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1. 发明授权

US07985285B2 Electroless gold plating bath, electroless gold plating method and electronic parts 有权
标题翻译：化学镀金，化学镀金方法及电子零件
公开(公告)号：US07985285B2
公开(公告)日：2011-07-26
申请号：US11987880
申请日：2007-12-05
申请人： Masayuki Kiso , Yukinori Oda , Seigo Kurosaka , Tohru Kamitamari , Yoshikazu Saijo , Katsuhisa Tanabe
发明人： Masayuki Kiso , Yukinori Oda , Seigo Kurosaka , Tohru Kamitamari , Yoshikazu Saijo , Katsuhisa Tanabe
IPC分类号： C23C18/44 , B05D1/18
CPC分类号： C23C18/44 , C23C18/54
摘要： An electroless gold plating bath includes a water-soluble gold compound, a complexing agent, a formaldehyde metabisulfite adduct, and an amine compound represented by R1—NH—C2H4—NH—R2 or (CH2—NH—C2H4—NH—CH2)n—R4 (wherein R1 to R4 represent —OH, —CH3, —CH2OH, —C2H4OH, —CH2N(CH3)2, —CH2NH(CH2OH), —CH2NH(C2H4OH), —C2H4NH(CH2OH), —C2H4NH(C2H4OH), —CH2N(CH2OH)2, —CH2N(C2H4OH)2, —C2H4N(CH2OH)2 or —C2H4N(C2H4OH)2, and n is an integer of 1 to 4). A gold plated coating of a good appearance can be formed without causing a failure in appearance owing to the progress of intergranular corrosion in a nickel surface.
摘要翻译：化学镀金浴包括水溶性金化合物，络合剂，偏亚硫酸氢甲酯加成物和由R1-NH-C2H4-NH-R2或（CH2-NH-C2H4-NH-CH2）n表示的胺化合物 -R4（其中R1至R4表示-OH，-CH3，-CH2OH，-C2H4OH，-CH2N（CH3）2，-CH2NH（CH2OH），-CH2NH（C2H4OH），-C2H4NH（CH2OH），-C2H4NH（C2H4OH），-CH 2 N（CH 2 OH）2，-CH 2 N（C 2 H 4 OH）2，-C 2 H 4 N（CH 2 OH）2或-C 2 H 4 N（C 2 H 4 OH）2，n为1〜4的整数）。可以形成良好外观的镀金涂层，而不会由于镍表面的晶间腐蚀的进行而导致外观不良。

2. 发明申请

US20080138506A1 Electroless gold plating bath, electroless gold plating method and electronic parts 有权
标题翻译：化学镀金，化学镀金方法及电子零件
公开(公告)号：US20080138506A1
公开(公告)日：2008-06-12
申请号：US11987880
申请日：2007-12-05
申请人： Masayuki Kiso , Yukinori Oda , Seigo Kurosaka , Tohru Kamitamari , Yoshikazu Saijo , Katsuhisa Tanabe
发明人： Masayuki Kiso , Yukinori Oda , Seigo Kurosaka , Tohru Kamitamari , Yoshikazu Saijo , Katsuhisa Tanabe
IPC分类号： C23C18/32 , C23C18/42 , C23C18/54
CPC分类号： C23C18/44 , C23C18/54
摘要： An electroless gold plating bath includes a water-soluble gold compound, a complexing agent, a formaldehyde metabisulfite adduct, and an amine compound represented by R1—NH—C2H4—NH—R2 or (CH2—NH—C2H4—NH—CH2)n—R4 (wherein R1 to R4 represent —OH, —CH3, —CH2OH, —C2H4OH, —CH2N(CH3)2, —CH2NH(CH2OH), —CH2NH(C2H4OH), —C2H4NH(CH2OH), —C2H4NH(C2H4OH), —CH2N(CH2OH)2, —CH2N(C2H4OH)2, —C2H4N(CH2OH)2 or —C2H4N(C2H4OH)2, and n is an integer of 1 to 4).A gold plated coating of a good appearance can be formed without causing a failure in appearance owing to the progress of intergranular corrosion in a nickel surface.
摘要翻译：无电镀金浴包括水溶性金化合物，络合剂，偏亚硫酸氢甲酯加成物和由R 1 -NH-C 2 H表示的胺化合物 4-NH-R 2或（CH 2 -NH-C 2 H 4）（其中R 1至R 4）其中R 1至R 4（其中R 1至R 4） -CH 3，-OH，-CH 2，-SO 2 H，CH 2 CH 2， OH，-CH 2 N（CH 3）2 - ， - CH 2 NH（CH 2） OH），-CH 2 NH（C 2 H 4 OH），-C 2 - H 2 NH（CH 2 OH），-C 2 H 4 NH（C 2 H 2） H 2 OH，-CH 2 N（CH 2 OH）2，-CH 2， N 2 C 2 H 2 H 2，H 2 H 2， N 2（CH 2 OH）2或-C 2 H 4 H（N） C 2 H 4 OH）2，n为1〜4的整数。可以形成良好外观的镀金涂层，而不会由于镍表面的晶间腐蚀的进行而导致外观不良。

