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1. 发明申请

US20220275516A1 Pretreatment Method for Electroless Plating, and Pretreatment Solution for Electroless Plating 有权
公开(公告)号：US20220275516A1
公开(公告)日：2022-09-01
申请号：US17631837
申请日：2020-06-03
申请人： Tetsuji Ishida , Hisamitsu Yamamoto , Ryoyu Shimizu
发明人： Tetsuji Ishida , Hisamitsu Yamamoto , Ryoyu Shimizu
IPC分类号： C23C18/24 , B01J23/44 , C23C18/20
摘要： The purpose of the present invention is to provide a pretreatment method for electroless plating and a pretreatment solution for electroless plating capable of increasing an adsorption amount of a catalyst. A pretreatment method for electroless plating for performing an electroless plating on a substrate, the pretreatment method at least comprises: a cleaner process S10; a soft etching process S20 and/or an acid treatment process S30; a catalyst imparting process S40; and a catalyst reducing process S50, wherein an anionic surfactant for ionizing a part of a hydrophilic group to an anion is added to a treatment solution used in the soft etching process S20 and/or the acid treatment process S30, an ionic catalyst is imparted on the substrate in the catalyst imparting process S40, and the ionic catalyst is reduced in the catalyst reducing process S50 to increase an adsorption amount of the catalyst on the substrate.

2. 发明授权

US08992756B2 Direct plating method and solution for palladium conductor layer formation 有权
标题翻译：直接电镀法和钯导体层形成方法
公开(公告)号：US08992756B2
公开(公告)日：2015-03-31
申请号：US12513611
申请日：2006-11-06
申请人： Hisamitsu Yamamoto
发明人： Hisamitsu Yamamoto
IPC分类号： C25D5/02 , C23C18/44 , C25D5/56 , H05K3/18 , H05K3/42 , C23C18/16 , C23C18/20 , C23C18/30 , H05K1/03
CPC分类号： C23C18/44 , C23C18/1653 , C23C18/2086 , C23C18/30 , C25D5/02 , C25D5/56 , H05K1/0346 , H05K3/181 , H05K3/422 , H05K3/427 , H05K2201/0344 , H05K2203/124
摘要： A surface of an object to be plated is subjected to a treatment for palladium catalyst impartation to impart a palladium catalyst to the surface of an insulating part thereof. A palladium conductor layer is formed on the insulating part from a solution for palladium conductor layer formation which contains a palladium compound, an amine compound, and a reducing agent. On the palladium conductor layer is then directly formed a copper deposit by electroplating. Thus, the work is converted to a conductor with the solution for palladium conductor layer formation, which is neutral, without using an electroless copper plating solution which is highly alkaline. Consequently, the polyimide is prevented from being attacked and no adverse influence is exerted on adhesion. By adding an azole compound to the solution for palladium conductor layer formation, a palladium conductor layer is prevented from depositing on copper.
摘要翻译：对被镀物体的表面进行钯催化剂的处理，将钯催化剂赋予其绝缘部分的表面。在包含钯化合物，胺化合物和还原剂的钯导体层形成用溶液的绝缘部上形成钯导体层。然后在钯导体层上通过电镀直接形成铜沉积物。因此，不用使用高碱性化学镀铜溶液，将工件转化为具有中性的钯导体层形成溶液的导体。因此，防止聚酰亚胺受到攻击，并且不会对粘合产生不利影响。通过向溶液中添加唑化合物以形成钯导体层，可以防止钯导体层沉积在铜上。

