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1. 发明授权

US07812107B2 Water-based coated-type vibration damping material 有权
标题翻译：水性涂层式减震材料
公开(公告)号：US07812107B2
公开(公告)日：2010-10-12
申请号：US11428421
申请日：2006-07-03
申请人： Masayuki Numazawa , Ken Tsuzuki , Yutaka Ohashi
发明人： Masayuki Numazawa , Ken Tsuzuki , Yutaka Ohashi
IPC分类号： C08F20/06
CPC分类号： C09D5/024
摘要： A water-based coated-type vibration damping material uses a styrene-butadiene copolymer emulsion as a resin emulsion and a calcium carbonate as an inorganic filler. The water-based coated-type vibration damping material limits a blending amount of a glycol to 2% by weight or less. In case of making a coated layer by such water-based coated-type vibration damping material, there is no blister generation observed after a hot water immersion of 168 hours (7 days), after a hot water immersion of 336 hours (14 days) and after a hot water immersion of 1000 hours, either.
摘要翻译：水性涂布型减震材料使用苯乙烯 - 丁二烯共聚物乳液作为树脂乳液，碳酸钙作为无机填料。水性涂布型减震材料将二醇的配合量限制在2重量％以下。在通过这种水性涂层型减振材料制造涂层的情况下，在168小时（7天）的热水浸渍后，在336小时（14天）的热水浸渍之后，没有观察到发泡，并经过1000小时的热水浸泡。

2. 发明申请

US20070032586A1 WATER-BASED COATED-TYPE VIBRATION DAMPING MATERIAL 有权
标题翻译：水基涂层式振动阻尼材料
公开(公告)号：US20070032586A1
公开(公告)日：2007-02-08
申请号：US11428421
申请日：2006-07-03
申请人： Masayuki Numazawa , Ken Tsuzuki , Yutaka Ohashi
发明人： Masayuki Numazawa , Ken Tsuzuki , Yutaka Ohashi
IPC分类号： B29C47/10
CPC分类号： C09D5/024
摘要： A water-based coated-type vibration damping material uses a styrene-butadiene copolymer emulsion as a resin emulsion and a calcium carbonate as an inorganic filler. The water-based coated-type vibration damping material limits a blending amount of a glycol to 2% by weight or less. In case of making a coated layer by such water-based coated-type vibration damping material, there is no blister generation observed after a hot water immersion of 168 hours (7 days), after a hot water immersion of 336 hours (14 days) and after a hot water immersion of 1000 hours, either.
摘要翻译：水性涂布型减震材料使用苯乙烯 - 丁二烯共聚物乳液作为树脂乳液，碳酸钙作为无机填料。水性涂布型减震材料将二醇的配合量限制在2重量％以下。在通过这种水性涂层型减振材料制造涂层的情况下，在168小时（7天）的热水浸渍后，在336小时（14天）的热水浸渍之后，没有观察到发泡，并经过1000小时的热水浸泡。

3. 发明授权

US09036958B2 Optical component 有权
标题翻译：光学元件
公开(公告)号：US09036958B2
公开(公告)日：2015-05-19
申请号：US13582954
申请日：2011-03-09
申请人： Motohaya Ishii , Naoki Ooba , Kazunori Seno , Yoshiyuki Doi , Ken Tsuzuki , Takao Fukumitsu , Atsushi Murasawa , Fumihiro Ebisawa , Hiroshi Terui , Tomoyo Shibazaki , Yuichi Kikuchi
发明人： Motohaya Ishii , Naoki Ooba , Kazunori Seno , Yoshiyuki Doi , Ken Tsuzuki , Takao Fukumitsu , Atsushi Murasawa , Fumihiro Ebisawa , Hiroshi Terui , Tomoyo Shibazaki , Yuichi Kikuchi
IPC分类号： G02B6/12 , G02B6/36 , G02B6/30 , G02B6/35
CPC分类号： G02B6/12009 , G02B6/12033 , G02B6/30 , G02B6/3508 , G02B6/3616
摘要： In an optical component, a part of a waveguide type optical device is fixed to a convex portion of a mount. The optical component includes an optical device support base, a pressure member and a pressure support base. The optical device support base is interposed between the mount and the presser member enough to be slidable in a direction parallel to surfaces of the mount and the presser member.
摘要翻译：在光学部件中，波导型光学元件的一部分固定在基座的凸部。光学部件包括光学器件支撑基座，压力部件和压力支撑基座。光学装置支撑基座插入在支架和压紧构件之间，足以在平行于安装件和压紧构件的表面的方向上滑动。

