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1. 发明授权

US07556669B2 Au-sn alloy powder for solder paste 有权
标题翻译： Au-Sn合金粉末用于焊膏
公开(公告)号：US07556669B2
公开(公告)日：2009-07-07
申请号：US11571289
申请日：2005-06-27
申请人： Masayuki Ishikawa , Masayoshi Kohinata , Akihumi Mishima
发明人： Masayuki Ishikawa , Masayoshi Kohinata , Akihumi Mishima
IPC分类号： B22F9/00
CPC分类号： B23K35/025 , B22F9/082 , B23K35/0244 , B23K35/30 , B23K35/3013 , C22C1/0466 , H05K3/3484
摘要： The problem is to provide an Au—Sn alloy powder for use in producing an Au—Sn alloy solder paste having reduced generation of voids. The problem is solved by an Au—Sn alloy powder for a solder paste, which has a composition consisting of Sn of 20.5-23.5% by mass and a remainder containing Au and inevitable impurities, and which has a microstructure in which 0.5 to 30 area % of fine Sn-rich primary crystal phase regions having a diameter of 3 μm or less are crystallized in a matrix.
摘要翻译：问题在于提供一种Au-Sn合金粉末，用于生产具有减少的空隙产生的Au-Sn合金焊膏。该问题由用于焊锡膏的Au-Sn合金粉末来解决，该Sn-Sn合金粉末的组成为Sn为20.5〜23.5质量％，余量为Au和不可避免的杂质，其组织为0.5〜30面积直径3μm以下的细小的富Sn的初晶相的％的结晶化为基体。

2. 发明申请

US20070183922A1 Au-sn alloy powder for solder paste 有权
标题翻译： Au-Sn合金粉末用于焊膏
公开(公告)号：US20070183922A1
公开(公告)日：2007-08-09
申请号：US11571289
申请日：2005-06-27
申请人： Masayuki Ishikawa , Masayoshi Kohinata , Akihumi Mishima
发明人： Masayuki Ishikawa , Masayoshi Kohinata , Akihumi Mishima
IPC分类号： C22C5/02
CPC分类号： B23K35/025 , B22F9/082 , B23K35/0244 , B23K35/30 , B23K35/3013 , C22C1/0466 , H05K3/3484
摘要： The problem is to provide an Au—Sn alloy powder for use in producing an Au—Sn alloy solder paste having reduced generation of voids. The problem is solved by an Au—Sn alloy powder for a solder paste, which has a composition consisting of Sn of 20.5-23.5% by mass and a remainder containing Au and inevitable impurities, and which has a microstructure in which 0.5 to 30 area % of fine Sn-rich primary crystal phase regions having a diameter of 3 μm or less are crystallized in a matrix.
摘要翻译：问题在于提供一种Au-Sn合金粉末，用于生产具有减少的空隙产生的Au-Sn合金焊膏。该问题由用于焊锡膏的Au-Sn合金粉末来解决，该Sn-Sn合金粉末的组成为Sn为20.5〜23.5质量％，余量为Au和不可避免的杂质，其组织为0.5〜30面积直径3μm以下的细小的富Sn的初晶相的％的结晶化为基体。

3. 发明申请

US20080304999A1 Au-Sn Alloy Bump Having no Trapped-In Large Void and Process for Producing the Same 有权
标题翻译： Au-Sn合金凸块没有陷入大的空隙，并且生产它的过程
公开(公告)号：US20080304999A1
公开(公告)日：2008-12-11
申请号：US12094167
申请日：2005-11-29
申请人： Masayuki Ishikawa , Masayoshi Kohinata , Akifumi Mishima
发明人： Masayuki Ishikawa , Masayoshi Kohinata , Akifumi Mishima
IPC分类号： B23K1/19 , C22C5/02
CPC分类号： C22C5/02 , B23K35/3013 , H01L24/11 , H01L24/13 , H01L2224/1131 , H01L2224/13099 , H01L2224/13144 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01322 , H01L2924/014 , H01L2924/10329 , H01L2224/0401
摘要： An Au—Sn alloy bump that does not include large voids and a method of producing the same are provided. The An Au—Sn alloy bump that does not include large voids comprises a composition containing Sn: 20.5 to 23.5 mass % and the balance Au and unavoidable impurities, and a structure where 0.5 to 30 area % of Sn-rich primary crystal phase is crystallized in the matrix.
摘要翻译：提供不包括大空隙的Au-Sn合金凸块及其制造方法。不包含大空隙的Au-Sn合金凸块包括含有Sn：20.5〜23.5质量％，余量为Au和不可避免的杂质的组成以及富含Sn的一次结晶相的0.5〜30面积％的结构在矩阵中。

