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    • 1. 发明申请
    • Probecard System and Method
    • Probecard系统和方法
    • US20110248735A1
    • 2011-10-13
    • US12756578
    • 2010-04-08
    • Matt LoseyMelvin KhooYohannes DestaChang Huang
    • Matt LoseyMelvin KhooYohannes DestaChang Huang
    • G01R31/02G01R31/26G01R31/20
    • G01R31/2889G01R1/06744
    • A microelectronic contactor assembly can include a probe head having microelectronic contactors for contacting terminals of semiconductor devices to test the semiconductor devices. A stiffener assembly can provide mechanical support to microelectronic contactors and for connecting a probe card assembly to a prober machine. A stiffener assembly may include first and second stiffener bodies that are connected together at their central portions with adjustment mechanisms such as three differential screw mechanisms. A probe head may be attached to a first stiffener body at locations outside its central portion, while a prober machine may be attached to a second stiffener body at locations outside its central portion. The first and second stiffener bodies may have different coefficients of thermal expansion. The stiffener assembly allows for differential thermal expansion of various components of the microelectronic contactor assembly while minimizing accompanying dimensional distortion that could interfere with contacting the terminals of semiconductor devices. The adjustment mechanisms allow for quick, sensitive adjustment of the positions of microelectronic contactors relative to semiconductor devices to be tested.
    • 微电子接触器组件可以包括具有微电子接触器的探针头,用于接触半导体器件的端子以测试半导体器件。 加强件组件可以为微电子接触器提供机械支撑并将探针卡组件连接到探测机。 加强件组件可以包括第一和第二加强件本体,其在其中心部分处与诸如三个差速螺旋机构的调节机构连接在一起。 探针头可以在其中心部分外部的位置处附接到第一加强体,而探针机可以在其中心部分外部的位置处附接到第二加强体。 第一和第二加强体可具有不同的热膨胀系数。 加强件组件允许微电子接触器组件的各种部件的差分热膨胀,同时最小化可能干扰接触半导体器件的端子的伴随的尺寸变形。 调节机构允许微电子接触器相对于要测试的半导体器件的位置的快速灵敏调节。
    • 2. 发明授权
    • Probecard system and method
    • Probecard系统和方法
    • US08278956B2
    • 2012-10-02
    • US12756578
    • 2010-04-08
    • Matt LoseyMelvin KhooYohannes DestaChang Huang
    • Matt LoseyMelvin KhooYohannes DestaChang Huang
    • G01R31/00
    • G01R31/2889G01R1/06744
    • A microelectronic contactor assembly can include a probe head having microelectronic contactors for contacting terminals of semiconductor devices to test the semiconductor devices. A stiffener assembly can provide mechanical support to microelectronic contactors and for connecting a probe card assembly to a prober machine. A stiffener assembly may include first and second stiffener bodies that are connected together at their central portions with adjustment mechanisms such as three differential screw mechanisms. A probe head may be attached to a first stiffener body at locations outside its central portion, while a prober machine may be attached to a second stiffener body at locations outside its central portion. The first and second stiffener bodies may have different coefficients of thermal expansion. The stiffener assembly allows for differential thermal expansion of various components of the microelectronic contactor assembly while minimizing accompanying dimensional distortion that could interfere with contacting the terminals of semiconductor devices. The adjustment mechanisms allow for quick, sensitive adjustment of the positions of microelectronic contactors relative to semiconductor devices to be tested.
    • 微电子接触器组件可以包括具有微电子接触器的探针头,用于接触半导体器件的端子以测试半导体器件。 加强件组件可以为微电子接触器提供机械支撑并将探针卡组件连接到探测机。 加强件组件可以包括第一和第二加强件本体,其在其中心部分处与诸如三个差速螺旋机构的调节机构连接在一起。 探针头可以在其中心部分外部的位置处附接到第一加强体,而探针机可以在其中心部分外部的位置处附接到第二加强体。 第一和第二加强体可具有不同的热膨胀系数。 加强件组件允许微电子接触器组件的各种部件的差分热膨胀,同时最小化可能干扰接触半导体器件的端子的伴随的尺寸变形。 调节机构允许微电子接触器相对于要测试的半导体器件的位置的快速灵敏调节。
    • 4. 发明授权
    • Probe card with balanced lateral force
    • 探头卡平衡横向力
    • US07538567B2
    • 2009-05-26
    • US11457132
    • 2006-07-12
    • Shaoning LuMelvin KhooNim Tea
    • Shaoning LuMelvin KhooNim Tea
    • G01R31/02
    • G01R31/2891G01R1/07342
    • A novel method and structure for counter-balancing a lateral force exerted by a probe card onto a device under test (“DUT”) is disclosed. Many DUTs (particularly memory devices) are tested in parallel (i.e., many die at a time) and have unequal numbers of contact pads on top vs. bottom and/or right vs. left sides of the die. The probe card used to test the DUT would necessarily have an uneven distribution of probes that match the contact pads and, as a consequence, may exert a net lateral force on the DUT. By manipulating the individual characteristics of the individual probes, a probe card may be constructed that zeroes the lateral force. Characteristics such as the direction and stiffness of the individual probes can be varied to zero the net lateral force.
