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    • 5. 发明申请
    • POLISHING APPARATUS AND POLISHING METHOD
    • 抛光装置和抛光方法
    • US20120252320A1
    • 2012-10-04
    • US13073218
    • 2011-03-28
    • Masaya SekiTetsuji TogawaMasayuki Nakanishi
    • Masaya SekiTetsuji TogawaMasayuki Nakanishi
    • B24B1/00
    • B24B21/002B24B9/065B24B21/20H01L21/30625H01L21/67092H01L21/67259H01L21/68H01L21/84H01L22/20
    • The polishing apparatus has a polishing unit capable of forming a right-angled cross section by polishing a peripheral portion of the substrate. The polishing unit includes a polishing head having a pressing member configured to press a polishing tape against the peripheral portion of the substrate from above, a tape supply and recovery mechanism configured to supply the polishing tape to the polishing head and to recover the polishing tape from the polishing head, a first moving mechanism configured to move the polishing head in a radial direction of the substrate, and a second moving mechanism configured to move the tape supply and recovery mechanism in the radial direction of the substrate. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate.
    • 抛光装置具有能够通过抛光基板的周边部分而形成直角横截面的抛光单元。 抛光单元包括:抛光头,其具有被配置成从上方将研磨带压靠在基板的周边部分上的按压构件,配置成将抛光带供给到抛光头并将抛光带从 抛光头,构造成沿着基板的径向方向移动抛光头的第一移动机构和被配置为沿着基板的径向移动带供给和恢复机构的第二移动机构。 引导辊布置成使得抛光带平行于基板的切线方向延伸,并且抛光带的抛光表面平行于基板的表面。