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    • 5. 发明授权
    • VCSEL array optical subassembly module with alignment mechanism
    • 具有对准机构的VCSEL阵列光学子组件模块
    • US06736553B1
    • 2004-05-18
    • US10044390
    • 2002-01-11
    • Mark StiehlMichael L. TartagliaCarl EmbryMichael DudekTimothy BingamanAllen TracyMark EgintonDale IsaacsonCraig Mynatt
    • Mark StiehlMichael L. TartagliaCarl EmbryMichael DudekTimothy BingamanAllen TracyMark EgintonDale IsaacsonCraig Mynatt
    • G02B642
    • G02B6/4246G02B6/4206G02B6/4225G02B6/4237G02B6/4239
    • A method and apparatus for coupling light from an array of optoelectronic devices to a corresponding array of fibers contained in a fiber optic ferrule is disclosed. The fibers may be single-mode or multi-mode optical fibers. The method includes fixing the fiber optic ferrule to the optical subassembly (OSA) base upon which the array of optoelectronic devices will be affixed, aligning the array of optoelectronic devices to the corresponding array of fibers, then securing the array of optoelectronic devices to the OSA base. In one embodiment, the module includes an optical subassembly module housing a linear array of 1300 nm VCSELs or photodetectors, spaced apart at a 250 micron pitch to correspond to the spacing of optical fibers in a conventional MT ferrule. The array of optoelectronic devices is mounted on a substrate assembly that includes a weldable surface and one or more photodetectors for automatic power control. After the components are aligned, the substrate assembly is affixed to the OSA base by epoxying or welding. The material within the substrate assembly is transparent to the emitted light or includes a notch or hole that allows light to pass through, in order to facilitate the integral placement of the monitor within the substrate assembly and beneath the material.
    • 公开了一种用于将光从光电子器件阵列耦合到包含在光纤套圈中的相应光纤阵列的方法和装置。 纤维可以是单模或多模光纤。 该方法包括将光纤套圈固定到光学子组件(OSA)基座上,将光固定阵列的光电子器件阵列固定在其上,将光电器件阵列对准相应的光纤阵列,然后将光电子器件阵列固定到OSA 基础。 在一个实施例中,该模块包括容纳1300nm VCSEL或光电检测器的线性阵列的光学子组件模块,其间隔开250微米间距以对应于常规MT套圈中的光纤的间隔。 光电器件的阵列安装在包括可焊接表面的衬底组件和用于自动功率控制的一个或多个光电检测器。 在组件对准之后,通过环氧树脂或焊接将衬底组件固定到OSA底座上。 衬底组件内的材料对于发射的光是透明的,或包括允许光通过的凹口或孔,以便于将监测器整体放置在衬底组件内和材料下方。
    • 9. 发明申请
    • HIGH SPEED OPTICAL SUB-ASSEMBLY WITH CERAMIC CARRIER
    • 高速光电子组件与陶瓷载体
    • US20060162104A1
    • 2006-07-27
    • US11278520
    • 2006-04-03
    • Kevin MaloneChristine MollenkopfJason YorksLance ThompsonBlake MynattMark StiehlTess AbidiWilliam DeanRobert ArnoldRichard AdamsGeorge JarrielDale Isaacson
    • Kevin MaloneChristine MollenkopfJason YorksLance ThompsonBlake MynattMark StiehlTess AbidiWilliam DeanRobert ArnoldRichard AdamsGeorge JarrielDale Isaacson
    • G11B23/50
    • G02B6/4232G02B6/4201G02B6/4204G02B6/4292H01L25/167H01L2224/48091H01L2924/30107H01L2924/3011H01L2924/3025H01S5/02248H01S5/02276H01S5/02284H01S5/02296H01S5/026H01S5/0262H01S5/0683H01S5/183H01L2924/00014H01L2924/00
    • A multilayer ceramic carrier for an optical element includes a terraced cavity for retaining a vertically receiving or vertically emitting optical element. The multilayer ceramic carrier includes conductive traces interposed between the ceramic layers and which extend into the terraced cavity along the trenches formed in the cavity. A vertical cavity surface emitting laser or vertically receiving optical element is wire bonded to the conductive traces which extend into the cavity. In one embodiment, the terraced cavity of the multilayer ceramic carrier includes a VCSEL and photodetector therein, the photodetector capable of monitoring the output optical power of the VCSEL. The method for forming the multilayer ceramic carrier includes forming a plurality of layers of ceramic tape, joining the layers, then co-firing the stacked layers. The multilayer ceramic carrier is joined to a plastic optical housing which includes an aperture for securing an optical fiber. The fiber launch direction is generally orthogonal to the optical surface of the vertically emitting or vertically receiving optical element secured within the ceramic carrier. The optical subassembly comprising the plastic optical housing and ceramic carrier is mounted on the surface of a printed circuit board or adjacent the edge of a printed circuit board, such that the light emitted or detected by the optical element, preferably travels along a fiber launch direction parallel to the surface of the printed circuit board. The optical assembly may be joined to the printed circuit board using various connectors capable of carrying an electrical signal.
    • 用于光学元件的多层陶瓷载体包括用于保持垂直接收或垂直发射的光学元件的梯形腔。 多层陶瓷载体包括介于陶瓷层之间并沿着形成在空腔中的沟槽延伸到梯形腔中的导电迹线。 垂直空腔表面发射激光器或垂直接收光学元件被引线接合到延伸到空腔中的导电迹线。 在一个实施例中,多层陶瓷载体的梯形空腔包括VCSEL和其中的光电检测器,该光电检测器能够监测VCSEL的输出光功率。 形成多层陶瓷载体的方法包括形成多层陶瓷带,连接层,然后共烧烧层叠层。 多层陶瓷载体连接到塑料光学外壳,该外壳包括用于固定光纤的孔。 光纤发射方向通常垂直于固定在陶瓷载体内的垂直发射或垂直接收的光学元件的光学表面。 包括塑料光学壳体和陶瓷载体的光学子组件安装在印刷电路板的表面上或与印刷电路板的边缘相邻,使得由光学元件发射或检测到的光优选沿着光纤发射方向 平行于印刷电路板的表面。 光学组件可以使用能够承载电信号的各种连接器连接到印刷电路板。