    • 公开了一种用于将探针卡施加到被测设备(“DUT”)上的横向力平衡的新颖方法和结构。 许多DUT(特别是存储器件)被并行测试(即,一次许多裸片),并且在芯片的顶部与底部和/或右侧或左侧具有不相等数量的接触焊盘。 用于测试DUT的探针卡必然具有与接触垫匹配的探头不均匀分布,因此可能在DUT上施加净侧向力。 通过操纵各个探针的各个特性,构造可以使横向力为零的探针卡。 诸如各个探针的方向和刚度的特征可以变化为零的净侧向力。
    • 5. 发明申请
    • HYBRID PROBE FOR TESTING SEMICONDUCTOR DEVICES
    • 用于测试半导体器件的混合探针
    • US20080252310A1
    • 2008-10-16
    • US11734434
    • 2007-04-12
    • Nim TeaZhiyong AnMelvin Khoo
    • Nim TeaZhiyong AnMelvin Khoo
    • G01R1/067
    • G01R1/06733G01R1/06727G01R3/00
    • A novel hybrid probe design is presented that comprises a torsion element and a bending element. These elements allow the probe to store the displacement energy as torsion or as bending. The novel hybrid probe comprises a probe base, a torsion element, a bending element, and a probe tip. The probe elastically deforms to absorb the displacement energy as the probe tip contacts the DUT contact pad. The bending element absorbs some of the displacement energy through bending. Because the torsion element and the bending element join at an angle, a portion of the displacement energy is transferred to the torsion element causing it to twist (torque). The torsion element can also bend to accommodate the storage of energy through torsion and bending. Also, adjusting the position of a pivot can be manipulated to alter the energy absorption characteristics of the probe. One or more additional angular elements may be added to change the energy absorption characteristics of the probe. And, the moment of inertia for the torsion and/or bending elements can by manipulated to achieve the desired probe characteristics.
    • 提出了一种新颖的混合探针设计,其包括扭转元件和弯曲元件。 这些元件允许探头将位移能量存储为扭转或弯曲。 该新型混合探针包括探针基座,扭转元件,弯曲元件和探针尖端。 当探针尖端接触DUT接触垫时,探头弹性变形以吸收位移能量。 弯曲元件通过弯曲吸收一些位移能量。 由于扭转元件和弯曲元件以一定角度接合,所以位移能量的一部分被传递到扭转元件,使其扭转(扭矩)。 扭转元件还可以弯曲以适应通过扭转和弯曲的能量存储。 此外,可以调节枢轴的位置以改变探头的能量吸收特性。 可以添加一个或多个附加角元件以改变探针的能量吸收特性。 并且,通过操纵扭转和/或弯曲元件的惯性矩可以实现所需的探针特性。
    • 6. 发明申请
    • Probe Card with Balanced Lateral Force
    • 具有平衡侧向力的探针卡
    • US20080012594A1
    • 2008-01-17
    • US11457132
    • 2006-07-12
    • Shaoning LuMelvin KhooNim Tea
    • Shaoning LuMelvin KhooNim Tea
    • G01R31/02
    • G01R31/2891G01R1/07342
    • A novel method and structure for counter-balancing a lateral force exerted by a probe card onto a device under test (“DUT”) is disclosed. Many DUTs (particularly memory devices) are tested in parallel (i.e., many die at a time) and have unequal numbers of contact pads on top vs. bottom and/or right vs. left sides of the die. The probe card used to test the DUT would necessarily have an uneven distribution of probes that match the contact pads and, as a consequence, may exert a net lateral force on the DUT. By manipulating the individual characteristics of the individual probes, a probe card may be constructed that zeroes the lateral force. Characteristics such as the direction and stiffness of the individual probes can be varied to zero the net lateral force.