3. 发明申请

US20120298505A1 ELECTROLYTIC REGENERATION UNIT AND ELECTROLYTIC REGENERATION APPARATUS USING SAME 有权
标题翻译：电解再生装置和电解再生装置
公开(公告)号：US20120298505A1
公开(公告)日：2012-11-29
申请号：US13478873
申请日：2012-05-23
申请人： Hisamitsu YAMAMOTO , Masayuki UTSUMI , Yoshikazu SAIJO , Tomoji OKUDA , Hiroki OMURA
发明人： Hisamitsu YAMAMOTO , Masayuki UTSUMI , Yoshikazu SAIJO , Tomoji OKUDA , Hiroki OMURA
IPC分类号： C25B11/02 , C25B9/18
CPC分类号： C25B1/21 , C25B1/28 , C25B9/00
摘要： An anode pipe includes a main pipe portion and a secondary pipe portion. The anode pipe has an inner circumferential surface that functions as an anode. The main pipe portion has a first connection end portion and a second connection end portion. The main pipe portion forms a flow channel for a treatment liquid that continues from the first connection end portion to the second connection end portion. The secondary pipe portion extends in a tubular fashion from the intermediate section of the main pipe portion. The interior of the secondary pipe portion communicates with the flow channel inside the main pipe portion. The cathode is disposed at a distance from the inner circumferential surface of the anode pipe. The cathode extends from a cathode attachment end portion toward the main pipe portion inside the secondary pipe portion.
摘要翻译：阳极管包括主管部分和次管部分。阳极管具有用作阳极的内周面。主管部分具有第一连接端部和第二连接端部。主管部形成从第一连接端部向第二连接端部连续的处理液的流路。次管部分以管状方式从主管部分的中间部分延伸。第二管部的内部与主管部内部的流路连通。阴极配置在距离阳极管的内周面一定距离处。阴极从第二管部分的阴极附着端部向主管部延伸。

4. 发明申请

US20120048728A1 ELECTROLYTIC REGENERATION DEVICE 有权
标题翻译：电解再生装置
公开(公告)号：US20120048728A1
公开(公告)日：2012-03-01
申请号：US13218855
申请日：2011-08-26
申请人： Yoshikazu SAIJO , Hisamitsu YAMAMOTO , Takahiro ISHIZAKI
发明人： Yoshikazu SAIJO , Hisamitsu YAMAMOTO , Takahiro ISHIZAKI
IPC分类号： C25B15/08
CPC分类号： C25B1/28 , C25B15/08 , H05K3/0055
摘要： The regeneration unit includes a tubular portion having the inner circumferential surface functioning as an anode, and a cathode provided inside the tubular portion and extending along the extension direction of the tubular portion in a state of separation from the inner circumferential surface. The treatment liquid used for desmearing treatment is fed through a gap between the inner circumferential surface of the tubular portion and the cathode. A feed-side conduit is connected by a downstream end portion thereof to the tubular portion and guides the treatment liquid discharged from a desmearing treatment tank into a regeneration unit. A return-side conduit is connected by an upstream end portion thereof to the tubular portion and guides the treatment liquid discharged from the regeneration unit into the desmearing treatment tank.
摘要翻译：再生单元包括具有用作阳极的内周面的管状部分和设置在管状部分内部并且在与内周表面分离的状态下沿管状部分的延伸方向延伸的阴极。用于除污处理的处理液通过管状部分的内周表面和阴极之间的间隙进料。进料侧导管通过其下游端部与管状部连接，将从脱盐处理槽排出的处理液引导到再生部。返回侧导管由其上游端部与管状部连接，将从再生部排出的处理液引导到除污处理槽内。