4. 发明授权

US07060518B2 Semiconductor optical device and the fabrication method 失效
公开(公告)号：US07060518B2
公开(公告)日：2006-06-13
申请号：US11240903
申请日：2005-09-30
申请人： Susumu Kondo , Matsuyuki Ogasawara , Ryuzo Iga , Yasuhiro Kondo , Yoshio Noguchi , Masahiro Yuda , Ken Tsuzuki , Satoshi Oku
发明人： Susumu Kondo , Matsuyuki Ogasawara , Ryuzo Iga , Yasuhiro Kondo , Yoshio Noguchi , Masahiro Yuda , Ken Tsuzuki , Satoshi Oku
IPC分类号： H01L21/00
CPC分类号： B82Y20/00 , G02F1/01708 , H01S5/0265 , H01S5/2226 , H01S5/227 , H01S5/3072
摘要： A semiconductor optical device includes a semiconductor substrate and a stacked body formed by at least a first cladding layer, an active region and a second cladding layer; wherein both sides of the stacked body are buried by a burying layer formed by a semi-insulating semiconductor crystal; the burying layer includes a first layer that is placed adjacent to both sides of the stacked body and a second layer that is placed adjacent to the first layer; the first layer includes Ru as a dopant; composition of the second layer is different from the composition of the first layer, or a dopant of the second layer is different from the dopant of the first layer. The device can also be configured such that the width of the active region is smaller than the width of the cladding layers of the stacked body; and a Ru-doped semi-insulating layer is provided in a space between the burying layer and the active region in both sides of the active region.

5. 发明申请

US20060030065A1 Semiconductor optical device and the fabrication method 失效
公开(公告)号：US20060030065A1
公开(公告)日：2006-02-09
申请号：US11240903
申请日：2005-09-30
申请人： Susumu Kondo , Matsuyuki Ogasawara , Ryuzo Iga , Yasuhiro Kondo , Yoshio Noguchi , Masahiro Yuda , Ken Tsuzuki , Satoshi Oku
发明人： Susumu Kondo , Matsuyuki Ogasawara , Ryuzo Iga , Yasuhiro Kondo , Yoshio Noguchi , Masahiro Yuda , Ken Tsuzuki , Satoshi Oku
IPC分类号： H01L21/00
CPC分类号： B82Y20/00 , G02F1/01708 , H01S5/0265 , H01S5/2226 , H01S5/227 , H01S5/3072
摘要： A semiconductor optical device includes a semiconductor substrate and a stacked body formed by at least a first cladding layer, an active region and a second cladding layer; wherein both sides of the stacked body are buried by a burying layer formed by a semi-insulating semiconductor crystal; the burying layer includes a first layer that is placed adjacent to both sides of the stacked body and a second layer that is placed adjacent to the first layer; the first layer includes Ru as a dopant; composition of the second layer is different from the composition of the first layer, or a dopant of the second layer is different from the dopant of the first layer. The device can also be configured such that the width of the active region is smaller than the width of the cladding layers of the stacked body; and a Ru-doped semi-insulating layer is provided in a space between the burying layer and the active region in both sides of the active region.

6. 发明授权

US08721191B2 Optical component 有权
标题翻译：光学元件
公开(公告)号：US08721191B2
公开(公告)日：2014-05-13
申请号：US13813388
申请日：2011-08-02
申请人： Motohaya Ishii , Takashi Yamada , Yoshiyuki Doi , Takashi Saida , Ken Tsuzuki , Takashi Goh , Hiroshi Yamazaki , Shinji Mino , Takao Fukumitsu , Atsushi Murasawa , Fumihiro Ebisawa , Hiroshi Terui , Tomoyo Shibazaki , Yuichi Kikuchi
发明人： Motohaya Ishii , Takashi Yamada , Yoshiyuki Doi , Takashi Saida , Ken Tsuzuki , Takashi Goh , Hiroshi Yamazaki , Shinji Mino , Takao Fukumitsu , Atsushi Murasawa , Fumihiro Ebisawa , Hiroshi Terui , Tomoyo Shibazaki , Yuichi Kikuchi
IPC分类号： G02B6/36
CPC分类号： G02B6/122 , G02B6/30 , G02B6/3897 , G02B6/4267 , G02B6/428 , G02B2006/1204
摘要： In an optical component configured to fix to a mount an optical device chip in which waveguide type optical devices having different thermal expansion coefficients are butt-jointed, deterioration in reliability due to thermal stress is suppressed. The optical component (300) comprises an optical device chip (310) including an LN waveguide (311), a first PLC waveguide (312), a second PLC waveguide (313), and a fiber alignment member (314), a mount (320), and optical fibers (330). Each of connection faces between the first PLC waveguide and the fiber alignment member is configured as an tilted structure, and each of connection faces between the LN waveguide, and the first and second PLC waveguides is configured as a right-angled structure. In the right-angled structure, the connection faces are connected by an adhesive having a lower Young's modulus than that of an adhesive used on the connection faces of the tilted structure.
摘要翻译：在被配置为将具有不同热膨胀系数的波导型光学器件对接的光学器件芯片固定到安装件的光学部件中，抑制了由于热应力引起的可靠性的劣化。光学部件（300）包括光学器件芯片（310），其包括LN波导（311），第一PLC波导（312），第二PLC波导（313）和光纤对准部件（314） 320）和光纤（330）。第一PLC波导和光纤对准部件之间的每个连接面被构造为倾斜结构，并且LN波导与第一和第二PLC波导之间的每个连接面被配置为直角结构。在直角结构中，连接面通过具有比在倾斜结构的连接面上使用的粘合剂的杨氏模量低的粘合剂连接。