    • 公开了一种用于将探针卡施加到被测设备(“DUT”)上的横向力平衡的新颖方法和结构。 许多DUT(特别是存储器件)被并行测试(即,一次许多裸片),并且在芯片的顶部与底部和/或右侧或左侧具有不相等数量的接触焊盘。 用于测试DUT的探针卡必然具有与接触垫匹配的探头不均匀分布,因此可能在DUT上施加净侧向力。 通过操纵各个探针的各个特性,构造可以使横向力为零的探针卡。 诸如各个探针的方向和刚度的特征可以变化为零的净侧向力。
    • 8. 发明授权
    • Torsion spring probe contactor design
    • 扭力弹簧探头接触器设计
    • US07724010B2
    • 2010-05-25
    • US11983521
    • 2007-11-09
    • Melvin KhooNim TeaSalleh IsmailYang HsuWeilong TangRaffi Garabedian
    • Melvin KhooNim TeaSalleh IsmailYang HsuWeilong TangRaffi Garabedian
    • G01R1/073
    • G01R1/06727G01R1/06738G01R3/00
    • The present invention relates to a probe for making electrical connection to a contact pad on a microelectronic device. A foot having a length, a thickness, a width, a proximal end, and a distal end, is connected to a substrate. The length of the foot is greater than its width. A torsion bar having a length, a width, a thickness, a proximal end, and a distal end, is connected to the distal end of the foot at the proximal end of torsion bar. The torsion bar lies in a first plane. A spacer having a length, a width, and a thickness, is connected to the distal end of the torsion bar. An arm having a length, a width, a thickness, a proximal end, and a distal end is connected to said spacer at the arms proximal end. The arm lies in a second plane and the second plane is in a different plane than the first plane. A first post having a top side and a bottom side is connected to the arm near the distal end of the arm. A tip is electrically connected to the top side of the post.
    • 本发明涉及一种用于与微电子器件上的接触焊盘进行电连接的探针。 具有长度,厚度,宽度,近端和远端的脚连接到基底。 脚的长度大于其宽度。 具有长度,宽度,厚度,近端和远端的扭杆在扭杆的近端处连接到脚的远端。 扭杆位于第一平面内。 具有长度,宽度和厚度的间隔件连接到扭杆的远端。 具有长度,宽度,厚度,近端和远端的臂在臂近端处连接到所述间隔件。 臂位于第二平面中,第二平面位于与第一平面不同的平面上。 具有顶侧和底侧的第一柱连接到臂的远端附近的臂。 尖端电连接到柱的顶侧。
    • 9. 发明授权
    • Hybrid probe for testing semiconductor devices
    • 用于半导体器件测试的混合探头
    • US07589542B2
    • 2009-09-15
    • US11734434
    • 2007-04-12
    • Melvin KhooNim TeaZhiyong AnTing Hu
    • Melvin KhooNim TeaZhiyong AnTing Hu
    • G01R31/02
    • G01R1/06733G01R1/06727G01R3/00
    • A hybrid probe design is presented that includes a torsion element and a bending element. These elements allow the probe to store the displacement energy as torsion or as bending. The probe includes a base, a torsion element, a bending element, and a tip. The probe elastically deforms to absorb the displacement energy as the probe tip contacts the DUT contact pad. The bending element absorbs some of the displacement energy through bending. Because the torsion element and the bending element join at an angle, a portion of the displacement energy is transferred to the torsion element causing it to twist (torque). The torsion element can also bend to accommodate the storage of energy through torsion and bending. Adjusting the position of a pivot can alter the probe's energy absorption characteristics. One or more additional angular elements may be added to change the energy absorption characteristics of the probe.
    • 提出了一种混合探针设计,其包括扭转元件和弯曲元件。 这些元件允许探头将位移能量存储为扭转或弯曲。 探头包括基座,扭转元件,弯曲元件和尖端。 当探针尖端接触DUT接触垫时,探头弹性变形以吸收位移能量。 弯曲元件通过弯曲吸收一些位移能量。 由于扭转元件和弯曲元件以一定角度接合,所以位移能量的一部分被传递到扭转元件,使其扭转(扭矩)。 扭转元件还可以弯曲以适应通过扭转和弯曲的能量存储。 调整枢轴的位置可以改变探头的能量吸收特性。 可以添加一个或多个附加角元件以改变探针的能量吸收特性。