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1. 发明申请

US20050031996A1 Method for producing circuit substrate 失效
标题翻译：电路基板的制造方法
公开(公告)号：US20050031996A1
公开(公告)日：2005-02-10
申请号：US10910271
申请日：2004-08-04
申请人： Keiichi Sasaki , Masato Kamiichi , Yukihiro Hayakawa , Ershad Chowdhury
发明人： Keiichi Sasaki , Masato Kamiichi , Yukihiro Hayakawa , Ershad Chowdhury
IPC分类号： B41J2/14 , B41J2/16 , G03F7/00 , H05K1/09 , H05K1/16 , H05K3/02 , H05K3/06 , H05K3/28
CPC分类号： H05K1/167 , B41J2/14072 , B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1642 , B41J2/1643 , B41J2/1646 , H05K1/09 , H05K3/06 , H05K3/067 , H05K2201/0317 , H05K2203/0361
摘要： In order to provide a circuit substrate with a satisfactory step coverage by the protective layer and the anti-cavitation film in an edge portion of wirings and a liquid discharge head utilizing such circuit substrate, the invention provides a method for producing a circuit substrate provided, on an insulating surface of a substrate, with a plurality of elements each including a resistive layer and a pair of electrodes formed with a predetermined spacing on said resistive layer, including a step of forming an aluminum electrode wiring layer on the resistive layer, a step of isolating the electrode wiring layer by dry etching into each element, and a step of forming the electrode wiring into a tapered cross section with an etching solution containing phosphoric acid, nitric acid and a chelating agent capable of forming a complex with the wiring metal.
摘要翻译：为了通过利用这种电路基板的布线边缘部分中的保护层和防空穴膜提供令人满意的阶梯覆盖的电路基板，本发明提供一种制造电路基板的方法，在基板的绝缘表面上，多个元件各自包括电阻层和在所述电阻层上以预定间隔形成的一对电极，包括在电阻层上形成铝电极布线层的步骤，步骤通过干蚀刻将电极配线层隔离成各元件，以及通过含有与配线金属形成络合物的磷酸，硝酸和螯合剂的蚀刻液将电极配线形成为锥形截面的工序。

2. 发明授权

US07309657B2 Circuit board, liquid discharge apparatus, and method of manufacturing the circuit board 有权
标题翻译：电路板，液体排出装置以及制造电路板的方法
公开(公告)号：US07309657B2
公开(公告)日：2007-12-18
申请号：US10929492
申请日：2004-08-31
申请人： Masato Kamiichi , Keiichi Sasaki
发明人： Masato Kamiichi , Keiichi Sasaki
IPC分类号： H01L21/302
CPC分类号： B41J2/1642 , B41J2/1412 , B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1646 , H05K1/167 , H05K3/06 , H05K2201/0317 , H05K2203/1453 , Y10T428/24917
摘要： Provided is a method for manufacturing a circuit board including an electrode wiring formed above a surface portion of a substrate, and a plurality of electrothermal converting elements which have a heating resistor film for generating thermal energy formed above the electrode wiring. The method includes: forming an electrode wiring layer for forming the electrode wiring, forming the heating resistor film; and collectively etching the electrode wiring layer and the heating resistor film to thereby form the electrode wiring. With the method according to the present invention, the circuit board can be manufactured with a higher density, higher endurance, and lower power consumption recording head to provide high resolution images.
摘要翻译：提供一种制造电路板的方法，该电路板包括形成在基板的表面部分上方的电极布线，以及多个电热转换元件，其具有用于产生形成在电极布线上方的热能的加热电阻膜。该方法包括：形成用于形成电极布线的电极布线层，形成加热电阻膜; 并且共同地蚀刻电极布线层和加热电阻膜，从而形成电极布线。利用根据本发明的方法，可以制造具有更高密度，更高耐久性和更低功耗记录头的电路板，以提供高分辨率图像。