5. 发明授权

US09045836B2 Electrolytic regeneration device 有权
标题翻译：电解再生装置
公开(公告)号：US09045836B2
公开(公告)日：2015-06-02
申请号：US13218855
申请日：2011-08-26
申请人： Yoshikazu Saijo , Hisamitsu Yamamoto , Takahiro Ishizaki
发明人： Yoshikazu Saijo , Hisamitsu Yamamoto , Takahiro Ishizaki
IPC分类号： C25B1/28 , C25B15/08 , H05K3/00
CPC分类号： C25B1/28 , C25B15/08 , H05K3/0055
摘要： The regeneration unit includes a tubular portion having the inner circumferential surface functioning as an anode, and a cathode provided inside the tubular portion and extending along the extension direction of the tubular portion in a state of separation from the inner circumferential surface. The treatment liquid used for desmearing treatment is fed through a gap between the inner circumferential surface of the tubular portion and the cathode. A feed-side conduit is connected by a downstream end portion thereof to the tubular portion and guides the treatment liquid discharged from a desmearing treatment tank into a regeneration unit. A return-side conduit is connected by an upstream end portion thereof to the tubular portion and guides the treatment liquid discharged from the regeneration unit into the desmearing treatment tank.
摘要翻译：再生单元包括具有用作阳极的内周面的管状部分和设置在管状部分内部并且在与内周表面分离的状态下沿管状部分的延伸方向延伸的阴极。用于除污处理的处理液通过管状部分的内周表面和阴极之间的间隙进料。进料侧导管通过其下游端部与管状部连接，将从脱盐处理槽排出的处理液引导到再生部。返回侧导管由其上游端部与管状部连接，将从再生部排出的处理液引导到除污处理槽内。

6. 发明授权

US08877020B2 Electrolytic regeneration unit and electrolytic regeneration apparatus using same 有权
标题翻译：电解再生装置及使用其的电解再生装置
公开(公告)号：US08877020B2
公开(公告)日：2014-11-04
申请号：US13478873
申请日：2012-05-23
申请人： Hisamitsu Yamamoto , Masayuki Utsumi , Yoshikazu Saijo , Tomoji Okuda , Hiroki Omura
发明人： Hisamitsu Yamamoto , Masayuki Utsumi , Yoshikazu Saijo , Tomoji Okuda , Hiroki Omura
IPC分类号： C25B9/00 , C25B1/21 , C25B1/28
CPC分类号： C25B1/21 , C25B1/28 , C25B9/00
摘要： An anode pipe includes a main pipe portion and a secondary pipe portion. The anode pipe has an inner circumferential surface that functions as an anode. The main pipe portion has a first connection end portion and a second connection end portion. The main pipe portion forms a flow channel for a treatment liquid that continues from the first connection end portion to the second connection end portion. The secondary pipe portion extends in a tubular fashion from the intermediate section of the main pipe portion. The interior of the secondary pipe portion communicates with the flow channel inside the main pipe portion. The cathode is disposed at a distance from the inner circumferential surface of the anode pipe. The cathode extends from a cathode attachment end portion toward the main pipe portion inside the secondary pipe portion.
摘要翻译：阳极管包括主管部分和次管部分。阳极管具有用作阳极的内周面。主管部分具有第一连接端部和第二连接端部。主管部形成从第一连接端部向第二连接端部连续的处理液的流路。次管部分以管状方式从主管部分的中间部分延伸。第二管部的内部与主管部内部的流路连通。阴极配置在距离阳极管的内周面一定距离处。阴极从第二管部分的阴极附着端部向主管部延伸。

