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1. 发明申请

US20080252328A1 PROBE FOR TESTING SEMICONDUCTOR DEVICES 有权
标题翻译：用于测试半导体器件的探针
公开(公告)号：US20080252328A1
公开(公告)日：2008-10-16
申请号：US12042295
申请日：2008-03-04
申请人： Zhiyong An , Melvin Khoo , Nim Tea , Ting Hu
发明人： Zhiyong An , Melvin Khoo , Nim Tea , Ting Hu
IPC分类号： G01R1/067
CPC分类号： G01R1/06733 , G01R1/06727
摘要： A novel probe design is presented that increases a probe tolerance to stress fractures. Specifically, what is disclosed are three features increase stress tolerance. These features include a various union angle interface edge shapes, pivot cutouts and buffers.
摘要翻译：提出了一种新的探针设计，增加了对应力骨折的探针耐受性。具体来说，公开的是增加压力容忍度的三个特征。这些特征包括各种联合角度界面边缘形状，枢轴切口和缓冲区。

2. 发明申请

US20080252310A1 HYBRID PROBE FOR TESTING SEMICONDUCTOR DEVICES 有权
标题翻译：用于测试半导体器件的混合探针
公开(公告)号：US20080252310A1
公开(公告)日：2008-10-16
申请号：US11734434
申请日：2007-04-12
申请人： Nim Tea , Zhiyong An , Melvin Khoo
发明人： Nim Tea , Zhiyong An , Melvin Khoo
IPC分类号： G01R1/067
CPC分类号： G01R1/06733 , G01R1/06727 , G01R3/00
摘要： A novel hybrid probe design is presented that comprises a torsion element and a bending element. These elements allow the probe to store the displacement energy as torsion or as bending. The novel hybrid probe comprises a probe base, a torsion element, a bending element, and a probe tip. The probe elastically deforms to absorb the displacement energy as the probe tip contacts the DUT contact pad. The bending element absorbs some of the displacement energy through bending. Because the torsion element and the bending element join at an angle, a portion of the displacement energy is transferred to the torsion element causing it to twist (torque). The torsion element can also bend to accommodate the storage of energy through torsion and bending. Also, adjusting the position of a pivot can be manipulated to alter the energy absorption characteristics of the probe. One or more additional angular elements may be added to change the energy absorption characteristics of the probe. And, the moment of inertia for the torsion and/or bending elements can by manipulated to achieve the desired probe characteristics.
摘要翻译：提出了一种新颖的混合探针设计，其包括扭转元件和弯曲元件。这些元件允许探头将位移能量存储为扭转或弯曲。该新型混合探针包括探针基座，扭转元件，弯曲元件和探针尖端。当探针尖端接触DUT接触垫时，探头弹性变形以吸收位移能量。弯曲元件通过弯曲吸收一些位移能量。由于扭转元件和弯曲元件以一定角度接合，所以位移能量的一部分被传递到扭转元件，使其扭转（扭矩）。扭转元件还可以弯曲以适应通过扭转和弯曲的能量存储。此外，可以调节枢轴的位置以改变探头的能量吸收特性。可以添加一个或多个附加角元件以改变探针的能量吸收特性。并且，通过操纵扭转和/或弯曲元件的惯性矩可以实现所需的探针特性。

3. 发明授权

US07772859B2 Probe for testing semiconductor devices with features that increase stress tolerance 有权
标题翻译：用于测试具有增加应力耐受性的半导体器件的探头
公开(公告)号：US07772859B2
公开(公告)日：2010-08-10
申请号：US12042295
申请日：2008-03-04
申请人： Melvin Khoo , Nim Tea , Ting Hu , Zhiyong An
发明人： Melvin Khoo , Nim Tea , Ting Hu , Zhiyong An
IPC分类号： G01R31/02
CPC分类号： G01R1/06733 , G01R1/06727
摘要： A novel probe design is presented that increases a probe tolerance to stress fractures. The probe includes a base, a torsion element connected to the base, and a second element connected to the torsion element through a union angle. The union angle includes an interface between the torsion element and the second element, and the edge of the interface is shaped to diffuse stress. What is further-disclosed are three features that increase stress tolerance. These features include a various union angle interface edge shapes, pivot cutouts and buffers.
摘要翻译：提出了一种新的探针设计，增加了对应力骨折的探针耐受性。探针包括基座，连接到基座的扭转元件和通过接合角连接到扭转元件的第二元件。联合角度包括扭转元件和第二元件之间的界面，并且界面的边缘成形为扩散应力。进一步披露的是增加压力容忍度的三个特征。这些特征包括各种联合角度界面边缘形状，枢轴切口和缓冲区。