3. 发明授权

US07270398B2 Circuit board and liquid discharging apparatus 有权
标题翻译：电路板和液体排放装置
公开(公告)号：US07270398B2
公开(公告)日：2007-09-18
申请号：US10968901
申请日：2004-10-21
申请人： Keiichi Sasaki , Masato Kamiichi , Ershad Ali Chowdhury , Yukihiro Hayakawa
发明人： Keiichi Sasaki , Masato Kamiichi , Ershad Ali Chowdhury , Yukihiro Hayakawa
IPC分类号： B41J2/05
CPC分类号： H01C17/065 , H01C17/281 , H05K1/167 , H05K3/02 , Y10T29/49126
摘要： A circuit board for a liquid discharging apparatus in which coating performance of a protective layer and a cavitation resistive film on a heat generating element is excellent and durability is excellent and a manufacturing method of such a circuit board are provided. A surface portion of a wiring material layer is processed so that an etching speed of the surface portion is made higher than that of the material forming the wiring material layer. It is desirable to execute a process for forming at least one selected from a fluoride, a chloride, and a nitride of the material forming the wiring material layer into the surface portion of the wiring material layer.
摘要翻译：一种用于液体排放装置的电路板，其中发热元件上的保护层和空穴电阻膜的涂层性能优异且耐久性优异，并且提供了这种电路板的制造方法。处理布线材料层的表面部分，使得表面部分的蚀刻速度高于形成布线材料层的材料的蚀刻速度。期望的是，将形成布线材料层的材料的氟化物，氯化物和氮化物中的至少一种形成到布线材料层的表面部分中。

4. 发明申请

US20050053774A1 Circuit board, liquid discharge apparatus, and method of manufacturing the circuit board 有权
标题翻译：电路板，液体排出装置以及制造电路板的方法
公开(公告)号：US20050053774A1
公开(公告)日：2005-03-10
申请号：US10929492
申请日：2004-08-31
申请人： Masato Kamiichi , Keiichi Sasaki
发明人： Masato Kamiichi , Keiichi Sasaki
IPC分类号： B32B3/00 , B41J2/05 , B41J2/14 , B41J2/16 , H05K1/16 , H05K3/02 , H05K3/06 , H05K3/28
CPC分类号： B41J2/1642 , B41J2/1412 , B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1646 , H05K1/167 , H05K3/06 , H05K2201/0317 , H05K2203/1453 , Y10T428/24917
摘要： Provided is a method for manufacturing a circuit board including an electrode wiring formed above a surface portion of a substrate, and a plurality of electrothermal converting elements which have a heating resistor film for generating thermal energy formed above the electrode wiring. The method includes: forming an electrode wiring layer for forming the electrode wiring, forming the heating resistor film; and collectively etching the electrode wiring layer and the heating resistor film to thereby form the electrode wiring. With the method according to the present invention, the circuit board can be manufactured with a higher density, higher endurance, and lower power consumption recording head to provide high resolution images.
摘要翻译：提供一种制造电路板的方法，该电路板包括形成在基板的表面部分上方的电极布线，以及多个电热转换元件，其具有用于产生形成在电极布线上方的热能的加热电阻膜。该方法包括：形成用于形成电极布线的电极布线层，形成加热电阻膜; 并且共同地蚀刻电极布线层和加热电阻膜，从而形成电极布线。利用根据本发明的方法，可以制造具有更高密度，更高耐久性和更低功耗记录头的电路板，以提供高分辨率图像。

5. 发明授权

US07244370B2 Method for producing circuit substrate 失效
标题翻译：电路基板的制造方法
公开(公告)号：US07244370B2
公开(公告)日：2007-07-17
申请号：US10910271
申请日：2004-08-04
申请人： Keiichi Sasaki , Masato Kamiichi , Yukihiro Hayakawa , Ershad Ali Chowdhury
发明人： Keiichi Sasaki , Masato Kamiichi , Yukihiro Hayakawa , Ershad Ali Chowdhury
IPC分类号： G01D15/00 , G11B5/127 , H01B13/00
CPC分类号： H05K1/167 , B41J2/14072 , B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1642 , B41J2/1643 , B41J2/1646 , H05K1/09 , H05K3/06 , H05K3/067 , H05K2201/0317 , H05K2203/0361
摘要： In order to provide a circuit substrate with a satisfactory step coverage by the protective layer and the anti-cavitation film in an edge portion of wirings and a liquid discharge head utilizing such circuit substrate, the invention provides a method for producing a circuit substrate provided, on an insulating surface of a substrate, with a plurality of elements each including a resistive layer and a pair of electrodes formed with a predetermined spacing on said resistive layer, including a step of forming an aluminum electrode wiring layer on the resistive layer, a step of isolating the electrode wiring layer by dry etching into each element, and a step of forming the electrode wiring into a tapered cross section with an etching solution containing phosphoric acid, nitric acid and a chelating agent capable of forming a complex with the wiring metal.
摘要翻译：为了通过利用这种电路基板的布线边缘部分中的保护层和防空穴膜提供令人满意的阶梯覆盖的电路基板，本发明提供一种制造电路基板的方法，在基板的绝缘表面上，多个元件各自包括电阻层和在所述电阻层上以预定间隔形成的一对电极，包括在电阻层上形成铝电极布线层的步骤，步骤通过干蚀刻将电极配线层隔离成各元件，以及通过含有与配线金属形成络合物的磷酸，硝酸和螯合剂的蚀刻液将电极配线形成为锥形截面的工序。

