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1. 发明授权

US06977035B2 Method for electrolytic copper plating 失效
标题翻译：电解镀铜方法
公开(公告)号：US06977035B2
公开(公告)日：2005-12-20
申请号：US10723219
申请日：2003-11-26
申请人： Hideki Tsuchida , Masaru Kusaka , Shinjiro Hayashi
发明人： Hideki Tsuchida , Masaru Kusaka , Shinjiro Hayashi
IPC分类号： C25D3/38 , C25D21/16 , C25D21/18 , H01L21/28 , H01L21/288 , H01L21/768 , H05K3/18 , H05K3/42 , B01D17/06
CPC分类号： C25D21/18 , C25D3/38 , H01L21/2885 , H01L21/76877 , H05K3/423
摘要： A method for electrolytic copper plating using an electrolytic copper plating solution including a compound containing a structure of —X—S—Y—, wherein X and Y are independently chosen from hydrogen atom, carbon atom, sulfur atom, nitrogen atom, and oxygen atom, and X and Y may be the same only when they are a carbon atom, and by contacting the electrolytic copper plating solution with ozone is disclosed.
摘要翻译：一种电解镀铜方法，其特征在于，使用包含含有-XSY-结构的化合物的电解镀铜溶液，其中X和Y独立地选自氢原子，碳原子，硫原子，氮原子和氧原子，X和 Y可以相同，只要它们是碳原子，并且通过使电解铜电镀溶液与臭氧接触。

2. 发明授权

US06835294B2 Electrolytic copper plating method 有权
标题翻译：电解铜电镀法
公开(公告)号：US06835294B2
公开(公告)日：2004-12-28
申请号：US10165437
申请日：2002-06-07
申请人： Hideki Tsuchida , Masaru Kusaka , Shinjiro Hayashi
发明人： Hideki Tsuchida , Masaru Kusaka , Shinjiro Hayashi
IPC分类号： C25D2106
CPC分类号： C25D3/38 , C25D17/10 , C25D21/18 , H05K3/423
摘要： Electrolytic copper plating methods are provided, wherein copper is electrolytically deposited on a substrate, and the electrolytic copper plating solution supplied to the electrolytic copper plating is subjected to dummy electrolysis using an insoluble anode. The method described above can maintain and restore the electrolytic copper plating solution so as to maintain satisfactory appearance of plated copper, fineness of deposited copper film, and via-filling.
摘要翻译：提供电解铜电镀方法，其中将铜电解沉积在基板上，并将供应到电解铜电镀的电解铜电镀溶液用不溶性阳极进行虚拟电解。上述方法可以维持和恢复电解铜电镀溶液，以保持镀铜的良好外观，沉积铜膜的细度和通孔填充。

3. 发明授权

US06761814B2 Via filling method 失效
标题翻译：通过灌装方法
公开(公告)号：US06761814B2
公开(公告)日：2004-07-13
申请号：US10327588
申请日：2002-12-20
申请人： Masaru Kusaka , Hideki Tsuchida
发明人： Masaru Kusaka , Hideki Tsuchida
IPC分类号： C25D502
CPC分类号： H05K3/423 , C25D5/18 , C25D7/123 , H01L21/2885 , H05K2201/09563 , H05K2203/1492
摘要： A via filling method that provides superior filling properties and superior planarization of the deposited metal layer is provided. This is achieved by a method having a F/R ratio, the ratio of the electric current densities between the forward electrolysis and the reverse electrolysis, is in the range of 1/1 to 1/10 in a PPR electric current method applied with a cycle wherein the forward electrolysis interval is from 1 to 50 msec and the reverse electrolysis interval is from 0.2 to 5 msec.
摘要翻译：提供了提供优异的填充性能和优良的沉积金属层的平坦化的通孔填充方法。这是通过具有F / R比（正向电解和反向电解之间的电流密度比）的方法在应用于循环，其中正电解间隔为1至50毫秒，反电解间隔为0.2至5毫秒。