7. 发明申请

US20100059386A1 DIRECT PLATING METHOD AND SOLUTION FOR PALLADIUM CONDUCTOR LAYER FORMATION 有权
标题翻译：直接涂层方法和解决方案用于阴极导体层形成
公开(公告)号：US20100059386A1
公开(公告)日：2010-03-11
申请号：US12513611
申请日：2006-11-06
申请人： Hisamitsu Yamamoto
发明人： Hisamitsu Yamamoto
IPC分类号： C23C28/02 , C25D3/38 , C25D5/00 , C25D5/56
CPC分类号： C23C18/44 , C23C18/1653 , C23C18/2086 , C23C18/30 , C25D5/02 , C25D5/56 , H05K1/0346 , H05K3/181 , H05K3/422 , H05K3/427 , H05K2201/0344 , H05K2203/124
摘要： A surface of an object to be plated is subjected to a treatment for palladium catalyst impartation to impart a palladium catalyst to the surface of an insulating part thereof. A palladium conductor layer is formed on the insulating part from a solution for palladium conductor layer formation which contains a palladium compound, an amine compound, and a reducing agent. On the palladium conductor layer is then directly formed a copper deposit by electroplating. Thus, the work is converted to a conductor with the solution for palladium conductor layer formation, which is neutral, without using an electroless copper plating solution which is highly alkaline. Consequently, the polyimide is prevented from being attacked and no adverse influence is exerted on adhesion. By adding an azole compound to the solution for palladium conductor layer formation, a palladium conductor layer is prevented from depositing on copper. Thus, the reliability of connection between the copper part present on a substrate and the copper deposit formed by electroplating is significantly high.
摘要翻译：对被镀物体的表面进行钯催化剂的处理，将钯催化剂赋予其绝缘部分的表面。在包含钯化合物，胺化合物和还原剂的钯导体层形成用溶液的绝缘部上形成钯导体层。然后在钯导体层上通过电镀直接形成铜沉积物。因此，不用使用高碱性化学镀铜溶液，将工件转化为具有中性的钯导体层形成溶液的导体。因此，防止聚酰亚胺受到攻击，并且不会对粘合产生不利影响。通过向溶液中添加唑化合物以形成钯导体层，可以防止钯导体层沉积在铜上。因此，存在于基板上的铜部分与通过电镀形成的铜沉积物之间的连接的可靠性显着地高。

8. 发明授权

US08828131B2 Catalyst application solution, electroless plating method using same, and direct plating method 有权
标题翻译：催化剂应用解决方案，使用其的化学镀方法，以及直接电镀法
公开(公告)号：US08828131B2
公开(公告)日：2014-09-09
申请号：US13394380
申请日：2010-08-05
申请人： Hisamitsu Yamamoto , Tetsuji Ishida
发明人： Hisamitsu Yamamoto , Tetsuji Ishida
IPC分类号： C23C18/30 , C23C18/44 , H05K3/18 , B05D3/10 , C23C18/16 , C23C18/42 , C23C18/20 , C25D5/54
CPC分类号： C23C18/42 , C23C18/1608 , C23C18/1637 , C23C18/1641 , C23C18/1653 , C23C18/2086 , C23C18/30 , C25D5/54
摘要： Disclosed is a catalyst application solution for plating an insulating portion of an object to be plated that comprises the insulating portion. The catalyst application solution is characterized by containing a water-soluble palladium compound, a reducer, a dispersant, catechol, a copper antioxidant and a buffering agent, and by having a pH of not less than 4. When the catalyst application solution is compared with a Pd—Sn colloidal solution, the catalyst application solution has the following advantages: since the catalyst application solution is a colloidal solution of Pd only that does not contain Sn, a pre-dip process and an Sn removal process are unnecessary and thus the catalyst application process can be simplified; since the catalyst application solution has a pH of not less than 4, haloing does not occur; and since the catalyst application solution is in a reducing atmosphere due to the reducer contained therein, a copper surface is not oxidized and no copper dissolution occurs, thereby causing no palladium displacement reaction.
摘要翻译：公开了一种用于电镀包含绝缘部分的被镀物体的绝缘部分的催化剂施加溶液。催化剂涂布液的特征在于含有水溶性钯化合物，还原剂，分散剂，儿茶酚，铜抗氧化剂和缓冲剂，并且具有不低于4的pH。当将催化剂涂布溶液与 Pd-Sn胶体溶液，催化剂涂布溶液具有以下优点：由于催化剂应用溶液是不含Sn的Pd的胶态溶液，因此不需要预浸处理和Sn去除工艺，因此催化剂申请流程可以简化; 由于催化剂涂布液的pH不低于4，因此不会发生卤化; 并且由于催化剂涂布液由于其中含有还原剂而在还原气氛中，所以铜表面不被氧化，并且不会发生铜溶解，从而不产生钯置换反应。