6. 发明申请

US20050078152A1 Circuit board and liquid discharging apparatus 有权
标题翻译：电路板和液体排放装置
公开(公告)号：US20050078152A1
公开(公告)日：2005-04-14
申请号：US10968901
申请日：2004-10-21
申请人： Keiichi Sasaki , Masato Kamiichi , Ershad Chowdhury , Yukihiro Hayakawa
发明人： Keiichi Sasaki , Masato Kamiichi , Ershad Chowdhury , Yukihiro Hayakawa
IPC分类号： B41J2/05 , H01C17/065 , H01C17/28 , H05K1/16 , H05K3/02
CPC分类号： H01C17/065 , H01C17/281 , H05K1/167 , H05K3/02 , Y10T29/49126
摘要： A circuit board for a liquid discharging apparatus in which coating performance of a protective layer and a cavitation resistive film on a heat generating element is excellent and durability is excellent and a manufacturing method of such a circuit board are provided. A surface portion of a wiring material layer is processed so that an etching speed of the surface portion is made higher than that of the material forming the wiring material layer. It is desirable to execute a process for forming at least one selected from a fluoride, a chloride, and a nitride of the material forming the wiring material layer into the surface portion of the wiring material layer.
摘要翻译：一种用于液体排放装置的电路板，其中发热元件上的保护层和空穴电阻膜的涂层性能优异且耐久性优异，并且提供了这种电路板的制造方法。处理布线材料层的表面部分，使得表面部分的蚀刻速度高于形成布线材料层的材料的蚀刻速度。期望的是，将形成布线材料层的材料的氟化物，氯化物和氮化物中的至少一种形成到布线材料层的表面部分中。

7. 发明授权

US06838351B2 Manufacturing method of circuit board, circuit board, and liquid discharging apparatus 有权
标题翻译：电路板，电路板和液体排放装置的制造方法
公开(公告)号：US06838351B2
公开(公告)日：2005-01-04
申请号：US10805191
申请日：2004-03-22
申请人： Keiichi Sasaki , Masato Kamiichi , Ershad Ali Chowdhury , Yukihiro Hayakawa
发明人： Keiichi Sasaki , Masato Kamiichi , Ershad Ali Chowdhury , Yukihiro Hayakawa
IPC分类号： B41J2/05 , H01C17/065 , H01C17/28 , H05K1/16 , H05K3/02 , H01L27/02
CPC分类号： H01C17/065 , H01C17/281 , H05K1/167 , H05K3/02 , Y10T29/49126
摘要： A circuit board for a liquid discharging apparatus in which coating performance of a protective layer and a cavitation resistive film on a heat generating element is excellent and durability is excellent and a manufacturing method of such a circuit board are provided. A surface portion of a wiring material layer is processed so that an etching speed of the surface portion is made higher than that of the material forming the wiring material layer. It is desirable to execute a process for forming at least one selected from a fluoride, a chloride, and a nitride of the material forming the wiring material layer into the surface portion of the wiring material layer.
摘要翻译：一种用于液体排放装置的电路板，其中发热元件上的保护层和空穴电阻膜的涂层性能优异且耐久性优异，并且提供了这种电路板的制造方法。处理布线材料层的表面部分，使得表面部分的蚀刻速度高于形成布线材料层的材料的蚀刻速度。期望的是，将形成布线材料层的材料的氟化物，氯化物和氮化物中的至少一种形成到布线材料层的表面部分中。

8. 发明授权

US08157357B2 Circuit substrate and liquid discharging apparatus with a first wiring layer directly connected to the substrate and a second wiring layer connected to the first wiring layer through a metal film 有权
标题翻译：具有直接连接到基板的第一布线层的电路基板和液体排出装置以及通过金属膜连接到第一布线层的第二布线层
公开(公告)号：US08157357B2
公开(公告)日：2012-04-17
申请号：US12429517
申请日：2009-04-24
申请人： Keiichi Sasaki
发明人： Keiichi Sasaki
IPC分类号： B41J2/05
CPC分类号： B41J2/14072 , B41J2202/13
摘要： The present invention provides a higher density, higher resolution, higher durability and lower cost circuit substrate. In a circuit substrate in which a circuit including: a plurality of heat generating elements in which a pair of electrodes opposing each other to form a predetermined gap is provided on a resistor 16 and a portion where a resistor layer is positioned between the electrodes is taken as a resistor portion; and first and second wiring layers 12 and 15 for energizing the pair of electrodes of each heat generating element; is mounted on a substrate 10, the substrate is formed of Si, the first wiring layer is formed of a metal material containing at least Si, the first wiring layer is electrically connected to the substrate, the second wiring layer is provided on the first wiring layer through a metal film 14 for preventing Si from diffusing and a resistor is provided over the second wiring layer.
摘要翻译：本发明提供了更高密度，更高分辨率，更高耐久性和更低成本的电路基板。在电路基板中，电路包括：多个发热元件，其中一对彼此相对以形成预定间隙的电极被设置在电阻器16上，并且电阻层位于电极之间的部分被取走作为电阻部分; 以及用于激励每个发热元件的一对电极的第一和第二布线层12和15; 安装在基板10上，基板由Si形成，第一布线层由至少含有Si的金属材料形成，第一布线层与基板电连接，第二布线层设置在第一布线通过用于防止Si扩散的金属膜14，并且在第二布线层上设置电阻器。

