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    • 1. 发明申请
    • Group III-V compound semiconductor and method for producing the same
    • III-V族化合物半导体及其制造方法
    • US20060022308A1
    • 2006-02-02
    • US11140236
    • 2005-05-27
    • Masaya ShimizuShinichi MorishimaMakoto Sasaki
    • Masaya ShimizuShinichi MorishimaMakoto Sasaki
    • H01L29/12
    • C30B25/02C30B25/18C30B29/403H01L21/0237H01L21/02458H01L21/02513H01L21/0254H01L21/02573H01L21/0262H01L33/007
    • A Group III-V compound semiconductor includes, at least, a substrate, a buffer layer of the general formula InuGavAlwN (wherein, 0≦u≦1, 0≦v≦1, 0≦w≦1, u+v+w=1) and a Group III-V compound semiconductor crystal layer of the general formula InxGayAlzN (wherein, 0≦x≦1, 0≦y≦1, 0≦z≦1, x+y+z=1), in this order, wherein the buffer layer has a thickness of at least about 5 Å and not more than about 90 Å. A method is provided for producing the Group III-V compound semiconductor, including forming a buffer layer of the general formula InuGavAlwN on a substrate to give a thickness of at least about 5 Å and not more than about 90 Å at temperatures lower than the growing temperature of the compound semiconductor crystal layer before growing the compound semiconductor crystal layer, and then growing a Group III-V compound semiconductor crystal layer of the general formula InxGayAlzN on the buffer layer.
    • III-V族化合物半导体至少包括基底,通式为AlN的缓冲层 (其中,0≤u≤1,0<=v≤1,0<= w <= 1,u + v + w =​​ 1)和通式为In的III-V族化合物半导体晶体层 (其中,0≤x≤1,0<= y <=1,0.0≤z <= 1,x + y + z = 1),其中缓冲层具有至少约和不大于约的厚度。 提供了用于制备III-V族化合物半导体的方法,包括形成通式为III-V族化合物半导体的缓冲层, N,在生长化合物半导体晶体层之前,在比化合物半导体晶体层的生长温度低的温度下,给出至少约不小于约90的厚度,然后生长III-V族 在缓冲层上具有通式为Al x Ga y Al y Al z的化合物半导体晶体层。
    • 2. 发明授权
    • Method for producing a Group III-V compound semiconductor
    • III-V族化合物半导体的制造方法
    • US07659190B2
    • 2010-02-09
    • US11140236
    • 2005-05-27
    • Masaya ShimizuShinichi MorishimaMakoto Sasaki
    • Masaya ShimizuShinichi MorishimaMakoto Sasaki
    • H01L21/28H01L21/3205
    • C30B25/02C30B25/18C30B29/403H01L21/0237H01L21/02458H01L21/02513H01L21/0254H01L21/02573H01L21/0262H01L33/007
    • A Group III-V compound semiconductor includes, at least, a substrate, a buffer layer of the general formula InuGavAlwN (wherein, 0≦u≦1, 0≦v≦1, 0≦w≦1, u+v+w=1) and a Group III-V compound semiconductor crystal layer of the general formula InxGayAlzN (wherein, 0≦x≦1, 0≦y≦1, 0≦z≦1, x+y+z=1), in this order, wherein the buffer layer has a thickness of at least about 5 Å and not more than about 90 Å. A method is provided for producing the Group III-V compound semiconductor, including forming a buffer layer of the general formula InuGavAlwN on a substrate to give a thickness of at least about 5 Å and not more than about 90 Å at temperatures lower than the growing temperature of the compound semiconductor crystal layer before growing the compound semiconductor crystal layer, and then growing a Group III-V compound semiconductor crystal layer of the general formula InxGayAlzN on the buffer layer.
