会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明授权
    • MOS field effect transistor device with buried channel
    • MOS场效应晶体管器件具有埋入通道
    • US4916500A
    • 1990-04-10
    • US78987
    • 1987-07-29
    • Yoshiaki YazawaAtsuo WatanabeAtsushi HiraishiMasataka MinamiTakahiro Nagano
    • Yoshiaki YazawaAtsuo WatanabeAtsushi HiraishiMasataka MinamiTakahiro Nagano
    • H01L29/10H01L29/78H01L29/786H01L29/808
    • H01L29/78696H01L29/105H01L29/78H01L29/7838H01L29/808
    • The present invention relates to a semiconductor device comprising a semiconductor substrate of a first conductivity type or an insulator, a source comprising an impurity layer of a second conductivity type disposed on said semiconductor substrate or said insulator, a drain comprising an impurity layer of the second conductivity type disposed on said semiconductor substrate or said insulator, an impurity layer of the first conductivity type formed between said source and said drain, a gate formed on said impurity layer of the first conductivity type via an insulation film, and an impurity layer of the second conductivity type having an impurity concentration lower than that of said source and said drain, said impurity layer of the second conductivity type being disposed between said source, said drain and said impurity layer of the first conductivity type, and said semiconductor substrate of the first conductivity type or said insulator.
    • 本发明涉及一种包括第一导电类型或绝缘体的半导体衬底的半导体器件,包括设置在所述半导体衬底或所述绝缘体上的第二导电类型的杂质层的源极,包括第二导电类型或绝缘体的杂质层的漏极 设置在所述半导体衬底或所述绝缘体上的导电类型,形成在所述源极和所述漏极之间的第一导电类型的杂质层,经由绝缘膜形成在所述第一导电类型的所述杂质层上的栅极和 第二导电类型的杂质浓度低于所述源极和漏极的第二导电类型,所述第二导电类型的所述杂质层设置在所述源极,所述漏极和所述第一导电类型的所述杂质层之间,所述第一导电类型的所述半导体衬底 导电类型或所述绝缘体。
    • 6. 发明授权
    • Method of fabricating bipolar transistor having high speed and MOS
transistor having small size
    • 制造具有高速度的双极晶体管的方法和具有小尺寸的MOS晶体管
    • US5506156A
    • 1996-04-09
    • US279087
    • 1994-07-22
    • Atsuo WatanabeKazushige SatoTakahiro NaganoShoji ShukuriTakashi Nishida
    • Atsuo WatanabeKazushige SatoTakahiro NaganoShoji ShukuriTakashi Nishida
    • H01L29/73H01L21/331H01L21/8249H01L27/06H01L29/732H01L21/265
    • H01L21/8249Y10S148/009
    • A semiconductor device includes a plurality of semiconductor regions of a first conductive type and a plurality of semiconductor regions of a second conductive type. AMOS transistor having a channel of the second conductive type is formed in the semiconductor regions of the first conductive type, and a bipolar transistor and a MOS transistor having a channel of the first conductive type are formed in the semiconductor regions of the second conductive type. Each of the semiconductor regions of the first conductive type is made up of a semiconductor layer where the impurity concentration decreases with the depth from the surface thereof, a first buried layer of the first conductive type which is formed in a semiconductor substrate and where the impurity concentration distribution in the direction of thickness has a single peak value, and a second buried layer of the first conductive type which is formed between the semiconductor layer and the first buried layer and where the impurity concentration distribution in the direction of thickness has a single peak value. The first and second buried layers are formed by the ion implantation method, after an epitaxial growth process and a field oxidation process have been completed.
    • 半导体器件包括多个第一导电类型的半导体区域和第二导电类型的多个半导体区域。 具有第二导电类型的沟道的AMOS晶体管形成在第一导电类型的半导体区域中,并且在第二导电类型的半导体区域中形成具有第一导电类型的沟道的双极晶体管和MOS晶体管。 第一导电类型的半导体区域由半导体层构成,其中杂质浓度随着其表面的深度而减小,第一导电类型的第一掩埋层形成在半导体衬底中,并且杂质 在厚度方向上的浓度分布具有单个峰值,并且形成在半导体层和第一掩埋层之间的第一导电类型的第二掩埋层,并且其中厚度方向上的杂质浓度分布具有单峰 值。 在外延生长处理和场氧化处理完成之后,通过离子注入法形成第一和第二掩埋层。