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    • 1. 发明授权
    • Wiring substrate and manufacturing method thereof
    • 接线基板及其制造方法
    • US06177635B1
    • 2001-01-23
    • US09461276
    • 1999-12-14
    • Masuo SugiuraHiroshi WatanabeMitsuji Kubota
    • Masuo SugiuraHiroshi WatanabeMitsuji Kubota
    • H01B1700
    • H01B7/40B60R16/0215H01B7/009H01B7/08H05K1/144
    • A coating insulator layer has plural rows of through holes disposed longitudinally in the coating insulator layer. A plurality of conductors are disposed in parallel with one another longitudinally in the coating insulator layer. Each conductor does not interfere with the through holes. Plural rows of locking projections are longitudinally formed on a face of the coating insulator layer. The locking projection has a construction to engage with the through hole. Thus, when a couple of the wiring substrates are layered, some of the locking projections formed on one of the wiring substrates are aligned to be engaged with some relative through holes of the other wiring substrate, allowing a sure lamination of the wiring substrates. The locking projections are disposed in regular intervals and the through holes are spaced in the same regular intervals. Another wiring substrate is enough flexible to be arranged along a structural wall for wiring. The wiring substrate has a stiffener means disposed in the insulator layer. The stiffener means is positioned not to interfere with the conductors and provides enough stiffness to keep the wiring substrate in a desired shape. The stiffener means has a larger strength than the insulator layer in bending strength and the stiffener means is disposed parallel with the longitudinal direction of the conductors. The wiring substrate has a plurality of through holes which each can be engageable with a locking projection provided on the structural wall.
    • 涂层绝缘体层具有在涂层绝缘体层中纵向设置的多排通孔。 多个导体在涂层绝缘体层中纵向彼此平行地设置。 每个导体不会干扰通孔。 在涂层绝缘体层的表面上纵向形成多排锁定突起。 锁定突起具有与通孔接合的结构。 因此,当一对布线基板被层叠时,形成在一个布线基板上的一些锁定突起被对准以与另一布线基板的一些相对通孔接合,从而允许布线基板的可靠层叠。 锁定突起以规则的间隔设置,并且通孔以相同的规则间隔隔开。 另一布线基板足够灵活地沿着用于布线的结构壁布置。 布线基板具有设置在绝缘体层中的加强装置。 加强件装置被定位成不干扰导体并且提供足够的刚度以将布线基板保持在期望的形状。 加强件在弯曲强度方面具有比绝缘体层更大的强度,并且加强件装置与导体的纵向方向平行设置。 布线基板具有多个通孔,每个通孔可与设置在结构壁上的锁定突起接合。
    • 8. 发明授权
    • Mobile wireless apparatus
    • 移动无线设备
    • US08611972B2
    • 2013-12-17
    • US12838619
    • 2010-07-19
    • Hirotake SumiHiroshi Watanabe
    • Hirotake SumiHiroshi Watanabe
    • H04W88/02
    • H01Q1/243H01Q1/48H01Q9/16H01Q9/42H04M1/0235
    • According to one embodiment, a mobile wireless apparatus includes: a first housing; and a second housing configured to be slidably connected to the first housing. The first housing includes: a conductor section; and a conducting member configured comprise a conductive material and to be connected to the conductor section. The second housing includes: a ground circuit; a power feed circuit; a slide member configured to comprise a conductive material, to be connected to the ground circuit, and to be slidably engaged with the first housing; and an unbalanced antenna configured to be connected to the power feed circuit. The conducting member is configured to make contact with the slide member when the first housing is opened with respect to the second housing.
    • 根据一个实施例,移动无线设备包括:第一外壳; 以及构造成可滑动地连接到所述第一壳体的第二壳体。 第一壳体包括:导体部分; 并且导电构件构造成包括导电材料并连接到导体部分。 第二壳体包括:接地电路; 供电电路; 滑动构件,其构造成包括导电材料,以连接到接地电路,并且与第一壳体可滑动地接合; 以及被配置为连接到所述馈电电路的不平衡天线。 导电构件被构造成当第一壳体相对于第二壳体打开时与滑动构件接触。