    • III-V族化合物半导体至少包括基底,通式为InuGavAlwN的缓冲层(其中,0≤u≤1,0<= v <= 1,0 <= w <= 1, u + v + w =​​ 1)和通式为In x Ga y Al z N的III-V族化合物半导体晶体层(其中,0≤x≤1,0≤y≤1,0≤z≤1, x + y + z = 1),其中缓冲层具有至少约和不大于约的厚度。 提供了用于制备III-V族化合物半导体的方法,包括在基底上形成通式为InuGavAlwN的缓冲层,以在比生长的温度低的温度下产生至少约和不大于约的厚度 在化合物半导体晶体层生长之前的化合物半导体晶体层的温度,然后在缓冲层上生长通式为In x Ga y Al z N的III-V族化合物半导体晶体层。
    • 3. 发明授权
    • Method for manufacturing organic electroluminescence device
    • 制造有机电致发光元件的方法
    • US08354287B2
    • 2013-01-15
    • US12670566
    • 2008-07-18
    • Makoto SasakiShinichi MorishimaNorihito Ito
    • Makoto SasakiShinichi MorishimaNorihito Ito
    • H01L21/00
    • H01L51/5256
    • The present invention provides a method for manufacturing an organic EL device. When an organic EL element which is composed of a pair of electrodes in which at least one of the electrodes is transparent or translucent, and an organic EL layer which comprises a light-emitting layer held between the electrodes, and a sealing layer which includes at least one layer of inorganic film being in contact with the organic EL element and which seals the organic EL element are formed on a substrate, a first sealing film which is included in the sealing layer and in contact with the organic EL element is formed by the facing target sputtering method, and the other inorganic film which is included in the sealing layer is formed by any method other than the facing target sputtering method.
    • 本发明提供一种制造有机EL器件的方法。 当由至少一个电极是透明或半透明的一对电极组成的有机EL元件以及包含保持在电极之间的发光层的有机EL层和包含在电极之间的密封层 在基板上形成与有机EL元件接触的至少一层无机膜,并且在基板上形成密封有机EL元件的无机膜,包含在密封层中并与有机EL元件接触的第一密封膜由 并且通过面对靶溅射法以外的任何方法形成包含在密封层中的其他无机膜。
    • 4. 发明申请
    • METHOD FOR MANUFACTURING ORGANIC ELECTROLUMINESCENCE DEVICE
    • 制造有机电致发光器件的方法
    • US20100227422A1
    • 2010-09-09
    • US12670524
    • 2008-07-24
    • Makoto SasakiShinichi MorishimaNorihito Ito
    • Makoto SasakiShinichi MorishimaNorihito Ito
    • H01L21/56
    • H01L51/56C23C14/0652C23C14/46H01L51/5253
    • The present invention is intended to provide a method for manufacturing an organic EL device, which method can form a film having high barrier properties to water vapor or oxygen, while suppressing damage to an organic EL element, during formation of the film including inorganic layers for sealing the organic EL element. When an organic EL element (20) which is composed of a pair of electrodes in which at least one of the electrodes being transparent or translucent and an organic EL layer (22) which comprises a light-emitting layer held between the electrodes, and a sealing layer (30) which includes at least one layer of inorganic film being in contact with the organic EL element (20) and which seals the organic EL element (20) are formed on a substrate (10), a first sealing film (31) which is included in the sealing layer (30) and which is in contact with the organic EL element (20) is formed by ion beam sputtering method, and the other inorganic film which is included in the sealing layer (30) is formed by any method other than the ion beam sputtering method.