9. 发明授权

US07829975B2 Multichip semiconductor device, chip therefor and method of formation thereof 有权
标题翻译：多芯片半导体器件，芯片及其形成方法
公开(公告)号：US07829975B2
公开(公告)日：2010-11-09
申请号：US11980641
申请日：2007-10-31
申请人： Nobuo Hayasaka , Katsuya Okumura , Keiichi Sasaki , Mie Matsuo
发明人： Nobuo Hayasaka , Katsuya Okumura , Keiichi Sasaki , Mie Matsuo
IPC分类号： H01L29/40
CPC分类号： H01L23/642 , H01L21/76898 , H01L23/367 , H01L23/481 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/0557 , H01L2224/06181 , H01L2224/13025 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2225/06513 , H01L2225/06527 , H01L2225/06541 , H01L2225/06572 , H01L2225/06589 , H01L2225/1023 , H01L2225/1058 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/13091 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/00
摘要： A multichip semiconductor device is disclosed in which chips are stacked each of which comprises a semiconductor substrate formed on top with circuit components and an interlayer insulating film formed on the top of the semiconductor substrate. At least one of the chips has a connect plug of a metal formed in a through hole that passes through the semiconductor substrate and the interlayer insulating film. The chip with the connect plug is electrically connected with another chip by that connect plug.
摘要翻译：公开了一种多芯片半导体器件，其中堆叠芯片，每个芯片包括形成在顶部的半导体衬底和电路部件，以及形成在半导体衬底的顶部上的层间绝缘膜。至少一个芯片具有穿过半导体衬底和层间绝缘膜的通孔中形成的金属的连接插头。具有连接插头的芯片通过该连接插头与另一个芯片电连接。

10. 发明授权

US07711217B2 Active sensor, multipoint active sensor, method for diagnosing deterioration of pipe, and apparatus for diagnosing deterioration of pipe, and apparatus for diagnosis deterioration of pipe 有权
标题翻译：主动传感器，多点有源传感器，管道劣化诊断方法，管道劣化诊断装置，管道诊断劣化装置
公开(公告)号：US07711217B2
公开(公告)日：2010-05-04
申请号：US12101395
申请日：2008-04-11
申请人： Masashi Takahashi , Keiichi Sasaki , Nobuo Yamaga , Norio Ahiko , Koichi Yoshimura , Masanobu Ohi , Yoshio Mochida , Yuuichi Machijima , Takehiro Shirai
发明人： Masashi Takahashi , Keiichi Sasaki , Nobuo Yamaga , Norio Ahiko , Koichi Yoshimura , Masanobu Ohi , Yoshio Mochida , Yuuichi Machijima , Takehiro Shirai
IPC分类号： G02B6/00 , G01B11/02 , G21C17/017
CPC分类号： G01N29/2418 , G01B17/02 , G01N29/043 , G01N29/07 , G01N29/2412 , G01N29/348 , G01N2291/0258 , G01N2291/02854 , G01N2291/044 , G01N2291/2634 , G21C17/017
摘要： An active sensor 10 is positioned on an outside of a pipe 60 so as to detect a thickness of the pipe. The active sensor comprises: an oscillator 15 capable of inputting oscillatory waves into the pipe and sweeping a frequency of the oscillatory waves within a desired range; and an optical fiber sensor mounted on the pipe, the optical fiber sensor detecting the oscillatory waves generated in the pipe.
摘要翻译：有源传感器10定位在管道60的外侧，以便检测管道的厚度。有源传感器包括：振荡器15，其能够将振荡波输入到管道中并将振荡波的频率扫描在期望的范围内; 以及安装在管道上的光纤传感器，光纤传感器检测管道中产生的振荡波。

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