4. 发明授权

US07589542B2 Hybrid probe for testing semiconductor devices 有权
标题翻译：用于半导体器件测试的混合探头
公开(公告)号：US07589542B2
公开(公告)日：2009-09-15
申请号：US11734434
申请日：2007-04-12
申请人： Melvin Khoo , Nim Tea , Zhiyong An , Ting Hu
发明人： Melvin Khoo , Nim Tea , Zhiyong An , Ting Hu
IPC分类号： G01R31/02
CPC分类号： G01R1/06733 , G01R1/06727 , G01R3/00
摘要： A hybrid probe design is presented that includes a torsion element and a bending element. These elements allow the probe to store the displacement energy as torsion or as bending. The probe includes a base, a torsion element, a bending element, and a tip. The probe elastically deforms to absorb the displacement energy as the probe tip contacts the DUT contact pad. The bending element absorbs some of the displacement energy through bending. Because the torsion element and the bending element join at an angle, a portion of the displacement energy is transferred to the torsion element causing it to twist (torque). The torsion element can also bend to accommodate the storage of energy through torsion and bending. Adjusting the position of a pivot can alter the probe's energy absorption characteristics. One or more additional angular elements may be added to change the energy absorption characteristics of the probe.
摘要翻译：提出了一种混合探针设计，其包括扭转元件和弯曲元件。这些元件允许探头将位移能量存储为扭转或弯曲。探头包括基座，扭转元件，弯曲元件和尖端。当探针尖端接触DUT接触垫时，探头弹性变形以吸收位移能量。弯曲元件通过弯曲吸收一些位移能量。由于扭转元件和弯曲元件以一定角度接合，所以位移能量的一部分被传递到扭转元件，使其扭转（扭矩）。扭转元件还可以弯曲以适应通过扭转和弯曲的能量存储。调整枢轴的位置可以改变探头的能量吸收特性。可以添加一个或多个附加角元件以改变探针的能量吸收特性。

5. 发明授权

US08705239B1 Heat dissipation for electronic modules 有权
标题翻译：电子模块的散热
公开(公告)号：US08705239B1
公开(公告)日：2014-04-22
申请号：US13205477
申请日：2011-08-08
申请人： Enchao Yu , Zhiyong An
发明人： Enchao Yu , Zhiyong An
IPC分类号： H05K7/20 , H01L23/36
CPC分类号： H01L23/4093 , H01L23/367 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation system for use with an electronic module is provided. The electronic module includes a first side with a first plurality of electronic components mounted thereon and a second side with a second plurality of electronic components mounted thereon. The heat dissipation system includes a first segment mountable on the module to be in thermal communication with at least one electronic component of the first plurality of electronic components. The system further includes a second segment mountable on the module to be in thermal communication with at least one electronic component of the second plurality of electronic components. The system includes a third segment mountable on the module to be in thermal communication with the first segment and with the second segment, the third segment providing a path through which heat flows from the first segment to the second segment.
摘要翻译：提供了一种用于电子模块的散热系统。电子模块包括安装在其上的第一多个电子部件的第一侧和安装在其上的第二多个电子部件的第二侧。散热系统包括可安装在模块上的第一段，以与第一多个电子部件中的至少一个电子部件热连通。该系统还包括可安装在模块上以与第二多个电子部件的至少一个电子部件热连通的第二部分。该系统包括可安装在模块上以与第一段热连通的第三段和第二段，第三段提供热量从第一段流向第二段的路径。

6. 发明授权

US08018723B1 Heat dissipation for electronic modules 有权
标题翻译：电子模块的散热
公开(公告)号：US08018723B1
公开(公告)日：2011-09-13
申请号：US12432591
申请日：2009-04-29
申请人： Enchao Yu , Zhiyong An
发明人： Enchao Yu , Zhiyong An
IPC分类号： H05K7/20 , H01L23/36
CPC分类号： H01L23/4093 , H01L23/367 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation system for use with an electronic module is provided. The electronic module includes a first side with a first plurality of electronic components mounted thereon and a second side with a second plurality of electronic components mounted thereon. The heat dissipation system includes a first segment mountable on the module to be in thermal communication with at least one electronic component of the first plurality of electronic components. The system further includes a second segment mountable on the module to be in thermal communication with at least one electronic component of the second plurality of electronic components. The system includes a third segment mountable on the module to be in thermal communication with the first segment and with the second segment, the third segment providing a path through which heat flows from the first segment to the second segment.
摘要翻译：提供了一种用于电子模块的散热系统。电子模块包括安装在其上的第一多个电子部件的第一侧和安装在其上的第二多个电子部件的第二侧。散热系统包括可安装在模块上的第一段，以与第一多个电子部件中的至少一个电子部件热连通。该系统还包括可安装在模块上以与第二多个电子部件的至少一个电子部件热连通的第二部分。该系统包括可安装在模块上以与第一段热连通的第三段和第二段，第三段提供热量从第一段流向第二段的路径。

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