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1. 发明授权

US06255444B1 Aromatic ester (meth)acrylate dendrimers and curable resin composition 有权
标题翻译：（甲基）丙烯酸酯树枝状聚合物和可固化树脂组合物
公开(公告)号：US06255444B1
公开(公告)日：2001-07-03
申请号：US09485849
申请日：2000-02-17
申请人： Masatoshi Yuasa , Hironobu Kawasato , Takero Teramoto
发明人： Masatoshi Yuasa , Hironobu Kawasato , Takero Teramoto
IPC分类号： C08G6300
CPC分类号： C08G83/003 , C07C69/76 , C07C69/90 , C08F22/10 , C08F22/105 , C08L51/003 , C09D4/00 , C09D151/003 , C09J151/003 , C08F222/1006
摘要： This invention relates to an aromatic ester (meth)acrylate dendrimer composed of the core formed by an aromatic polycarboxylic acid and the branches formed by an aromatic compound containing one hydroxyl group and two carboxyl groups and represented by the following general formula (1) and also to a curable resin composition which contains the dendrimer and a polymerization initiator as essential components, is low in viscosity and highly curable, and forms a coating film with excellent heat and moisture resistance.
摘要翻译：本发明涉及由芳族多元羧酸形成的核心和由含有一个羟基和两个羧基并由下列通式（1）表示的芳族化合物形成的支链构成的芳族酯（甲基）丙烯酸酯树枝状聚合物，对于含有树枝状聚合物和聚合引发剂作为必要成分的固化性树脂组合物，粘度低，固化性高，形成耐热，耐湿性优异的涂膜。

2. 发明授权

US5520809A Separation membranes 失效
标题翻译：分离膜
公开(公告)号：US5520809A
公开(公告)日：1996-05-28
申请号：US97052
申请日：1993-07-27
申请人： Takero Teramoto , Kazuhiro Sugiyama , Masaya Furukawa , Hironobu Kawasato , Tutomu Kaneta , Kazuhiro Watanabe
发明人： Takero Teramoto , Kazuhiro Sugiyama , Masaya Furukawa , Hironobu Kawasato , Tutomu Kaneta , Kazuhiro Watanabe
IPC分类号： B01D71/48 , B01D71/50 , B01D71/52 , B01D71/56 , B01D71/64 , B01D71/68
CPC分类号： B01D71/56 , B01D71/48 , B01D71/50 , B01D71/52 , B01D71/64 , B01D71/68
摘要： This invention relates to separation membranes composed of a mixture of two kinds or more of polymers containing at least one kind of polymer selected from polyesters, polyethers, polycarbonates, polyamides, and polyimides with a fluorene skeleton and possessing a spongy structure throughout and the membranes can be made by a known simple process, have not only excellent separatory ability but also good mechanical properties, and are particularly useful for ultrafiltration membranes and gas separation membranes.
摘要翻译：本发明涉及由两种或更多种含有至少一种选自聚酯，聚醚，聚碳酸酯，聚酰胺和具有芴骨架的聚酰亚胺和具有整个海绵结构的聚合物的聚合物的混合物组成的分离膜，并且膜可以通过已知的简单方法制造，不仅具有优异的分离能力，而且具有良好的机械性能，并且对于超滤膜和气体分离膜特别有用。

3. 发明授权

US06444403B1 Resin laminated wiring sheet, wiring structure using the same, and production method thereof 失效
标题翻译：树脂层叠布线板及其制造方法
公开(公告)号：US06444403B1
公开(公告)日：2002-09-03
申请号：US09574222
申请日：2000-05-19
申请人： Tadanori Shimoto , Koji Matsui , Takero Teramoto , Hironobu Kawasato
发明人： Tadanori Shimoto , Koji Matsui , Takero Teramoto , Hironobu Kawasato
IPC分类号： G03F700
CPC分类号： H05K3/4617 , H05K3/0023 , H05K3/205 , H05K3/4007 , H05K2201/0355 , H05K2203/0733
摘要： A method of making a multilayer buildup printed circuit board and mounting substrate wherein a resin laminated wiring sheet, which has a copper foil, an epoxy-acrylate photosensitive resin composition having a fluorene structure, and a conductive pattern, are overlaid on the conductive pattern side of a supporting substrate at 100° C. and 3 kg/cm2, and adhered thereto at 200 to 300° C. and 10 kg/cm2. The copper foil is entirely etched by wet-etching or is etched into a predetermined pattern so as to form a wiring structure. Since the epoxy-acrylate photosensitive resin composition is not treated at 100° C. or more, and hence is in a semi-cured state, the epoxy-acrylate photosensitive resin composition can be heat-bonded onto the supporting substrate.
摘要翻译：一种制造多层堆积印刷电路板和安装基板的方法，其中将具有铜箔的树脂层压布线板，具有芴结构的环氧丙烯酸酯感光性树脂组合物和导电图案重叠在导电图案侧上的支撑基材在100℃和3kg / cm 2下，并在200〜300℃和10kg / cm 2下粘合。通过湿式蚀刻将铜箔完全蚀刻或蚀刻成预定图案以形成布线结构。由于环氧丙烯酸酯系感光性树脂组合物在100℃以上没有进行处理，因此处于半固化状态，因此环氧丙烯酸酯系感光性树脂组合物能够热粘合在支撑基材上。

