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1. 发明授权

US6010538A In situ technique for monitoring and controlling a process of chemical-mechanical-polishing via a radiative communication link 失效
标题翻译：用于通过辐射通信链路监测和控制化学机械抛光过程的原位技术
公开(公告)号：US6010538A
公开(公告)日：2000-01-04
申请号：US585164
申请日：1996-01-11
申请人： Mei H. Sun , Herbert E. Litvak , Huey M. Tzeng , Daniel E. Glenn , Earl M. Jensen , Frank J. Hausman , Lin Jun Zhou
发明人： Mei H. Sun , Herbert E. Litvak , Huey M. Tzeng , Daniel E. Glenn , Earl M. Jensen , Frank J. Hausman , Lin Jun Zhou
IPC分类号： B24B37/013 , B24B49/04 , B24B49/12 , G05B19/4065 , H05K3/04 , B24B7/04
CPC分类号： B24B37/013 , B24B49/04 , B24B49/12 , G05B19/4065
摘要： In an apparatus for removing material from an article, such as an exposed surface of an intermediate integrated circuit structure, by planarizing, polishing, etching or the like, a sensor is mechanically coupled to a moving carrier of the article for directing through the article to its first side an electromagnetic radiation beam having a wavelength band to which the structure is substantially transparent. The beam is detected after interacting with the article, such as being reflected from its exposed surface, and resulting information of the state of the processing of the exposed surface is transmitted from the moving carrier to a stationary receiver by radiation without the use of any physical transmission media such as wires or optical fibers. Multiple sensors mounted on the moving article carrier provide information of the uniformity of the processing across the exposed article surface. The radiation signal received by the stationary receiver is used to monitor or control the processing, such as by determining an endpoint thereof.
摘要翻译：在用于从诸如中间集成电路结构的暴露表面的物品去除材料的设备中，通过平面化，抛光，蚀刻等，将传感器机械耦合到物品的移动载体上，以引导物品引导到物品其第一面是具有该结构基本上透明的波长带的电磁辐射束。在与物品相互作用之后检测到光束，例如从其暴露的表面反射，并且通过辐射将暴露表面的处理状态的结果信息从运动载体传输到固定的接收器，而不使用任何物理传输介质如电线或光纤。安装在移动物品载体上的多个传感器提供跨过暴露的物品表面的处理的均匀性的信息。由固定接收机接收的辐射信号用于监视或控制处理，例如通过确定其端点。

2. 发明授权

US06315857B1 Polishing pad shaping and patterning 失效
标题翻译：抛光垫成型和图案化
公开(公告)号：US06315857B1
公开(公告)日：2001-11-13
申请号：US09113714
申请日：1998-07-10
申请人： Tsungnan Cheng , Ethan C. Wilson , Shou-sung Chang , Gregory C. Lee , Huey M. Tzeng , David E. Weldon , Linh X. Can , Luis Lau , Siyuan Yang
发明人： Tsungnan Cheng , Ethan C. Wilson , Shou-sung Chang , Gregory C. Lee , Huey M. Tzeng , David E. Weldon , Linh X. Can , Luis Lau , Siyuan Yang
IPC分类号： B24B2100
CPC分类号： B24B37/26 , B24D11/00
摘要： Polishing pads are provided for a linear chemical mechanical polishing apparatus used in manufacturing integrated circuits. The polishing pads, which are attached to a polishing belt, are grooved in patterns to advantageously transport slurry from the point of introduction to the point at which semiconductor wafers are polished. The patterns include at least one set of multiple parallel grooves extending across the polishing pads. The grooves form an angle with the direction of travel of the belt that is unequal to zero.
摘要翻译：为制造集成电路中使用的线性化学机械抛光装置提供抛光垫。附着在抛光带上的抛光垫以图案开槽，以有利地将浆料从导入点输送到半导体晶片被抛光的点。这些图案包括延伸穿过抛光垫的至少一组多个平行凹槽。槽与带的行进方向形成不等于零的角度。

3. 发明授权

US6126512A Robust belt tracking and control system for hostile environment 失效
标题翻译：强大的皮带追踪和控制系统，用于敌对环境
公开(公告)号：US6126512A
公开(公告)日：2000-10-03
申请号：US113485
申请日：1998-07-10
申请人： Mike Chao , Tim H. Huynh , Chi Guo , Huey M. Tzeng
发明人： Mike Chao , Tim H. Huynh , Chi Guo , Huey M. Tzeng
IPC分类号： B24B21/20 , B24B37/005 , B24B49/10 , F16H7/18
CPC分类号： B24B37/005 , B24B21/20 , B24B49/10
摘要： An automated tracking and control system measures the lateral displacement of a moving belt, using non-contact sensing. The displacement signal is provided to an algorithm that adjusts the tilts of the belt pulleys and steers the belt laterally. Non-contact sensors include inductive proximity sensors, which respond to the metal belt but are immune to airborne slurry and other non-metallic debris in a hostile environment typical of wafer polishing. Other non-contact sensors include shielded optical sensors. Dual sensor configurations cancel response to non-lateral displacements. Instrumentation, such as tension sensors, cylinder pressure sensors, load transducers, and limit switches, provides input to the algorithm. Independent tension signals for each belt edge verify proper functioning of, e.g., pad conditioners. User-specified belt displacements, e.g., dither, sawtooth oscillation, step, ramp, and sweep, combine with selective texturing and other variable pad properties to provide a desired polishing rate profile.
摘要翻译：自动跟踪和控制系统使用非接触感测来测量移动皮带的横向位移。位移信号被提供给调整皮带轮的倾斜并且横向转向皮带的算法。非接触传感器包括电感式接近传感器，其响应于金属带，但是在典型的晶片抛光的恶劣环境中对空气中的浆料和其它非金属碎屑是免疫的。其他非接触式传感器包括屏蔽光学传感器。双传感器配置取消对非横向位移的响应。仪器仪表，例如张力传感器，气缸压力传感器，负载传感器和限位开关，为算法提供了输入。每个带边缘的独立张力信号验证例如垫调节器的正常功能。用户指定的带位移，例如抖动，锯齿波振荡，步进，斜坡和扫描，与选择性纹理化和其他可变焊盘属性组合以提供期望的抛光速率分布。