3. 发明授权

US07988773B2 Electroless gold plating bath, electroless gold plating method and electronic parts 有权
标题翻译：化学镀金，化学镀金方法及电子零件
公开(公告)号：US07988773B2
公开(公告)日：2011-08-02
申请号：US11987881
申请日：2007-12-05
申请人： Masayuki Kiso , Yoshikazu Saijo , Tohru Kamitamari
发明人： Masayuki Kiso , Yoshikazu Saijo , Tohru Kamitamari
IPC分类号： C23C18/44 , B05D1/18
CPC分类号： C23C18/54 , C23C18/44
摘要： An electroless gold plating bath includes a water-soluble gold compound, a complexing agent, an aldehyde compound, and an amine compound represented by R1—NH—C2H4—NH—R2 or (CH2—NH—C2H4—NH—CH2)n—R4 (wherein R1 to R4 represent —OH, —CH3, —CH2OH, —C2H4OH, —CH2N(CH3)2, —CH2NH(CH2OH), —CH2NH(C2H4OH), —C2H4NH(CH2OH), —C2H4NH(C2H4OH), —CH2N(CH2OH)2, —CH2N(C2H4OH)2, —C2H4N(CH2OH)2 or —C2H4N(C2H4OH)2, and n is an integer of 1 to 4). The electroless gold plating can be carried out without corrosion of an underlying metal to be plated at a stable deposition rate. Because of the high deposition rate and the immersion and reduction types, thickening of a plated coating is possible in one solution and the color of the coating is not degraded to provide a good appearance while keeping a lemon yellow color inherent to gold.
摘要翻译：化学镀金浴包括水溶性金化合物，络合剂，醛化合物和由R1-NH-C2H4-NH-R2或（CH2-NH-C2H4-NH-CH2）n- R4（其中R1至R4表示-OH，-CH3，-CH2OH，-C2H4OH，-CH2N（CH3）2，-CH2NH（CH2OH），-CH2NH（C2H4OH），-C2H4NH（CH2OH），-C2H4NH（C2H4OH） -CH 2 N（CH 2 OH）2，-CH 2 N（C 2 H 4 OH）2，-C 2 H 4 N（CH 2 OH）2或-C 2 H 4 N（C 2 H 4 OH）2，n为1〜4的整数。化学镀金可以在不会以稳定的沉积速率进行电镀的基底金属的腐蚀下进行。由于沉积速度快，浸渍和还原的种类，镀层可以在一种溶液中增稠，涂层的颜色也不会降解，同时保持黄金固有的柠檬黄色。