9. 发明申请

US20120171363A1 CATALYST APPLICATION SOLUTION, ELECTROLESS PLATING METHOD USING SAME, AND DIRECT PLATING METHOD 有权
标题翻译：催化剂应用解决方案，使用相同的电镀法和直接镀层法
公开(公告)号：US20120171363A1
公开(公告)日：2012-07-05
申请号：US13394380
申请日：2010-08-05
申请人： Hisamitsu Yamamoto , Tetsuji Ishida
发明人： Hisamitsu Yamamoto , Tetsuji Ishida
IPC分类号： H05K3/18 , C09D5/00 , C23C18/18
CPC分类号： C23C18/42 , C23C18/1608 , C23C18/1637 , C23C18/1641 , C23C18/1653 , C23C18/2086 , C23C18/30 , C25D5/54
摘要： Disclosed is a catalyst application solution for plating an insulating portion of an object to be plated that comprises the insulating portion. The catalyst application solution is characterized by containing a water-soluble palladium compound, a reducer, a dispersant, catechol, a copper antioxidant and a buffering agent, and by having a pH of not less than 4. When the catalyst application solution is compared with a Pd—Sn colloidal solution, the catalyst application solution has the following advantages: since the catalyst application solution is a colloidal solution of Pd only that does not contain Sn, a pre-dip process and an Sn removal process are unnecessary and thus the catalyst application process can be simplified; since the catalyst application solution has a pH of not less than 4, haloing does not occur; and since the catalyst application solution is in a reducing atmosphere due to the reducer contained therein, a copper surface is not oxidized and no copper dissolution occurs, thereby causing no palladium displacement reaction.
摘要翻译：公开了一种用于电镀包含绝缘部分的被镀物体的绝缘部分的催化剂施加溶液。催化剂涂布液的特征在于含有水溶性钯化合物，还原剂，分散剂，儿茶酚，铜抗氧化剂和缓冲剂，并且具有不低于4的pH。当将催化剂涂布溶液与 Pd-Sn胶体溶液，催化剂涂布溶液具有以下优点：由于催化剂应用溶液是不含Sn的Pd的胶态溶液，因此不需要预浸处理和Sn去除工艺，因此催化剂申请流程可以简化; 由于催化剂涂布液的pH不低于4，因此不会发生卤化; 并且由于催化剂涂布液由于其中含有还原剂而在还原气氛中，所以铜表面不被氧化，并且不会发生铜溶解，从而不产生钯置换反应。

10. 发明申请

US20140339463A1 DESMEAR SOLUTION AND DESMEAR METHOD 审中-公开
标题翻译： DESMEAR解决方案和DESMEAR方法
公开(公告)号：US20140339463A1
公开(公告)日：2014-11-20
申请号：US14345618
申请日：2012-09-11
申请人： Yoshikazu Saijo , Hisamitsu Yamamoto , Masayuki Utsumi
发明人： Yoshikazu Saijo , Hisamitsu Yamamoto , Masayuki Utsumi
IPC分类号： C09K13/02 , H05K3/00
CPC分类号： C09K13/02 , H05K3/0055 , H05K3/381 , H05K2203/0793 , H05K2203/0796
摘要： The present invention provides a desmear solution and a desmear method using said desmear solution, the desmear solution being capable of certainly removing a smear inside a non-through hole formed in a resin substrate and also capable of forming a plating film excellent in adhesion without excessive roughening of a surface of the resin substrate. The present invention uses the desmear solution containing a permanganate having a concentration of 0.2 to 0.4 mol/L and an alkali metal hydroxide and having a molar concentration ratio of said permanganate to said alkali metal hydroxide of 1:5 to 1:20.
摘要翻译：本发明提供一种使用所述去污溶液的去污解决方案和去污方法，所述去污溶液能够可靠地除去形成在树脂基材中的非通孔内的污迹，并且还能够形成无粘附性优异的电镀膜使树脂基板的表面粗糙化。本发明使用含有浓度为0.2〜0.4mol / L的高锰酸盐和碱金属氢氧化物并且所述高锰酸盐与所述碱金属氢氧化物的摩尔浓度比为1:5〜1:20的去污溶液。

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