4. 发明授权

US08026036B2 Photosensitive resin composition and circuit substrate employing the same 有权
标题翻译：感光树脂组合物和使用其的电路基板
公开(公告)号：US08026036B2
公开(公告)日：2011-09-27
申请号：US11887420
申请日：2006-03-24
申请人： Kiwamu Tokuhisa , Kentaro Hayashi , Hironobu Kawasato
发明人： Kiwamu Tokuhisa , Kentaro Hayashi , Hironobu Kawasato
IPC分类号： G03F7/00 , G03F7/004
CPC分类号： G03F7/037 , C08F283/12 , C08F290/14 , C08G73/1042 , C08G73/106 , C08G73/1075 , C08G73/1082 , C08K5/103 , C08L79/08 , C08L83/10 , G03F7/0387 , H05K3/0023 , H05K3/4676 , H05K2201/0154 , Y10S430/114 , Y10S430/12 , Y10S430/121 , Y10S430/146 , Y10T428/24802
摘要： The present invention relates to a photosensitive resin composition excellent in pliability, ultraviolet sensitivity for development, developability with an aqueous alkali solution, and storage stability at room temperature and a circuit substrate employing the same. The photosensitive resin composition includes a siloxane-containing polyamic acid resin having structural units respectively represented by the following formulae (1), (2), and (3) and a photopolymerization initiator incorporated therein. The circuit substrate is coated with the photosensitive resin composition. In the formulae, Ar represents a residue of an aromatic tetracarboxylic acid; R1 represents alkyl group having 1 to 6 carbon atoms or phenyl group; R2 represents alkylene group having 2 to 6 carbon atoms or phenylene group; l represents a number of 0 to 10; R3 represents a divalent group or a direct bond; R4 represents —CH2═CH—R6—, in which R6 represents a direct bond, alkylene group having 1 to 6 carbon atoms, or phenylene group; R5 represents a diamine residue; and m, n, and o, indicating the range of the abundant molar ratios of the respective structural units, are 0.3 to 0.95, 0.05 to 0.7, and 0 to 0.5, respectively.
摘要翻译：本发明涉及柔软性，紫外线敏感性，显色性，碱性水溶液的显影性和室温下的保存稳定性以及使用该感光性树脂组合物的电路基板。感光性树脂组合物包含具有分别由下式（1），（2）和（3）表示的结构单元的含硅氧烷的聚酰胺酸树脂和其中引入的光聚合引发剂。电路基板用感光性树脂组合物涂布。式中，Ar表示芳香族四羧酸的残基， R1表示碳原子数为1〜6的烷基或苯基; R2表示碳原子数2〜6的亚烷基或亚苯基; l表示0〜10的数; R3表示二价基团或直接键; R 4表示-CH 2 = CH-R 6 - ，其中R 6表示直接键，具有1至6个碳原子的亚烷基或亚苯基; R5表示二胺残基; m，n，o表示各结构单元的摩尔比的范围分别为0.3〜0.95,0.05〜0.7,0〜0.5的范围。