4. 发明申请

US20080138507A1 Electroless gold plating bath, electroless gold plating method and electronic parts 有权
标题翻译：化学镀金，化学镀金方法及电子零件
公开(公告)号：US20080138507A1
公开(公告)日：2008-06-12
申请号：US11987881
申请日：2007-12-05
申请人： Masayuki Kiso , Yoshikazu Saijo , Tohru Kamitamari
发明人： Masayuki Kiso , Yoshikazu Saijo , Tohru Kamitamari
IPC分类号： C23C18/32 , C23C18/42 , C23C18/54
CPC分类号： C23C18/54 , C23C18/44
摘要： An electroless gold plating bath includes a water-soluble gold compound, a completing agent, an aldehyde compound, and an amine compound represented by R1—NH—C2H4—NH—R2 or (CH2—NH—C2H4—NH—CH2)n—R4 (wherein R1 to R4 represent —OH, —CH3, —CH2OH, —C2H4OH, —CH2N(CH3)2, —CH2NH(CH2OH), CH2NH(C2H4OH), —C2H4NH(CH2OH), —C2H4NH(C2H4OH), —CH2N(CH2OH)2, —CH2N(C2H4OH)2, —C2H4N(CH2OH)2 or —C2H4N(C2H4OH)2, and n is an integer of 1 to 4).The electroless gold plating can be carried out without corrosion of an underlying metal to be plated at a stable deposition rate. Because of the high deposition rate and the immersion and reduction types, thickening of a plated coating is possible in one solution and the color of the coating is not degraded to provide a good appearance while keeping a lemon yellow color inherent to gold.
摘要翻译：无电镀金浴包括水溶性金化合物，完成剂，醛化合物和由R 1 -NH-C 2 H表示的胺化合物，（3）-NH-R 2或（CH 2 -NH-C 2 H 4）2 / （其中R 1至R 4）其中R 1，R 2，R 3，R 3，R 4， / SUB>表示-OH，-CH 3，-CH 2 OH，-C 2 H 4 OH ，-CH 2 N（CH 3）2，-CH 2 NH（CH 2）2， OH），CH 2 NH（C 2 H 4 OH），-C 2 H 2， NH 2（CH 2 OH），-C 2 H 4 NH（C 2 H 2） H 2 OH，-CH 2 N（CH 2 OH）2，-CH 2， 2 N（C 2 H 4 OH）2 N 2，-C 2 H 2， 4 N（CH 2 OH）2或-C 2 H 4 N（C 1 -C 6烷基） 2个H 4 OH，2个，n为1〜4的整数）。化学镀金可以在不会以稳定的沉积速率进行电镀的基底金属的腐蚀下进行。由于沉积速度快，浸渍和还原的种类，镀层可以在一种溶液中增稠，涂层的颜色也不会降低，同时保持黄金固有的柠檬黄色。

5. 发明申请

US20140339463A1 DESMEAR SOLUTION AND DESMEAR METHOD 审中-公开
标题翻译： DESMEAR解决方案和DESMEAR方法
公开(公告)号：US20140339463A1
公开(公告)日：2014-11-20
申请号：US14345618
申请日：2012-09-11
申请人： Yoshikazu Saijo , Hisamitsu Yamamoto , Masayuki Utsumi
发明人： Yoshikazu Saijo , Hisamitsu Yamamoto , Masayuki Utsumi
IPC分类号： C09K13/02 , H05K3/00
CPC分类号： C09K13/02 , H05K3/0055 , H05K3/381 , H05K2203/0793 , H05K2203/0796
摘要： The present invention provides a desmear solution and a desmear method using said desmear solution, the desmear solution being capable of certainly removing a smear inside a non-through hole formed in a resin substrate and also capable of forming a plating film excellent in adhesion without excessive roughening of a surface of the resin substrate. The present invention uses the desmear solution containing a permanganate having a concentration of 0.2 to 0.4 mol/L and an alkali metal hydroxide and having a molar concentration ratio of said permanganate to said alkali metal hydroxide of 1:5 to 1:20.
摘要翻译：本发明提供一种使用所述去污溶液的去污解决方案和去污方法，所述去污溶液能够可靠地除去形成在树脂基材中的非通孔内的污迹，并且还能够形成无粘附性优异的电镀膜使树脂基板的表面粗糙化。本发明使用含有浓度为0.2〜0.4mol / L的高锰酸盐和碱金属氢氧化物并且所述高锰酸盐与所述碱金属氢氧化物的摩尔浓度比为1:5〜1:20的去污溶液。