4. 发明授权

US6000997A Temperature regulation in a CMP process 失效
标题翻译： CMP工艺中的温度调节
公开(公告)号：US6000997A
公开(公告)日：1999-12-14
申请号：US113450
申请日：1998-07-10
申请人： Shu-Hsin Kao , Shou-sung Chang , Huey M. Tzeng , Gregory C. Lee , Greg Simon , Harry Lee , David E. Weldon , Garry Kwong , William F. Lapson , Gregory A. Appel , Peter Mok
发明人： Shu-Hsin Kao , Shou-sung Chang , Huey M. Tzeng , Gregory C. Lee , Greg Simon , Harry Lee , David E. Weldon , Garry Kwong , William F. Lapson , Gregory A. Appel , Peter Mok
IPC分类号： B24B21/04 , B24B37/015 , B24B49/14
CPC分类号： B24B37/015 , B24B21/04
摘要： Heat is transferred between a linear CMP belt and an adjacent heat transfer source, providing a predetermined lateral temperature distribution across the belt. Temperature sensors generate feedback signals to control the heat transfer sources. Alternatively, process monitoring sensors provide feedback signals. The heat transfer source can include multiple selectively controllable individual heat transfer sources having differing temperatures, which can be above or below ambient temperature. The mechanism of heat transfer can include one or more of convection, conduction, and radiation. The configuration provides substantial flexibility to establish and maintain selective non-uniform temperature distributions across the polishing belt. This in turn permits precise control and stability of the polishing process. Heat transfer sources can include pulleys, slurry dispensers, polishing pad conditioners or conditioner back supports, fluid nozzles, and sealed fluid cavity belt supports.
摘要翻译：热量在线性CMP带和相邻的传热源之间传递，从而提供穿过带的预定横向温度分布。温度传感器产生反馈信号来控制传热源。或者，过程监控传感器提供反馈信号。传热源可以包括具有不同温度的多个选择性可控的单个热传递源，其可以高于或低于环境温度。传热的机理可以包括一个或多个对流，传导和辐射。该配置提供了大量灵活性，以建立和保持穿过抛光带的选择性不均匀的温度分布。这又允许精确的控制和抛光过程的稳定性。传热源可以包括滑轮，浆液分配器，抛光垫调节器或调节器背部支撑件，流体喷嘴和密封的流体腔体带支撑件。

5. 发明授权

US6028669A Signal processing for in situ monitoring of the formation or removal of a transparent layer 失效
标题翻译：用于原位监测透明层的形成或去除的信号处理
公开(公告)号：US6028669A
公开(公告)日：2000-02-22
申请号：US899470
申请日：1997-07-23
申请人： Huey M. Tzeng
发明人： Huey M. Tzeng
IPC分类号： G01B11/06 , G01B9/02
CPC分类号： G01B11/0683
摘要： The deposition material on, or removal of material from, an article, such as on an exposed surface of an intermediate integrated circuit structure, is optically monitored. The processes that are so monitored include the formation of a dielectric layer on a semiconductor wafer, and the removal of material from such a layer by planarization, polishing, or etching, a process of chemical-mechanical-polishing (CMP) being given as an example. A resulting optical signal is detected and processed in real time to provide information of the progress of the material formation or removal and an indication when an end point has been reached. The optical signal being processed varies sinusoidally as a result of interference between light reflected from a surface being operated upon and light reflected from some other surface. A differential or integral of this signal is formed to provide additional peaks and valleys that are detected in order to obtain data points from the signal every one-quarter period. This allows a very early determination of the amount of material being added or removed, the rate that this is occurring, and the like, which determinations are repetitively updated as more signal data points are acquired. This information can be provided to an individual who is operating the processing equipment, and/or can be used to directly control the processing equipment.
摘要翻译：在中间集成电路结构的暴露表面上的物品上或从物品移除材料的沉积材料被光学监测。如此监控的工艺包括在半导体晶片上形成电介质层，以及通过平面化，抛光或蚀刻从这种层去除材料，化学机械抛光（CMP）的过程被给出为例。产生的光信号被实时检测和处理以提供材料形成或去除的进展的信息以及当达到终点时的指示。正在处理的光信号由于从被操作的表面反射的光和从其它表面反射的光之间的干涉而正弦变化。形成该信号的差分或积分以提供额外的峰和谷，以便每四分之一周期从信号获得数据点。这允许非常早的确定被添加或去除的材料的量，发生的速率等，当获取更多的信号数据点时，确定被重复地更新。该信息可以提供给正在操作处理设备的个人，和/或可用于直接控制处理设备。

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