5. 发明申请

US20060115671A1 Copper-clad laminate 审中-公开
标题翻译：覆铜层压板
公开(公告)号：US20060115671A1
公开(公告)日：2006-06-01
申请号：US11288303
申请日：2005-11-29
申请人： Ryuzo Shinta , Yasufumi Matsumura , Hironobu Kawasato
发明人： Ryuzo Shinta , Yasufumi Matsumura , Hironobu Kawasato
IPC分类号： B21D39/00 , B32B15/08
CPC分类号： C23C28/00 , H05K3/389 , H05K2201/0154 , H05K2201/0355 , H05K2203/124 , Y10T428/12556 , Y10T428/12569
摘要： This invention relate to a copper-clad laminate with good adhesion between a copper foil and a layer of polyimide resin useful for high-density printed wiring boards. The copper-clad laminate having a copper foil treated with a heterocyclic compound containing nitrogen and sulfur as an organic surface treating agent and a layer of polyimide resin satisfying either of the following requirements: the concentration of sulfur atoms derived from the organic surface treating agent in the interface of copper and polyimide is in the range of 0.01-0.24 wt % as determined by an Energy dispersive X-ray spectroscopy (EDX); the weight of sulfur atoms derived from the organic surface treating agent per unit area of the copper foil is in the range of 2.5-3.1 mg/m2; and the concentration of sulfur atoms derived from the organic surface treating agent existing in the range from the surface to a depth of 16 nm of the copper foil is in the range of 1.73-2.30 atom % as determined by X-ray photoelectron spectroscopy (XPS).
摘要翻译：本发明涉及铜箔和用于高密度印刷电路板的聚酰亚胺树脂层之间具有良好粘附性的覆铜层压板。具有用氮和硫作为有机表面处理剂的杂环化合物处理的铜箔的覆铜层压板和满足以下任一要求的聚酰亚胺树脂层：衍生自有机表面处理剂的硫原子浓度通过能量色散X射线光谱法（EDX）测定，铜和聚酰亚胺的界面在0.01-0.24重量％的范围内; 来自有机表面处理剂的单位面积铜箔的硫原子的重量在2.5-3.1mg / m 2的范围内; 存在于铜箔表面至深度16nm范围内的有机表面处理剂的硫原子浓度为1.73〜2.30原子％的范围，通过X射线光电子能谱法（XPS ）。

6. 发明申请

US20070149758A1 Aromatic polyamic acid and polyimide 审中-公开
标题翻译：芳香族聚酰胺酸和聚酰亚胺
公开(公告)号：US20070149758A1
公开(公告)日：2007-06-28
申请号：US10584189
申请日：2004-12-06
申请人： Hongyuan Wang , Noriko Chikaraishi , Hironobu Kawasato
发明人： Hongyuan Wang , Noriko Chikaraishi , Hironobu Kawasato
IPC分类号： C08G69/08
CPC分类号： H05K1/0346 , C08G73/10 , C08G73/1067
摘要： The present invention relates to an aromatic polyimide which has excellent heat resistance and excellent thermal dimensional stability, and which realizes low hygroscopic property, and an aromatic polyamic acid as a precursor for the aromatic polyimide. Provided are an aromatic polyamic acid including a structural unit represented by the following general formula (1), and an aromatic polyimide obtained by imidating the aromatic polyamic acid. The aromatic polyamic acid or the aromatic polyimide can be a copolymerization-type aromatic polyamic acid or aromatic polyimide having another structural unit: where, Ar1 represents a tetravalent organic group produced from a tetracarboxylic acid having one or more aromatic rings, and R represents a hydrocarbon having 2 to 6 carbon atoms.
摘要翻译：本发明涉及具有优异的耐热性和优异的热尺寸稳定性并且实现低吸湿性的芳族聚酰亚胺和作为芳族聚酰亚胺的前体的芳族聚酰胺酸。提供包含由以下通式（1）表示的结构单元的芳族聚酰胺酸和通过酰亚胺芳族聚酰胺酸获得的芳族聚酰亚胺。芳香族聚酰胺酸或芳香族聚酰亚胺可以是具有其他结构单元的共聚型芳香族聚酰胺酸或芳香族聚酰亚胺，其中，Ar 1表示由具有一个以上的四羧酸生成的四价有机基团芳环，R表示碳原子数2〜6的烃。