4. 发明授权

US08721961B2 Au—Sn alloy bump including no large void and method of producing same 有权
标题翻译：不含大孔的Au-Sn合金凸块及其制造方法
公开(公告)号：US08721961B2
公开(公告)日：2014-05-13
申请号：US12094167
申请日：2005-11-29
申请人： Masayuki Ishikawa , Masayoshi Kohinata , Akifumi Mishima
发明人： Masayuki Ishikawa , Masayoshi Kohinata , Akifumi Mishima
IPC分类号： C22C5/02
CPC分类号： C22C5/02 , B23K35/3013 , H01L24/11 , H01L24/13 , H01L2224/1131 , H01L2224/13099 , H01L2224/13144 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01322 , H01L2924/014 , H01L2924/10329 , H01L2224/0401
摘要： An Au—Sn alloy bump that does not include large voids and a method of producing the same are provided. The Au—Sn alloy bump that does not include large voids comprises a composition containing Sn: 20.5 to 23.5 mass % and the balance Au and unavoidable impurities, and a structure where 0.5 to 30 area % of Sn-rich primary crystal phase is crystallized in the matrix.
摘要翻译：提供不包括大空隙的Au-Sn合金凸块及其制造方法。不包含大空隙的Au-Sn合金凸块包括含有Sn：20.5〜23.5质量％，余量为Au和不可避免的杂质的组合物，以及富含Sn的一次结晶相的0.5〜30面积％结晶化的结构矩阵。

5. 发明申请

US20130015027A1 HYDRAULIC SHOCK ABSORBER 有权
标题翻译：液压减震器
公开(公告)号：US20130015027A1
公开(公告)日：2013-01-17
申请号：US13521631
申请日：2010-12-01
申请人： Eiko Miyasato , Akira Hiroki , Junya Kaneko , Youji Takakuwa , Kengo Monden , Masayuki Ishikawa , Mariko Kessoku
发明人： Eiko Miyasato , Akira Hiroki , Junya Kaneko , Youji Takakuwa , Kengo Monden , Masayuki Ishikawa , Mariko Kessoku
IPC分类号： F16F9/19 , F16F9/36
CPC分类号： F16F9/363
摘要： A hydraulic shock absorber that can reduce outflow amount of oil by maximally removing an oil film attached to an outer periphery of a rod and that can achieve securement of high slidability between the rod and a rod packing and prevention of wear of the rod packing. A rod packing interposed between an outer periphery of a rod and an inner periphery of a rod-side end wall includes a first lip for scrapping off an oil film attached to the outer periphery of the rod, and a ring-shaped grease holding member for supplying holding grease to the outer periphery of the rod. The grease holding member is in contact with the outer periphery of the rod at a position closer to a rod distal end than the first lip.
摘要翻译：一种液压减震器，其可以通过最大限度地除去附着在杆的外周上的油膜，从而可以减少杆和杆状填料之间的高滑动性，并防止杆状填料的磨损，从而减少油的流出量。插入在杆的外周和杆侧端壁的内周之间的杆状填料包括用于废除附着在杆的外周的油膜的第一唇缘和用于向杆的外周供给保持油脂。润滑脂保持构件在比第一唇缘更靠近杆远端的位置处与杆的外周接触。