7. 发明申请

US20130315524A1 OPTICAL FREQUENCY SHIFTER AND OPTICAL MODULATOR USING THE SAME 有权
标题翻译：光学透镜和使用该光学调制器的光学调制器
公开(公告)号：US20130315524A1
公开(公告)日：2013-11-28
申请号：US13984480
申请日：2012-02-15
申请人： Takashi Saida , Hiroshi Yamazaki , Takashi Goh , Ken Tsuzuki , Shinji Mino
发明人： Takashi Saida , Hiroshi Yamazaki , Takashi Goh , Ken Tsuzuki , Shinji Mino
IPC分类号： G02F1/01
CPC分类号： G02F1/011 , H04B10/5053 , H04B10/548
摘要： An object of the present invention is to provide a temperature-independent optical frequency shifter for generating sub-carriers with a miniaturizable configuration, as well as to provide an all-optical OFDM modulator using the same that is compact, has low temperature dependence, and is even compatible with different frequency grids. Provided is an optical frequency shifter and an optical modulator using the same, the optical frequency shifter comprises one input optical port, a 1-input, 2-output optical coupler optically connected thereto, two Mach-Zehnder modulation units individually optically connected to the two outputs thereof, a 2-input, 2-output optical coupler optically connected to the individual outputs thereof, and two output optical ports optically connected to the outputs thereof, wherein the two Mach-Zehnder modulation units are driven by periodic waveforms at the same frequency whose phases differ from each other by (2p+1) π/2 (p: integer).
摘要翻译：本发明的目的是提供一种用于产生具有小型化配置的子载波的与温度无关的光学移频器，并且提供使用紧凑的，具有低温度依赖性的全光OFDM调制器，以及甚至兼容不同的频率网格。提供一种光学移频器和使用其的光调制器，该光学移频器包括一个输入光端口，与其光学连接的1输入2输出光耦合器，两个马赫 - 曾德调制单元，其光学连接到两个光耦合到其各个输出的2输入2输出光耦合器和与其输出光学连接的两个输出光端口，其中两个马赫 - 策德尔调制单元以相同频率的周期波形驱动其相位彼此不同（2p + 1）pi / 2（p：整数）。

8. 发明申请

US20130136393A1 OPTICAL COMPONENT 有权
标题翻译：光学元件
公开(公告)号：US20130136393A1
公开(公告)日：2013-05-30
申请号：US13813388
申请日：2011-08-02
申请人： Motohaya Ishii , Takashi Yamada , Yoshiyuki Doi , Takashi Saida , Ken Tsuzuki , Takashi Goh , Hiroshi Yamazaki , Shinji Mino , Takao Fukumitsu , Atsushi Murasawa , Fumihiro Ebisawa , Hiroshi Terui , Tomoyo Shibazaki , Yuichi Kikuchi
发明人： Motohaya Ishii , Takashi Yamada , Yoshiyuki Doi , Takashi Saida , Ken Tsuzuki , Takashi Goh , Hiroshi Yamazaki , Shinji Mino , Takao Fukumitsu , Atsushi Murasawa , Fumihiro Ebisawa , Hiroshi Terui , Tomoyo Shibazaki , Yuichi Kikuchi
IPC分类号： G02B6/122
CPC分类号： G02B6/122 , G02B6/30 , G02B6/3897 , G02B6/4267 , G02B6/428 , G02B2006/1204
摘要： In an optical component configured to fix to a mount an optical device chip in which a plurality of waveguide type optical devices having different thermal expansion coefficients are butt-jointed, deterioration in reliability due to thermal stress is suppressed. The optical component (300) comprises an optical device chip (310) including an LN waveguide (311), a first PLC waveguide (312) connected to an end of the LN waveguide (311), a second PLC waveguide (313) connected to the other end of the LN waveguide (311), and a fiber alignment member (314) connected to the first PLC waveguide (312), a mount (320) on which the optical device chip (310) is mounted, and optical fibers (330) aligned to the fiber alignment member (314). Each of connection faces between the first PLC waveguide (312) and the fiber alignment member (314) is configured as an tilted structure, and each of connection faces between the LN waveguide (311), and the first and second PLC waveguides (312, 313) is configured as a right-angled structure. In the right-angled structure, the connection faces are connected by an adhesive having a lower Young's modulus than that of an adhesive used on the connection faces of the tilted structure.
摘要翻译：在构造成将具有不同热膨胀系数的多个波导型光学器件对接的光学器件芯片固定到安装件的光学部件中，抑制了由于热应力引起的可靠性的劣化。光学部件（300）包括光学器件芯片（310），其包括LN波导（311），连接到LN波导（311）的一端的第一PLC波导（312），连接到 LN波导311的另一端和与第一PLC波导312连接的光纤对准部314，安装光器件芯片310的安装座320和光纤 330）对准到光纤对准部件（314）。第一PLC波导（312）与光纤对准部件（314）之间的各连接面构成为倾斜结构，并且LN波导311与第一和第二PLC波导312和312之间的各连接面， 313）被配置为直角结构。在直角结构中，连接面通过具有比在倾斜结构的连接面上使用的粘合剂的杨氏模量低的粘合剂连接。