7. 发明授权

US06780549B2 Photo-or heat-curable resin composition and multilayer printed wiring board 失效
标题翻译：光固化或热固化树脂组合物和多层印刷线路板
公开(公告)号：US06780549B2
公开(公告)日：2004-08-24
申请号：US09933946
申请日：2001-08-22
申请人： Masahiko Takeuchi , Kazuhiko Mizuuchi , Hironobu Kawasato
发明人： Masahiko Takeuchi , Kazuhiko Mizuuchi , Hironobu Kawasato
IPC分类号： G03F7075
CPC分类号： G03F7/0388 , G03F7/0047 , G03F7/038 , H05K3/0023 , H05K3/4676 , H05K2201/0209
摘要： This invention relates to a photo- or heat-curable resin composition which yields a cured product with minimal cracking and high reliability. The resin composition of this invention comprises 100 parts by weight of the resin-forming component containing a photo- or heat-polymerizable unsaturated compound and 0.01-5 parts by weight of an inorganic filler such as silica sol with its average particle diameter controlled in the range 5 nm-0.5 &mgr;m. The composition exhibits high heat resistance and good microfabrication quality and is useful as a peripheral material of electronic parts such as semiconductor devices by the build-up process, for example, as a material for forming insulation layers in multilayer printed wiring boards.
摘要翻译：本发明涉及光固化或热固化树脂组合物，其产生具有最小破裂和高可靠性的固化产物。本发明的树脂组合物包含100重量份含有光或热可聚合不饱和化合物的树脂形成组分和0.01-5重量份无机填料如二氧化硅溶胶，其平均粒径控制在范围5nm-0.5μm。该组合物表现出高的耐热性和良好的微细加工质量，并且作为用于在多层印刷线路板中形成绝缘层的材料的构建方法的半导体器件等电子部件的周边材料是有用的。

8. 发明授权

US06770421B2 Photo- or heat-curable resin composition and multilayer printed wiring board 失效
标题翻译：光固化或热固化树脂组合物和多层印刷线路板
公开(公告)号：US06770421B2
公开(公告)日：2004-08-03
申请号：US09996938
申请日：2001-11-30
申请人： Masahiko Takeuchi , Kazuhiko Mizuuchi , Hironobu Kawasato
发明人： Masahiko Takeuchi , Kazuhiko Mizuuchi , Hironobu Kawasato
IPC分类号： G03F7027
CPC分类号： C08G59/4292 , G03F7/027 , G03F7/038 , H05K1/0326 , H05K3/287 , H05K3/4644 , Y10T428/24917 , Y10T428/31515
摘要： This invention relates to a photo- or heat-curable resin composition which yields a cured product with minimal cracking and high reliability. The resin composition of this invention comprises 100 parts by weight of (A) photo- or heat-polymerizable unsaturated compound composed of a polycarboxylic acid adduct of bisphenol-epoxy (meth)acrylate, 10-100 parts by weight of (B) alkylene oxide-modified product of (meth)acrylate or oligomers thereof, 0-50 parts by weight of (C) compound containing epoxy group and 0-50 parts by weight of (D) photopolymerization initiator or sensitizer. The composition exhibits high heat resistance and good microfabrication quality and is useful as a peripheral material of electronic parts such as semiconductor devices by the build-up process, for example, as a material for forming insulation layers in multilayer printed wiring boards.
摘要翻译：本发明涉及光固化或热固化树脂组合物，其产生具有最小破裂和高可靠性的固化产物。本发明的树脂组合物包含100重量份由双酚环氧（甲基）丙烯酸酯的多元羧酸加合物，10-100重量份（B）环氧烷烃（甲基）丙烯酸酯或其低聚物的改性产物，0-50重量份的（C）含环氧基的化合物和0-50重量份的（D）光聚合引发剂或敏化剂。该组合物表现出高的耐热性和良好的微细加工质量，并且作为用于在多层印刷线路板中形成绝缘层的材料的构建方法的半导体器件等电子部件的周边材料是有用的。

