are registered with the conductors on the substrate. The package further includes a stamped metal heat sink in heat transfer relationship with the second surface of the flip chip. The heat sink includes a cavity formed adjacent to the flip chip containing a thermally conductive material.
摘要翻译：提供具有增强的散热的电子封装，其呈现出相反方向上的双重传导热路径。封装包括其上具有电导体的基板和安装到基板的倒装芯片。倒装芯片具有第一表面，第一表面上的焊料凸块和与第一表面相对设置的第二表面。倒装芯片安装到基板上，使得焊料凸块与基板上的导体对准。该封装还包括与倒装芯片的第二表面传热关系的冲压金属散热器。散热器包括与包含导热材料的倒装芯片相邻形成的空腔。

6. 发明申请

US20080053700A1 Sealed electronic component 审中-公开
标题翻译：密封电子元件
公开(公告)号：US20080053700A1
公开(公告)日：2008-03-06
申请号：US11516195
申请日：2006-09-06
申请人： Kurt F. O'Connor , Daniel A. Lawlyes , David A. Laudick , Kevin M. Gertiser
发明人： Kurt F. O'Connor , Daniel A. Lawlyes , David A. Laudick , Kevin M. Gertiser
IPC分类号： H01L23/02
CPC分类号： H05K5/066 , B23K20/122 , B23K2101/42 , H01L23/041 , H01L23/10 , H01L2924/0002 , H05K5/0052 , H01L2924/00
摘要： An assembly for a sealed electronic component includes at least one electronic device mounted on a substrate, and a metal enclosure comprising first and second housing components that are welded together to define a sealed enclosure. The resulting assembly provides a reliable seal that eliminates the need for mechanical fasteners, adhesives, and equipment for applying and curing adhesives.
摘要翻译：用于密封电子部件的组件包括安装在基板上的至少一个电子装置，以及包括焊接在一起以限定密封外壳的第一和第二壳体部件的金属外壳。所得组件提供可靠的密封，消除了对于粘合剂的施加和固化的机械紧固件，粘合剂和设备的需要。

7. 发明授权

US07256615B2 Configurable high/low side driver using a low-side FET pre-driver 有权
标题翻译：可配置的高/低侧驱动器使用低端FET预驱动器
公开(公告)号：US07256615B2
公开(公告)日：2007-08-14
申请号：US11105841
申请日：2005-04-14
申请人： Balakrishnan Nair Vijayakumaran Nair , Kevin M. Gertiser
发明人： Balakrishnan Nair Vijayakumaran Nair , Kevin M. Gertiser
IPC分类号： H03K19/0175
CPC分类号： H03K17/18 , H03K17/063 , H03K17/0822 , H03K17/6877 , H03K2217/0063
摘要： A high-side driver circuit for driving a load, including a low-side driver IC having a drive output and a feedback input, a first transistor coupled to the drive output, and a second transistor coupled between a power source and the load. The second transistor is configured to enter an “OFF” state when the first transistor is driven into an “OFF” state by the drive output, and to enter an “ON” state when the first transistor is driven into an “ON” state by the drive output.
摘要翻译：用于驱动负载的高侧驱动器电路，包括具有驱动输出和反馈输入的低侧驱动器IC，耦合到驱动输出的第一晶体管，以及耦合在电源和负载之间的第二晶体管。第二晶体管被配置为当第一晶体管被驱动输出驱动到“关”状态时进入“关”状态，并且当第一晶体管被驱动到“导通”状态时，第二晶体管进入“接通”状态驱动器输出。