6. 发明申请

US20120167916A1 NEUTRALIZING/REDUCING AGENT, AND DESMEAR METHOD 审中-公开
标题翻译：中和/还原剂和DESMEAR方法
公开(公告)号：US20120167916A1
公开(公告)日：2012-07-05
申请号：US13395201
申请日：2010-09-24
申请人： Yoshikazu Saijo , Hisamitsu Yamamoto , Masayuki Utsumi
发明人： Yoshikazu Saijo , Hisamitsu Yamamoto , Masayuki Utsumi
IPC分类号： B08B3/08 , C11D7/60
CPC分类号： H05K3/0055 , H05K2203/0796 , H05K2203/122
摘要： Disclosed is a neutralizing/reducing agent for neutralizing/reducing an oxidizing agent component that is adsorbed and remains on an object to be coated after the object is subjected to a desmear treatment with the oxidizing agent, which comprises a thioamide compound and a non-aromatic thiol compound. The neutralizing/reducing agent does not generate any gas during a neutralization/reduction treatment, and therefore the occurrence of defects caused by the neutralization/reduction on the surface of a through hole or a blind via hole can be prevented. Further, the neutralizing/reducing agent hardly dissolves copper, and therefore the occurrence of haloing can be prevented, and the blistering caused by the etching between an inner layer copper and a resin with the neutralizing/reducing agent can also be prevented.
摘要翻译：公开了一种用于中和/还原氧化剂组分的中和/还原剂，该氧化剂组分在物体被氧化剂进行去污处理之后被吸附并保留在待涂覆的物体上，该氧化剂包括硫代酰胺化合物和非芳族化合物硫醇化合物。中和/还原剂在中和/还原处理期间不产生任何气体，因此可以防止由通孔或盲通孔的表面上的中和/还原引起的缺陷的发生。此外，中和还原剂几乎不溶解铜，因此可以防止卤化的发生，并且还可以防止由内层铜和具有中和/还原剂的树脂之间的腐蚀引起的起泡。

7. 发明授权

US06406750B1 Process of forming catalyst nuclei on substrate, process of electroless-plating substrate, and modified zinc oxide film 失效
标题翻译：在基板上形成催化剂核的过程，无电镀基板的工艺和改性的氧化锌膜
公开(公告)号：US06406750B1
公开(公告)日：2002-06-18
申请号：US09580557
申请日：2000-05-30
申请人： Masanobu Izaki , Hiroshi Hatase , Yoshikazu Saijo
发明人： Masanobu Izaki , Hiroshi Hatase , Yoshikazu Saijo
IPC分类号： B05D118
CPC分类号： C23C18/1889
摘要： A substrate includes a non-conductive portion to be electroless-plated of a substrate, on the surface of which fine metal catalyst particles composed of silver nuclei and palladium nuclei each having an average particle size of 1 nm or less adhere at a high nuclei density of 2000 nuclei/&mgr;m2 or more. The metal catalyst particles are produced by sensitizing the non-conductive portion of the substrate by dipping the substrate in a sensitizing solution containing bivalent tin ions, activating the non-conductive portion of the substrate by dipping the substrate in a first activator containing silver ions, and activating the non-conductive portion of the substrate by dipping the substrate in a second activator containing palladium ions.
摘要翻译：基板包括基板无电镀的非导电部分，其表面上具有平均粒径为1nm以下的银核和钯核的细金属催化剂粒子以高核密度粘附的2000核/ mum2以上。金属催化剂颗粒通过将基板浸渍在含有二价锡离子的敏化溶液中而使基板的非导电部分感光来制造，通过将基板浸渍在含有银离子的第一活化剂中来活化基板的非导电部分，以及通过将衬底浸入含有钯离子的第二活化剂来活化衬底的非导电部分。

8. 发明授权

US09045836B2 Electrolytic regeneration device 有权
标题翻译：电解再生装置
公开(公告)号：US09045836B2
公开(公告)日：2015-06-02
申请号：US13218855
申请日：2011-08-26
申请人： Yoshikazu Saijo , Hisamitsu Yamamoto , Takahiro Ishizaki
发明人： Yoshikazu Saijo , Hisamitsu Yamamoto , Takahiro Ishizaki
IPC分类号： C25B1/28 , C25B15/08 , H05K3/00
CPC分类号： C25B1/28 , C25B15/08 , H05K3/0055
摘要： The regeneration unit includes a tubular portion having the inner circumferential surface functioning as an anode, and a cathode provided inside the tubular portion and extending along the extension direction of the tubular portion in a state of separation from the inner circumferential surface. The treatment liquid used for desmearing treatment is fed through a gap between the inner circumferential surface of the tubular portion and the cathode. A feed-side conduit is connected by a downstream end portion thereof to the tubular portion and guides the treatment liquid discharged from a desmearing treatment tank into a regeneration unit. A return-side conduit is connected by an upstream end portion thereof to the tubular portion and guides the treatment liquid discharged from the regeneration unit into the desmearing treatment tank.
摘要翻译：再生单元包括具有用作阳极的内周面的管状部分和设置在管状部分内部并且在与内周表面分离的状态下沿管状部分的延伸方向延伸的阴极。用于除污处理的处理液通过管状部分的内周表面和阴极之间的间隙进料。进料侧导管通过其下游端部与管状部连接，将从脱盐处理槽排出的处理液引导到再生部。返回侧导管由其上游端部与管状部连接，将从再生部排出的处理液引导到除污处理槽内。

