会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Radiation temperature measuring method and radiation temperature measuring system
    • 辐射温度测量方法和辐射温度测量系统
    • US06488407B1
    • 2002-12-03
    • US09527243
    • 2000-03-17
    • Masayuki KitamuraEisuke MorisakiNobuaki TakahashiTakashi Shigeoka
    • Masayuki KitamuraEisuke MorisakiNobuaki TakahashiTakashi Shigeoka
    • G01J500
    • G01J5/0003G01J5/0007G01J5/08G01J5/0818G01J5/0887G01J5/0896G01J2005/0051G01J2005/0077
    • The present invention intends to improve the accuracy of temperature measurement when measuring the temperature of a semiconductor wafer by a radiation thermometer on the basis of the idea of virtual blackbody simulated by multiple reflection of light. A system includes a wafer (W), a circular reflector 1 of a radius R disposed opposite to the wafer (W), and a probe (2) disposed in a through hole formed in the reflector (1). The probe (2) is a through hole. The radiation intensity of radiation passed the through hole is determined by image data provided by a CCD camera disposed behind the back surface of the reflector (1). An error in measured radiation intensity of radiation falling the probe (2) due to light that enters a space between the wafer (W) and the reflector (1) and a space between the reflector (1) and the probe (2) and light leaks from the same spaces is corrected, the emissivity of the wafer (W) is calculated and the temperature of the wafer (W) is determined.
    • 本发明旨在通过基于由多次反射光模拟的虚拟黑体的想法,通过辐射温度计测量半导体晶片的温度来提高温度测量的精度。 系统包括晶片(W),与晶片(W)相对设置的半径为R的圆形反射器1和设置在形成于反射器(1)中的通孔中的探针(2)。 探针(2)是通孔。 通过通孔的辐射的辐射强度由设置在反射器(1)的后表面后面的CCD照相机提供的图像数据确定。 由于进入晶片(W)和反射器(1)之间的空间的光以及反射器(1)和探针(2)之间的空间以及光线(2)引起的探测器(2)的测量辐射强度的误差 校正相同空间的泄漏,计算晶片的发射率(W),并确定晶片(W)的温度。
    • 2. 发明授权
    • Virtual blackbody radiation system and radiation temperature measuring system
    • 虚拟黑体辐射系统和辐射温度测量系统
    • US06467952B2
    • 2002-10-22
    • US09527239
    • 2000-03-16
    • Eisuke MorisakiMasayuki KitamuraNobuaki TakahashiTakashi Shigeoka
    • Eisuke MorisakiMasayuki KitamuraNobuaki TakahashiTakashi Shigeoka
    • G01K1500
    • G01J5/522
    • A virtual blackbody radiation system (10) includes a light-emitting unit (1) including an LED driven by a fixed current, a light-receiving unit (2) including a sapphire rod, and an optical unit (3) including lenses (31, 32) for converging light emitted by the light-emitting unit in a convergent light. A cylindrical member (41)included in the optical unit (3)can be moved along the optical axis by a servomotor (42) included in a focus adjusting unit (4) for positional adjustment. The focus of convergent light relative to the light-receiving unit (2) can be adjusted by moving the lens (32) disposed in the cylindrical member (41) along the optical axis relative to the light-receiving unit (2). The intensity of the convergent light on the light-receiving unit (2) can be adjusted to the intensity of predetermined blackbody radiation. Thus, the virtual blackbody radiation system (10) is able to obtain light of a desired intensity without changing the driving current for driving a light source; consequently, the life time of the light source can be extended and the stability of radiation can be improved.
    • 虚拟黑体辐射系统(10)包括包括由固定电流驱动的LED的发光单元(1),包括蓝宝石棒的光接收单元(2)和包括透镜(31)的光学单元(3) ,32),用于会聚由所述发光单元发射的光。 包括在光学单元(3)中的圆柱形构件(41)可以通过包括在聚焦调节单元(4)中的伺服电动机(42)沿光轴移动,用于位置调节。 可以通过相对于光接收单元(2)沿着光轴移动设置在圆柱形构件(41)中的透镜(32)来调节相对于光接收单元(2)的会聚光的聚焦。 光接收单元(2)上的会聚光的强度可以被调整到预定黑体辐射的强度。 因此,虚拟黑体辐射系统(10)能够在不改变用于驱动光源的驱动电流的情况下获得所需强度的光; 因此,可以延长光源的寿命并且可以提高辐射的稳定性。
    • 3. 发明授权
    • Thermal treatment method and apparatus
    • 热处理方法及装置
    • US06473993B1
    • 2002-11-05
    • US09537768
    • 2000-03-30
    • Yasushi YagiTakeshi SakumaWataru OkaseMasayuki KitamuraHironori YagiEisuke Morisaki
    • Yasushi YagiTakeshi SakumaWataru OkaseMasayuki KitamuraHironori YagiEisuke Morisaki
    • F26B304
    • H01L21/67109
    • A semiconductor wafer is mounted on a susceptor disposed in a processing chamber, the wafer is heated at a temperature on the order of 1000° C. for annealing, and a gas is supplied from a gas supply device disposed opposite to the wafer. When raising the temperature of the wafer and/or when lowering the temperature of the wafer, intra-surface temperature difference is limited to a small value to suppress the occurrence of slips. A gas supply device is divided into sections corresponding to a central part and a peripheral part, respectively, of the wafer to supply the gas at different flow rates onto the central part and the peripheral part, respectively. When raising the temperature of the wafer, for example, a gas of a temperature higher (lower) than that of the wafer is supplied at a flow rate per unit area greater (lower) than that at which the gas is supplied to the peripheral part to the central part. When lowering the temperature of the wafer, for example, a gas of a temperature higher (lower) than that of the wafer is supplied at a flow rate per unit area lower (higher) than that at which the gas is supplied to the peripheral part to the central part.
    • 将半导体晶片安装在设置在处理室中的基座上,将晶片在约1000℃的温度下加热退火,并且从与晶片相对设置的气体供给装置供给气体。 当提高晶片的温度和/或当降低晶片的温度时,将表面内温度差限制在较小的值以抑制滑移的发生。 气体供给装置分别对应于晶片的中心部分和周边部分,以将不同流量的气体分别供应到中心部分和周边部分。 当提高晶片的温度时,例如以比晶片的温度更高(低于)的温度的气体以比将气体供应到周边部分的流量更大(下) 到中部。 当降低晶片的温度时,例如以比晶片的温度更高(更低)的温度的气体以比供应气体的周边部分低的(高)的单位面积的流量被供给 到中部。