6. 发明申请

US20120282123A1 ELECTRIC COMPRESSOR AND ASSEMBLY METHOD THEREOF 有权
标题翻译：电动压缩机及其装配方法
公开(公告)号：US20120282123A1
公开(公告)日：2012-11-08
申请号：US13519926
申请日：2010-08-26
申请人： Yuki Ichise , Takayuki Hagita , Masayuki Ishikawa , Takeshi Hirano , Takayuki Watanabe
发明人： Yuki Ichise , Takayuki Hagita , Masayuki Ishikawa , Takeshi Hirano , Takayuki Watanabe
IPC分类号： F04D25/06 , B23P15/00
CPC分类号： F04B39/14 , F04C18/0215 , F04C23/008 , F04C29/0078 , F04C2230/60 , H02K1/28 , H02K5/1732 , H02K7/083 , H02K15/0012 , Y10T29/49245
摘要： A main-bearing outer diameter of an electric motor is made smaller than a rotor outer diameter without causing a drop in production efficiency, and the ease of performing a shrink-fitting step is also enhanced by making it possible to mount a rotor to a main shaft in an early stage. A bearing journal portion (14b) of a main shaft (14) of an electric motor is formed in a shape into which an inner race (18b) of a main bearing (18) can be press-fitted from both sides in the axial direction thereof, and, in addition, an outer diameter of the bearing journal portion (14b) is made larger than an outer diameter of a rotor press-fitting portion (14a), whereas a bearing bore portion (5a) of a partition member (5) is formed in a shape into which an outer race (18a) can be press-fitted from both sides in the axial direction thereof. It is preferable that a space (S) into which a press-fitting tool for press-fitting the main bearing (18) can be inserted be provided between the rotor press-fitting portion (14a) of the main shaft (14) and the bearing journal portion (14b) thereof.
摘要翻译：电动机的主轴承外径小于转子外径而不会导致生产效率下降，并且通过使转子能够安装到主体上也可以提高进行收缩装配步骤的容易性轴早期阶段。电动机的主轴（14）的轴承轴颈部（14b）形成为主轴承（18）的内圈（18b）能够沿轴向从两侧压配合成的形状并且另外，使轴承轴颈部（14b）的外径大于转子压配部（14a）的外径，而分隔部件（5）的轴承孔部（5a））形成为能够沿其轴向方向从两侧压配合外圈（18a）的形状。优选的是，可以插入用于压配主轴承（18）的压配工具的空间（S），该主体轴（14）的转子压配合部（14a）和轴承轴颈部分（14b）。

7. 发明申请

US20110297980A1 SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：半导体发光器件及其制造方法
公开(公告)号：US20110297980A1
公开(公告)日：2011-12-08
申请号：US12886709
申请日：2010-09-21
申请人： Yoshiaki Sugizaki , Hideki Shibata , Akihiro Kojima , Masayuki Ishikawa , Hideo Tamura , Tetsuro Komatsu
发明人： Yoshiaki Sugizaki , Hideki Shibata , Akihiro Kojima , Masayuki Ishikawa , Hideo Tamura , Tetsuro Komatsu
IPC分类号： H01L33/44 , H01L33/50
CPC分类号： H01L33/0066 , H01L27/15 , H01L33/0075 , H01L33/0079 , H01L33/38 , H01L33/44 , H01L33/48 , H01L33/486 , H01L33/50 , H01L33/62 , H01L2924/0002 , H01L2933/0041 , H01L2933/005 , H01L2933/0066 , H01L2924/00
摘要： According to one embodiment, a semiconductor light emitting device includes a light emitting chip and a fluorescent material layer. The light emitting chip includes a semiconductor layer, a first electrode, a second electrode, an insulating layer, a first interconnect layer, a second interconnect layer, a first metal pillar, a second metal pillar, and a resin layer. The semiconductor layer includes a light emitting layer, a first major surface, and a second major surface formed on a side opposite to the first major surface. The fluorescent material layer is provided on the first major surface and has a larger planer size than the light emitting chip.
摘要翻译：根据一个实施例，半导体发光器件包括发光芯片和荧光材料层。发光芯片包括半导体层，第一电极，第二电极，绝缘层，第一互连层，第二互连层，第一金属柱，第二金属柱和树脂层。半导体层包括形成在与第一主表面相对的一侧上的发光层，第一主表面和第二主表面。荧光材料层设置在第一主表面上，并且具有比发光芯片更大的平面尺寸。