8. 发明授权

US07532010B2 Sensing circuit and method for diagnosing open and short circuit conditions of a sensor 有权
标题翻译：用于诊断传感器的开路和短路状况的感应电路和方法
公开(公告)号：US07532010B2
公开(公告)日：2009-05-12
申请号：US11527742
申请日：2006-09-25
申请人： Ashraf K. Kamel , Robert W Koseluk , Kevin M. Gertiser , Larry R. Hach
发明人： Ashraf K. Kamel , Robert W Koseluk , Kevin M. Gertiser , Larry R. Hach
IPC分类号： G01R31/00 , G01R31/08
CPC分类号： G01L23/225 , G01D3/08 , G01R31/2829
摘要： A sensing circuit for detecting open and short circuit conditions in sensors is provided. The sensing circuit includes switching circuitry, a voltage supply, a test capacitor, and an operational amplifier. The switching circuitry is electrically coupled to the voltage supply, test capacitor, operational amplifier, and a sensor. The sensing circuit is configured to provide for a normal operating mode in which the sensing circuit provides an output indicative of a voltage across the sensor, and a charging mode in which the test capacitor is coupled to the sensor and operational amplifier and charged to a steady state, and in which the output of the operational amplifier is a function of the test capacitor capacitance and the capacitance of the sensor. A method for detecting open and short circuit conditions in sensors is also provided.
摘要翻译：提供了一种用于检测传感器中的开路和短路状况的感测电路。感测电路包括开关电路，电压源，测试电容器和运算放大器。开关电路电耦合到电压源，测试电容器，运算放大器和传感器。感测电路被配置为提供正常操作模式，其中感测电路提供指示传感器两端的电压的输出，以及充电模式，其中测试电容器耦合到传感器和运算放大器并且被充电到稳定的状态，并且其中运算放大器的输出是测试电容器电容和传感器的电容的函数。还提供了用于检测传感器中的开路和短路状况的方法。

9. 发明授权

US4509484A Closed loop lean air/fuel ratio controller 失效
标题翻译：闭环稀空燃比控制器
公开(公告)号：US4509484A
公开(公告)日：1985-04-09
申请号：US494938
申请日：1983-05-16
申请人： Kevin M. Gertiser
发明人： Kevin M. Gertiser
IPC分类号： F02D41/14 , F02M7/10
CPC分类号： F02D41/1498 , F02D2200/1015
摘要： The air/fuel ratio of the mixture supplied to an internal combustion engine is controlled to a lean limit resulting in a maximum engine operating roughness at one level during off-idle operation and a higher level during idle conditions. Roughness is detected by comparing the minimum engine speed attained during each cylinder combustion cycle to the average of the minimum speeds.
摘要翻译：供给到内燃机的混合物的空燃比被控制为稀薄极限，导致在怠速运转期间的一个级别的最大发动机工作粗糙度，以及空转状态下的较高水平。通过比较在每个气缸燃烧循环期间获得的最小发动机转速与最小速度的平均值来检测粗糙度。

10. 发明授权

US07414476B2 Sensor interface circuitry having adjustable gain and Q, and method for adjusting sensor interface circuitry gain and Q 有权
标题翻译：具有可调节增益和Q的传感器接口电路，以及用于调节传感器接口电路增益和Q的方法
公开(公告)号：US07414476B2
公开(公告)日：2008-08-19
申请号：US11588136
申请日：2006-10-26
申请人： Ashraf K. Kamel , Robert W Koseluk , Kevin M. Gertiser , Larry R. Hach
发明人： Ashraf K. Kamel , Robert W Koseluk , Kevin M. Gertiser , Larry R. Hach
IPC分类号： H03F3/30
CPC分类号： G01L23/225
摘要： A sensor interface filter having adjustable gain and Q is provided. The sensor interface includes a first operational amplifier coupled to gain circuitry, a gain stage, and a resistor. The gain circuitry and gain stage are electrically coupled to each other. The gain stage includes a gain stage switch, and is coupled to control circuitry. The control circuitry controls the state of the gain stage switch to vary the number of feedback current paths providing feedback to the inverting input of the first operational amplifier, altering the gain provided by the first operational amplifier. The sensor interface further includes a second operational amplifier coupled to filter circuitry and feedback switches. The feedback switches are coupled to the control circuitry, which controls the state of the feedback switches to vary the gain provided by the second operational amplifier and the filter Q of the sensor interface. A method is also provided.
摘要翻译：提供了具有可调节增益和Q的传感器接口滤波器。传感器接口包括耦合到增益电路，增益级和电阻器的第一运算放大器。增益电路和增益级彼此电耦合。增益级包括增益级开关，并且耦合到控制电路。控制电路控制增益级开关的状态，以改变向第一运算放大器的反相输入端提供反馈的反馈电流路径的数量，改变由第一运算放大器提供的增益。传感器接口还包括耦合到滤波器电路和反馈开关的第二运算放大器。反馈开关耦合到控制电路，控制电路控制反馈开关的状态以改变由第二运算放大器和传感器接口的滤波器Q提供的增益。还提供了一种方法。

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