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    • 1. 发明授权
    • Method and apparatus for producing super clean air
    • 生产超洁净空气的方法和设备
    • US6151914A
    • 2000-11-28
    • US152688
    • 1998-09-14
    • Masashi MizunoMasuo TadaNorio YamazakiToshiaki Ohmori
    • Masashi MizunoMasuo TadaNorio YamazakiToshiaki Ohmori
    • B01D53/04B01D53/00B01D53/02F04B27/10F25J3/04F25J1/00
    • F25J3/044B01D53/002B01D53/02F25J3/04284F25J3/04527F25J3/04563F25J3/04612F25J3/04636F25J2205/60F25J2215/40F25J2215/42Y10S62/909
    • Super clean air suitable for use in a tunnel-type wafer transport system, etc., is produced efficiently with the specific energy consumption reduced and the yield improved by making good use of part of cooling energy and gas produced in a low temperature separation type nitrogen producing apparatus. Material air 1a collected from the atmosphere is pretreated in a room temperature adsorption tower 7, this pretreated air is adsorption treated at -60.degree. C. in a first low temperature adsorption tower 9, and the treated air 1c is further adsorption treated at -150.degree. C. in a second low temperature adsorption tower 10, thereby producing super clean air 1e containing not higher than 1 ppb of the chemical components other than nitrogen, oxygen and noble gases and having a dew point of not higher than -100.degree. C. The airs 1b and 1c are cooled in heat exchangers 12, 13 and 14 by utilizing cooling energy produced in the low temperature separation type nitrogen producing apparatus, that is, the low temperature gas 3f passed through an expansion turbine 38 from a rectifying tower 37.
    • 适用于隧道式晶片输送系统等的超洁净空气通过降低比能量消耗而有效地生产,并且通过充分利用部分冷却能量和在低温分离型氮气中产生的气体而提高产率 生产设备。 从大气中收集的原料空气1a在室温吸附塔7中进行预处理,该预处理空气在-60℃下在第一低温吸附塔9中进行吸附处理,经处理的空气1c进一步在-150处进行吸附处理 在第二低温吸附塔10中,由此产生除了氮气,氧气和惰性气体以外并且露点不高于-100℃的不超过1ppb的化学成分的超洁净空气1e。 空气1b和1c通过利用低温分离式氮气生成装置中产生的冷却能量,即从精馏塔37通过膨胀涡轮机38的低温气体3f而在热交换器12,13和14中冷却。
    • 2. 发明授权
    • Processing apparatus for semiconductor wafers
    • 半导体晶圆加工装置
    • US4932168A
    • 1990-06-12
    • US177784
    • 1988-04-05
    • Masuo TadaTakeki HataTakaaki FukumotoToshiaki Ohmori
    • Masuo TadaTakeki HataTakaaki FukumotoToshiaki Ohmori
    • B08B7/00B24C1/00B24C3/32F25C1/00H01L21/306H01L21/322
    • H01L21/02043B08B7/0092B24C1/003B24C3/322F25C1/00H01L21/3221Y10S438/906
    • A cleaning method and a gettering method for semiconductor wafers comprises blasting frozen particles at the surface of a semiconductor wafer. A processing apparatus for a semiconductor wafer comprises means for forming ultrafine frozen particles and means for blasting the frozen particles at the surface of a semiconductor wafer to perform either the gettering or the cleaning of the semiconductor wafer. In one form of the invention, the frozen particles are formed by spraying a mist of water into a chamber partially filled with liquid nitrogen, which freezes the mist to form ice particles. In another form of the invention, the frozen particles are formed by spraying a mist of water into a chamber containing cold nitrogen gas, which freezes the mist to form ice particles. In another form of the invention, the frozen particles are formed by heating water to form water vapor and introducing the water vapor into a freezing chamber containing a two-phase mixture of a coolant which freezes the vapor into ultrafine particles. The frozen particles are blasted at a semiconductor wafer through a blasting nozzle by a gas such as nitrogen gas. When the frozen particles are used for gettering, they may further include abrasive particles such as silica powder.
    • 用于半导体晶片的清洁方法和吸气方法包括在半导体晶片的表面喷砂冻结颗粒。 用于半导体晶片的处理装置包括用于形成超细冷冻颗粒的装置和用于在半导体晶片的表面喷砂冻结颗粒以进行半导体晶片的吸气或清洁的装置。 在本发明的一种形式中,冷冻颗粒是通过将一滴水喷入部分充满液氮的室中形成的,该室将液体冻结形成冰粒。 在本发明的另一形式中,冷冻颗粒是通过将水雾喷入含有冷氮气的室中而形成的,该冷室将冻结雾形成冰粒。 在本发明的另一形式中,冷冻颗粒是通过加热水以形成水蒸汽形成的,并将水蒸汽引入冷冻室,该冷冻室含有将蒸气冻结成超细颗粒的冷却剂的两相混合物。 冷冻颗粒通过诸如氮气的气体通过喷射喷嘴在半导体晶片上喷砂。 当冷冻颗粒用于吸气时,它们可以进一步包括研磨颗粒如二氧化硅粉末。
    • 7. 发明授权
    • Ice particle forming and blasting device
    • 冰粒形成和喷砂装置
    • US4974375A
    • 1990-12-04
    • US434982
    • 1989-11-09
    • Masuo TadaTakaaki FukumotoToshiaki Ohmori
    • Masuo TadaTakaaki FukumotoToshiaki Ohmori
    • B08B7/02B24C1/00B24C3/22F25C1/00H01L21/00H01L21/304
    • H01L21/67028B24C1/003B24C3/22F25C1/00
    • A solid surface cleaning device utilizes a jet of ice particles of ultrapure water for removing contaminants from a surface of a solid such as a semiconductor wafer. The electrical resistivity of ultrapure water stored in a tank is reduced by means of a gas such as dry air or carbon dioxide evolving into the water from a bubble tube disposed in the tank. The water whose resistivity is thus reduced is sprayed from a nozzle into an ice-making container which is refrigerated by the vaporization of a refrigerant discharged into the container. The fine ice particles that are thus generated in the container are sprayed and blasted from a jet spray nozzle onto the surface of the cleaned solid supported within a jet spray chamber. The air inside the chamber is exhausted by a blower together with the ice particles that have been ejected from the jet spray nozzle.
    • 固体表面清洁装置利用超纯水的冰颗粒射流来从诸如半导体晶片的固体的表面去除污染物。 存储在罐中的超纯水的电阻率通过从设置在罐中的气泡管放入水中的气体例如干燥空气或二氧化碳减少。 电阻率如此降低的水从喷嘴喷射到制冷容器中,该制冰容器通过排放到容器中的制冷剂的蒸发而冷藏。 在容器中产生的细冰颗粒从喷射喷嘴喷射喷射到支撑在喷射喷雾室内的清洁固体的表面上。 室内的空气与从喷射喷嘴喷射的冰颗粒一起被鼓风机排出。