    • 本发明旨在提供一种制造有机EL器件的方法,该方法可以在形成含有无机层的膜的同时,在形成含有无机层的膜的同时,抑制对有机EL元件的损伤,从而形成对水蒸汽或氧气具有高阻隔性的膜 密封有机EL元件。 当由一对电极构成的有机EL元件(20),其中至少一个电极是透明的或半透明的,以及包括在电极之间保持的发光层的有机EL层(22),以及 在基板(10)上形成包括至少一层与有机EL元件(20)接触并密封有机EL元件(20)的无机膜的密封层(30),第一密封膜(31) )包含在密封层(30)中并且与有机EL元件(20)接触的方法通过离子束溅射法形成,并且包含在密封层(30)中的另一种无机膜由 除离子束溅射法以外的任何方法。
    • 5. 发明授权
    • Method for manufacturing organic electroluminescence device
    • 制造有机电致发光元件的方法
    • US08278126B2
    • 2012-10-02
    • US12670524
    • 2008-07-24
    • Makoto SasakiShinichi MorishimaNorihito Ito
    • Makoto SasakiShinichi MorishimaNorihito Ito
    • H01L21/00
    • H01L51/56C23C14/0652C23C14/46H01L51/5253
    • The present invention is intended to provide a method for manufacturing an organic EL device, which method can form a film having high barrier properties to water vapor or oxygen, while suppressing damage to an organic EL element, during formation of the film including inorganic layers for sealing the organic EL element. When an organic EL element (20) which is composed of a pair of electrodes in which at least one of the electrodes being transparent or translucent and an organic EL layer (22) which comprises a light-emitting layer held between the electrodes, and a sealing layer (30) which includes at least one layer of inorganic film being in contact with the organic EL element (20) and which seals the organic EL element (20) are formed on a substrate (10), a first sealing film (31) which is included in the sealing layer (30) and which is in contact with the organic EL element (20) is formed by ion beam sputtering method, and the other inorganic film which is included in the sealing layer (30) is formed by any method other than the ion beam sputtering method.
    • 本发明旨在提供一种制造有机EL器件的方法,该方法可以在形成含有无机层的膜的同时,在形成含有无机层的膜的同时,抑制对有机EL元件的损伤,从而形成对水蒸汽或氧气具有高阻隔性的膜 密封有机EL元件。 当由一对电极构成的有机EL元件(20),其中至少一个电极是透明的或半透明的,以及包括在电极之间保持的发光层的有机EL层(22),以及 在基板(10)上形成包括至少一层与有机EL元件(20)接触并密封有机EL元件(20)的无机膜的密封层(30),第一密封膜(31) )包含在密封层(30)中并且与有机EL元件(20)接触的方法通过离子束溅射法形成,并且包含在密封层(30)中的另一种无机膜由 除离子束溅射法以外的任何方法。
    • 6. 发明申请
    • METHOD FOR MANUFACTURING ORGANIC ELECTROLUMINESCENCE DEVICE
    • 制造有机电致发光器件的方法
    • US20100210047A1
    • 2010-08-19
    • US12670566
    • 2008-07-18
    • Makoto SasakiShinichi MorishimaNorihito Ito
    • Makoto SasakiShinichi MorishimaNorihito Ito
    • H01L21/56C23C14/34C23C14/35
    • H01L51/5256
    • The present invention is intended to provide a method for manufacturing an organic EL device, which can form a film with less damage to the organic EL element during formation of the film including inorganic layers for sealing the organic EL element. When an organic EL element (20) which is composed of a pair of electrodes in which at least one of the electrodes being transparent or translucent, and an organic EL layer (22) which comprises a light-emitting layer held between the electrodes, and a sealing layer (30) which includes at least one layer of inorganic film being in contact with the organic EL element (20) and which seals the organic EL element (20) are formed on a substrate (10), a first sealing film (31) which is included in the sealing layer (30) and in contact with the organic EL element (20) is formed by the facing target sputtering method, and the other inorganic film which is included in the sealing layer (30) is formed by any method other than the facing target sputtering method.
    • 本发明旨在提供一种用于制造有机EL器件的方法,其可以在形成包括用于密封有机EL元件的无机层的膜形成期间形成对有机EL元件的损伤较小的膜。 当由一对电极构成的有机EL元件(20),其中至少一个电极是透明的或半透明的,以及包含保持在电极之间的发光层的有机EL层(22),以及 在基板(10),第一密封膜(10)上形成有至少一层与有机EL元件(20)接触并密封有机EL元件(20)的无机膜的密封层(30) 通过面对靶溅射法形成包含在密封层30中并与有机EL元件(20)接触的膜(31),并且包含在密封层(30)中的另一无机膜由 除面对靶溅射法以外的任何方法。