9. 发明申请

US20130011095A1 OPTICAL COMPONENT 有权
标题翻译：光学元件
公开(公告)号：US20130011095A1
公开(公告)日：2013-01-10
申请号：US13582954
申请日：2011-03-09
申请人： Motohaya Ishii , Naoki Ooba , Kazunori Seno , Yoshiyuki Doi , Ken Tsuzuki , Takao Fukumitsu , Atsushi Murasawa , Fumihiro Ebisawa , Hiroshi Terui , Tomoyo Shibazaki , Yuichi Kikuchi
发明人： Motohaya Ishii , Naoki Ooba , Kazunori Seno , Yoshiyuki Doi , Ken Tsuzuki , Takao Fukumitsu , Atsushi Murasawa , Fumihiro Ebisawa , Hiroshi Terui , Tomoyo Shibazaki , Yuichi Kikuchi
IPC分类号： G02B6/122 , G02B6/10
CPC分类号： G02B6/12009 , G02B6/12033 , G02B6/30 , G02B6/3508 , G02B6/3616
摘要： In an optical component, a part of a waveguide type optical device is fixed to a convex portion of a mount. The optical component includes an optical support base, a pressure member and a pressure support base. The optical device support base is interposed between the mount and the presser member enough to be slidable in a direction parallel to surfaces of the mount and the presser member.
摘要翻译：在光学部件中，波导型光学元件的一部分固定在基座的凸部。光学部件包括光学支撑基座，压力部件和压力支撑基座。光学装置支撑基座插入在支架和压紧构件之间，足以在平行于安装件和压紧构件的表面的方向上滑动。

10. 发明授权

US08031984B2 Semiconductor optical modulator 有权
标题翻译：半导体光调制器
公开(公告)号：US08031984B2
公开(公告)日：2011-10-04
申请号：US12445616
申请日：2007-10-24
申请人： Tadao Ishibashi , Nobuhiro Kikuchi , Ken Tsuzuki
发明人： Tadao Ishibashi , Nobuhiro Kikuchi , Ken Tsuzuki
IPC分类号： G02F1/025
CPC分类号： G02F1/017 , B82Y20/00 , G02F1/025 , G02F2202/101
摘要： The present invention can provide an npin-type optical modulator that has a high withstand voltage and is easily fabricated. A semiconductor optical amplifier (10) according to an embodiment of the present invention is an npin-type semiconductor optical modulator in which layers are sequentially stacked, with a cathode layer (12-1) arranged on the substrate side, including at least a first n-type cladding layer (13-1), a p-type cladding layer (14), a core layer (17) and a second n-type cladding layer (13-2). In this semiconductor optical modulator, the p-type cladding layer (14) is electrically connected to an electrode (18-1) of the cathode layer. Accordingly, the accumulation of holes in the p-type cladding layer associated with light absorption in the npin-type optical modulator can be absorbed in the electrode on the negative side. This npin-type semiconductor optical modulator can be comparatively easily fabricated using conventional semiconductor manufacturing techniques by adopting a mesa type waveguide structure.
摘要翻译：本发明可以提供一种耐压高且易于制造的npin型光调制器。根据本发明的实施例的半导体光放大器（10）是其中依次堆叠层的衬底型半导体光调制器，其中布置在衬底侧上的阴极层（12-1）包括至少第一 n型包覆层（13-1），p型包覆层（14），芯层（17）和第二n型包覆层（13-2）。在该半导体光调制器中，p型覆层（14）与阴极层的电极（18-1）电连接。因此，能够在负极侧的电极中吸收与npin型光调制器中的光吸收有关的p型覆层的空穴积聚。通过采用台面型波导结构，可以使用常规的半导体制造技术相对容易地制造该npin型半导体光调制器。

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