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    • 9. 发明申请
    • SUBSTRATE COOLING DEVICE, SUBSTRATE COOLING METHOD AND HEAT TREATMENT APPARATUS
    • 基板冷却装置,基板冷却方法和热处理装置
    • US20130062035A1
    • 2013-03-14
    • US13597513
    • 2012-08-29
    • Masato KawakamiHiromi NitadoriYun Mo
    • Masato KawakamiHiromi NitadoriYun Mo
    • F27D9/00F24F7/00
    • H01L21/67757H01L21/67109
    • A substrate cooling device includes a cylindrical heat shielding member 30 configured to be movable between an insertion position where the heat shielding member 30 is inserted between the substrate holding member 15 in a processing vessel 11 and a heating member 12 and an unloading position where the heat shielding member 30 is unloaded from the insertion position, and configured to block radiant heat toward the substrates W after completing a heat treatment; and an air cooling port 21 provided at an outside of the processing vessel 11. The heat shielding member 30 includes two half-cylindrical members 31 that are assembled and separated at the unloading position, and is movable between the unloading position and the insertion position. An outer surface and an inner surface of the heat shielding member 30 are made of materials having a relatively low emissivity and a relatively high emissivity, respectively.
    • 基板冷却装置包括圆筒形的热屏蔽构件30,该圆筒形的热屏蔽构件30能够在热屏蔽构件30插入处理容器11中的基板保持构件15和加热构件12之间的插入位置与加热构件12的卸载位置之间移动 遮蔽构件30从插入位置卸载,并且构造成在完成热处理之后阻挡朝向基板W的辐射热; 以及设置在处理容器11的外侧的空气冷却端口21.隔热构件30包括在卸载位置组装和分离的两个半圆柱形构件31,并且可在卸载位置和插入位置之间移动。 隔热构件30的外表面和内表面分别由具有相对低的发射率和相对高的发射率的材料制成。