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    • 5. 发明授权
    • Method of producing a semiconductor structure including a recrystallized
film
    • 制造包括再结晶膜的半导体结构的方法
    • US5467731A
    • 1995-11-21
    • US322375
    • 1994-10-13
    • Satoshi ArimotoNorio HayafujiMikio DeguchiSatoshi Hamamoto
    • Satoshi ArimotoNorio HayafujiMikio DeguchiSatoshi Hamamoto
    • H01L21/208H01L21/20C30B13/20
    • H01L21/2022
    • A method for producing a semiconductor structure including a semiconductor film formed on a semiconductor substrate body via an insulating film includes: laminating a first insulating film, a first semiconductor film, and a second insulating film on the semiconductor substrate successively; forming stripe-shaped second semiconductor films of predetermined width on the second insulating film arranged periodically at a predetermined interval and covering these second semiconductor films with a third insulating film; performing zone melting recrystallization of the first semiconductor film from one end of the substrate to the opposite end along the stripe direction of the stripe-shaped second semiconductor film; etching the third insulating film and portions of the second insulating film not sandwiched by the first and second semiconductor films; oxidizing portions of the second semiconductor film and the first semiconductor film exposed in the etching step and etching and removing the second insulating film remaining after the previous etching. Thus, a semiconductor substrate including a recrystallized semiconductor film having removed sub-grain-boundaries generated during the zone melting recrystallization, is obtained by fewer process steps than in the prior art.
    • 一种用于制造半导体结构的方法,该半导体结构包括通过绝缘膜形成在半导体衬底本体上的半导体膜,包括:依次在半导体衬底上层叠第一绝缘膜,第一半导体膜和第二绝缘膜; 在预定间隔周期性地布置的第二绝缘膜上形成预定宽度的条状第二半导体膜,并用第三绝缘膜覆盖这些第二半导体膜; 从所述基板的一端到所述条状的第二半导体膜的条带方向的相反端进行区域熔融再结晶的第一半导体膜; 蚀刻第三绝缘膜和未被第一和第二半导体膜夹持的第二绝缘膜的部分; 在蚀刻步骤中暴露的第二半导体膜和第一半导体膜的氧化部分,并蚀刻除去在先前蚀刻之后残留的第二绝缘膜。 因此,通过比现有技术更少的工艺步骤获得包括在区域熔融再结晶期间产生的去除亚晶界的再结晶半导体膜的半导体衬底。
    • 9. 发明授权
    • Semiconductor laser producing short wavelength light
    • 半导体激光产生短波长光
    • US5701321A
    • 1997-12-23
    • US623378
    • 1996-03-28
    • Norio HayafujiZempei Kawazu
    • Norio HayafujiZempei Kawazu
    • H01S5/00H01L27/15H01S5/02H01S5/026H01S5/183H01S5/323H01S3/19H01S3/08
    • H01S5/18305H01L27/156H01L33/007H01S5/0207H01S5/0213H01S5/18369H01S5/32341
    • A semiconductor laser includes an electrically insulating substrate having an opening; a first conductivity type first contact layer within the opening; a laminated semiconductor layer structure on the first contact layer and comprising a first cladding layer, an active layer, a second cladding layer, and a second contact layer wherein the first contact layer includes an aperture within the opening; a first electrode disposed on the electrically insulating substrate and extending to and contacting the first contact layer; and a second electrode in electrical contact with the second contact layer. The substrate is preferably sapphire, MgO, and spinel and the semiconductor layers are preferably GaN materials so that the laser emits short wavelength light. An electrode makes direct, reliable contact to the first cladding layer through an opening in the electrically insulating substrate without the need of mechanically working or etching the substrate.
    • 半导体激光器包括具有开口的电绝缘基板; 在开口内的第一导电类型的第一接触层; 在所述第一接触层上的层叠半导体层结构,包括第一覆层,有源层,第二覆层和第二接触层,其中所述第一接触层在所述开口内包括孔; 第一电极,设置在所述电绝缘基板上并延伸到所述第一接触层并接触所述第一接触层; 以及与所述第二接触层电接触的第二电极。 基板优选为蓝宝石,MgO和尖晶石,半导体层优选为GaN材料,使得激光发射短波长的光。 电极通过电绝缘衬底中的开口直接,可靠地接触第一包层,而不需要机械加工或蚀刻衬底。