8. 发明授权

US07808741B2 Head slider and disk drive device 有权
标题翻译：磁头滑块和磁盘驱动器设备
公开(公告)号：US07808741B2
公开(公告)日：2010-10-05
申请号：US12313610
申请日：2008-11-21
申请人： Tsuyoshi Matsumoto , Futoshi Kitaizumi , Yoshio Yamamoto , Hidetsugu Tanaka , Masayuki Ishikawa
发明人： Tsuyoshi Matsumoto , Futoshi Kitaizumi , Yoshio Yamamoto , Hidetsugu Tanaka , Masayuki Ishikawa
IPC分类号： G11B5/60 , G11B21/21
CPC分类号： G11B5/54 , G11B5/6005 , G11B5/607
摘要： Embodiments of the present invention help to adjust the recess depth of a head element portion of a head slider. In an embodiment of the present invention, in a test step in manufacturing an HDD, the HDD examines the recess depth of a head element portion and decreases and adjusts the recess depth if the recess depth of the head element portion does not satisfy the predetermined condition. The HDD moves an actuator to a ramp of a retract position and supplies power to a heater in a head slider. If the heater power is large, the head element portion undergoes plastic deformation. The plastic deformation of the head element portion decreases the recess depth of the head element portion.
摘要翻译：本发明的实施例有助于调整磁头滑块的磁头元件部分的凹陷深度。在本发明的一个实施例中，在制造HDD的测试步骤中，如果头元件部分的凹陷深度不满足预定条件，则HDD检查头元件部分的凹陷深度并减小并调节凹陷深度。 HDD将致动器移动到缩回位置的斜坡，并向头滑块中的加热器供电。如果加热器功率大，则头元件部分发生塑性变形。头元件部分的塑性变形减小了头元件部分的凹陷深度。

9. 发明申请

US20100128383A1 DISK DRIVE AND METHOD FOR CONTROLLING CLEARANCE IN THE DISK DRIVE 有权
标题翻译：用于控制盘驱动器中的间隙的盘驱动和方法
公开(公告)号：US20100128383A1
公开(公告)日：2010-05-27
申请号：US12623345
申请日：2009-11-20
申请人： Shinji MATSUSHITA , Kenichi Kuramoto , Kanji Kuroki , Takahiro Nishioka , Masayuki Ishikawa
发明人： Shinji MATSUSHITA , Kenichi Kuramoto , Kanji Kuroki , Takahiro Nishioka , Masayuki Ishikawa
IPC分类号： G11B21/02
CPC分类号： G11B5/6029 , G11B5/6005 , G11B5/6035 , G11B5/6058 , G11B5/6064 , G11B5/607
摘要： A disk drive. The disk drive includes a disk configured to store data, a slider configured to fly in proximity to the disk, and a magnetic-recording head on the slider configured to access the disk. The disk drive also includes a moving mechanism configured to support and to move the head-slider, an adjustment portion configured to adjust clearance between the magnetic-recording head and the disk, and a controller configured to control the adjustment portion to control the clearance. The controller is configured to perform clearance control in a first mode in an operation selected from the group consisting of reading user data and writing user data according to a change in fly height of the slider after a load operation, and subsequently is configured to perform clearance control in a second mode in an operation selected from the group consisting of reading user data and writing user data.
摘要翻译：磁盘驱动器磁盘驱动器包括被配置为存储数据的盘，被配置为在盘附近飞行的滑块以及被配置为访问盘的滑块上的磁记录头。磁盘驱动器还包括移动机构，其被配置为支撑和移动磁头滑动器，配置成调节磁记录磁头和磁盘之间的间隙的调整部分以及被配置为控制调整部分来控制间隙的控制器。控制器被配置为在从包括读取用户数据和在加载操作之后根据滑块的飞行高度的改变来写入用户数据的组中选择的操作中执行第一模式中的间隙控制，并且随后被配置为执行间隙在从包括读取用户数据和写入用户数据的组中选择的操作中以第二模式进行控制。

10. 发明授权

US07641045B2 Top plate conveyor device 失效
标题翻译：顶板输送装置
公开(公告)号：US07641045B2
公开(公告)日：2010-01-05
申请号：US12245098
申请日：2008-10-03
申请人： Masayuki Ishikawa , Yasunori Ueno
发明人： Masayuki Ishikawa , Yasunori Ueno
IPC分类号： B65G29/00
CPC分类号： B65G17/065 , B65G17/44
摘要： A top plate conveyor device, in which vibrations and noises are reduced, and the structure is simple and the production assembly and handling are easy. Top plates 110 are removably provided on a rubber toothed belt 120 by engagement members 111 provided on the back surfaces of the top plates 110, and engagement members 111 include sandwiching portions 112 which sandwich the toothed belt 120 from both outer sides in the width direction and terminate in pawl portions 113, which snap-connect the top plates to the toothed belt 120.
摘要翻译：振动和噪音减小的顶板输送装置，结构简单，生产组装和处理容易。顶板110通过设置在顶板110的后表面上的接合构件111可拆卸地设置在橡胶齿形带120上，并且接合构件111包括从宽度方向的两个外侧夹持齿形带120的夹持部112，终止于棘爪部分113，卡爪部分113将顶板卡扣到齿形带120上。

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