9. 发明申请

US20090202786A1 Photosensitive Resin Composition and Circuit Substrate Employing the Same 有权
标题翻译：光敏树脂组合物和使用它的电路基板
公开(公告)号：US20090202786A1
公开(公告)日：2009-08-13
申请号：US11887420
申请日：2006-03-24
申请人： Kiwamu Tokuhisa , Kentaro Hayashi , Hironobu Kawasato
发明人： Kiwamu Tokuhisa , Kentaro Hayashi , Hironobu Kawasato
IPC分类号： B32B3/10 , G03F7/075
CPC分类号： G03F7/037 , C08F283/12 , C08F290/14 , C08G73/1042 , C08G73/106 , C08G73/1075 , C08G73/1082 , C08K5/103 , C08L79/08 , C08L83/10 , G03F7/0387 , H05K3/0023 , H05K3/4676 , H05K2201/0154 , Y10S430/114 , Y10S430/12 , Y10S430/121 , Y10S430/146 , Y10T428/24802
摘要： The present invention relates to a photosensitive resin composition excellent in pliability, ultraviolet sensitivity for development, developability with an aqueous alkali solution, and storage stability at room temperature and a circuit substrate employing the same. The photosensitive resin composition includes a siloxane-containing polyamic acid resin having structural units respectively represented by the following formulae (1), (2), and (3) and a photopolymerization initiator incorporated therein. The circuit substrate is coated with the photosensitive resin composition. In the formulae, Ar represents a residue of an aromatic tetracarboxylic acid; R1 represents alkyl group having 1 to 6 carbon atoms or phenyl group; R2 represents alkylene group having 2 to 6 carbon atoms or phenylene group; l represents a number of 0 to 10; R3 represents a divalent group or a direct bond; R4 represents —CH2═CH—R6—, in which R6 represents a direct bond, alkylene group having 1 to 6 carbon atoms, or phenylene group; R5 represents a diamine residue; and m, n, and o, indicating the range of the abundant molar ratios of the respective structural units, are 0.3 to 0.95, 0.05 to 0.7, and 0 to 0.5, respectively.
摘要翻译：本发明涉及柔软性，紫外线敏感性，显色性，碱性水溶液的显影性和室温下的保存稳定性以及使用该感光性树脂组合物的电路基板。感光性树脂组合物包含具有分别由下式（1），（2）和（3）表示的结构单元的含硅氧烷的聚酰胺酸树脂和其中引入的光聚合引发剂。电路基板用感光性树脂组合物涂布。式中，Ar表示芳香族四羧酸的残基， R1表示碳原子数为1〜6的烷基或苯基; R2表示碳原子数2〜6的亚烷基或亚苯基; l表示0〜10的数; R3表示二价基团或直接键; R 4表示-CH 2 -CH-R 6 - ，其中R 6表示直接键，具有1至6个碳原子的亚烷基或亚苯基; R5表示二胺残基; m，n，o表示各结构单元的摩尔比的范围分别为0.3〜0.95,0.05〜0.7,0〜0.5的范围。

10. 发明申请

US20080057299A1 Laminate for wiring board 审中-公开
标题翻译：接线板层压板
公开(公告)号：US20080057299A1
公开(公告)日：2008-03-06
申请号：US11891630
申请日：2007-08-10
申请人： Yasuhiro Adachi , Hironori Nagaoka , Hongyuan Wang , Naoko Osawa , Masahiko Takeuchi , Hironobu Kawasato
发明人： Yasuhiro Adachi , Hironori Nagaoka , Hongyuan Wang , Naoko Osawa , Masahiko Takeuchi , Hironobu Kawasato
IPC分类号： B32B15/08 , B32B27/06
CPC分类号： H05K1/0346 , C08G73/1042 , H05K1/036 , H05K2201/0154 , Y10T428/264 , Y10T428/31681
摘要： The present invention aims to provide a polyimide resin excellent in heat resistance, dimensional stability, and toughness as an insulating layer, and to obtain a laminate suitable for a flexible wiring board by using the polyimide resin, the laminate being excellent in resistance to rupture and flexibility even when the thickness of a polyimide resin layer is small. Provided is a laminate for a wiring board having a metal layer on at least one surface of a polyimide resin layer, in which a polyimide resin layer (A) obtained by imidating a polyimide precursor resin having a weight average molecular weight of 150,000 to 800,000 is a main polyimide resin layer, and a polyimide resin of which the main polyimide resin layer is constituted has structural units represented by the following general formulae (1) and (2) where R represents a lower alkyl group, a phenyl group, or a halogen atom, and Ar1 represents a residue of bis(aminophenoxy)benzene or bis(aminophenoxy)naphthalene.
摘要翻译：本发明旨在提供一种作为绝缘层的耐热性，尺寸稳定性和韧性优异的聚酰亚胺树脂，并且通过使用聚酰亚胺树脂获得适用于柔性布线板的层压体，该层压板具有优异的抗断裂性和即使当聚酰亚胺树脂层的厚度小时也是灵活的。本发明提供一种在聚酰亚胺树脂层的至少一个表面上具有金属层的布线基板的叠层体，其中通过酰亚胺化重均分子量为150,000〜800,000的聚酰亚胺前体树脂得到的聚酰亚胺树脂层（A）为主要聚酰亚胺树脂层和主要聚酰亚胺树脂层构成的聚酰亚胺树脂具有由以下通式（1）和（2）表示的结构单元，其中R表示低级烷基，苯基或卤素原子和Ar 1表示双（氨基苯氧基）苯或双（氨基苯氧基）萘的残基。

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