9. 发明授权

US08877020B2 Electrolytic regeneration unit and electrolytic regeneration apparatus using same 有权
标题翻译：电解再生装置及使用其的电解再生装置
公开(公告)号：US08877020B2
公开(公告)日：2014-11-04
申请号：US13478873
申请日：2012-05-23
申请人： Hisamitsu Yamamoto , Masayuki Utsumi , Yoshikazu Saijo , Tomoji Okuda , Hiroki Omura
发明人： Hisamitsu Yamamoto , Masayuki Utsumi , Yoshikazu Saijo , Tomoji Okuda , Hiroki Omura
IPC分类号： C25B9/00 , C25B1/21 , C25B1/28
CPC分类号： C25B1/21 , C25B1/28 , C25B9/00
摘要： An anode pipe includes a main pipe portion and a secondary pipe portion. The anode pipe has an inner circumferential surface that functions as an anode. The main pipe portion has a first connection end portion and a second connection end portion. The main pipe portion forms a flow channel for a treatment liquid that continues from the first connection end portion to the second connection end portion. The secondary pipe portion extends in a tubular fashion from the intermediate section of the main pipe portion. The interior of the secondary pipe portion communicates with the flow channel inside the main pipe portion. The cathode is disposed at a distance from the inner circumferential surface of the anode pipe. The cathode extends from a cathode attachment end portion toward the main pipe portion inside the secondary pipe portion.
摘要翻译：阳极管包括主管部分和次管部分。阳极管具有用作阳极的内周面。主管部分具有第一连接端部和第二连接端部。主管部形成从第一连接端部向第二连接端部连续的处理液的流路。次管部分以管状方式从主管部分的中间部分延伸。第二管部的内部与主管部内部的流路连通。阴极配置在距离阳极管的内周面一定距离处。阴极从第二管部分的阴极附着端部向主管部延伸。

10. 发明授权

US06723679B2 Process of forming catalyst nuclei on substrate, process of electroless-plating substrate, and modified zinc oxide film 失效
标题翻译：在基板上形成催化剂核的过程，无电镀基板的工艺和改性的氧化锌膜
公开(公告)号：US06723679B2
公开(公告)日：2004-04-20
申请号：US10120393
申请日：2002-04-12
申请人： Masanobu Izaki , Hiroshi Hatase , Yoshikazu Saijo
发明人： Masanobu Izaki , Hiroshi Hatase , Yoshikazu Saijo
IPC分类号： B01J2358
CPC分类号： C23C18/1889
摘要： A substrate includes a non-conductive portion to be electroless-plated of a substrate, on the surface of which fine metal catalyst particles composed of silver nuclei and palladium nuclei each having an average particle size of 1 nm or less adhere at a high nuclei density of 2000 nuclei/&mgr;m2 or more. The metal catalyst particles are produced by sensitizing the non-conductive portion of the substrate by dipping the substrate in a sensitizing solution containing bivalent tin ions, activating the non-conductive portion of the substrate by dipping the substrate in a first activator containing silver ions, and activating the non-conductive portion of the substrate by dipping the substrate in a second activator containing palladium ions.
摘要翻译：基板包括基板无电镀的非导电部分，其表面上具有平均粒径为1nm以下的银核和钯核的细金属催化剂粒子以高核密度粘附的2000核/ mum2以上。金属催化剂颗粒通过将基板浸渍在含有二价锡离子的敏化溶液中而使基板的非导电部分感光来制造，通过将基板浸渍在含有银离子的第一活化剂中来活化基板的非导电部分，以及通过将衬底浸入含有钯离子的第二活化剂来活化衬底的非导电部分。

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