4. 发明授权

US07374652B2 Plating method 有权
标题翻译：电镀方法
公开(公告)号：US07374652B2
公开(公告)日：2008-05-20
申请号：US11482890
申请日：2006-07-07
申请人： Shinjiro Hayashi , Hideki Tsuchida , Masaru Kusaka , Koichi Yomogida
发明人： Shinjiro Hayashi , Hideki Tsuchida , Masaru Kusaka , Koichi Yomogida
IPC分类号： C25D5/02 , C25D5/56 , C25D3/38
CPC分类号： C25D3/38 , H05K3/423 , H05K2201/09563
摘要： Copper plating baths containing a leveling agent that is a reaction product of a compound including a heteroatom chosen from nitrogen, sulfur and a mixture of nitrogen and sulfur, with a polyepoxide compound containing an ether linkage that deposit copper on the surface of an electronic device and in apertures on such substrate are provided. Such plating baths deposit a copper layer on the substrate surface that is substantially planar across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.
摘要翻译：包含作为包含选自氮，硫和氮和硫的混合物的杂原子的化合物与包含在电子器件的表面上沉积铜的醚键的聚环氧化合物的反应产物的流平剂的镀铜浴，以及设置在这种基板上的孔中。这样的镀浴在基板表面上沉积一层铜层，该铜层在电解质浓度范围内基本上是平面的。还公开了使用这种镀铜浴沉积铜层的方法。

5. 发明申请

US20070007143A1 Plating method 有权
标题翻译：电镀方法
公开(公告)号：US20070007143A1
公开(公告)日：2007-01-11
申请号：US11482890
申请日：2006-07-07
申请人： Shinjiro Hayashi , Hideki Tsuchida , Masaru Kusaka , Koichi Yomogida
发明人： Shinjiro Hayashi , Hideki Tsuchida , Masaru Kusaka , Koichi Yomogida
IPC分类号： C25D3/38
CPC分类号： C25D3/38 , H05K3/423 , H05K2201/09563
摘要： Copper plating baths containing a leveling agent that is a reaction product of a compound including a heteroatom chosen from nitrogen, sulfur and a mixture of nitrogen and sulfur, with a polyepoxide compound containing an ether linkage that deposit copper on the surface of an electronic device and in apertures on such substrate are provided. Such plating baths deposit a copper layer on the substrate surface that is substantially planar across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.
摘要翻译：包含作为包含选自氮，硫和氮和硫的混合物的杂原子的化合物与包含在电子器件的表面上沉积铜的醚键的聚环氧化合物的反应产物的流平剂的镀铜浴，以及设置在这种基板上的孔中。这样的镀浴在基板表面上沉积一层铜层，该铜层在电解质浓度范围内基本上是平面的。还公开了使用这种镀铜浴沉积铜层的方法。

6. 发明申请

US20050164020A1 Composite material with improved binding strength and method for forming the same 审中-公开
标题翻译：具有改善结合强度的复合材料及其形成方法
公开(公告)号：US20050164020A1
公开(公告)日：2005-07-28
申请号：US11041682
申请日：2005-01-24
申请人： Masaru Seita , Hideki Tsuchida , Masaaki Imanari , Masaru Kusaka , Koichi Yomogida , Hidemi Nawafune , Syozo Mizumoto , Shingo Ikeda
发明人： Masaru Seita , Hideki Tsuchida , Masaaki Imanari , Masaru Kusaka , Koichi Yomogida , Hidemi Nawafune , Syozo Mizumoto , Shingo Ikeda
IPC分类号： B32B15/08 , C23C18/16 , C23C18/31 , C23C18/40 , C23C18/50 , C23C30/00 , H05K3/18 , H05K3/22
CPC分类号： H05K3/181 , C23C30/00 , H05K3/22 , H05K2203/0278 , H05K2203/121 , Y10T428/12014 , Y10T428/31692
摘要： This invention offers a composite material with improved binding strength and a method for its manufacture. In particular, the invention offers a composite material having metal at the surface of a resin base, obtained by subjecting the surface of a resin base to an ion exchange group introduction treatment, treating the surface of said resin base with liquid containing metal ions, and then reducing said metal ions, where the aforementioned composite material resin is characterized in that the resin base and metal of said composite material are hot-pressed. Said composite material has superior binding strength between resin base and metal relative to composite materials obtained by electroless plating which have inferior binding strength between resin base and metal. Moreover, said composite material is readily manufactured because hot-press methods can be used in the formation of said composite material.
摘要翻译：本发明提供了具有改进的结合强度的复合材料及其制造方法。特别地，本发明提供一种在树脂基材的表面具有金属的复合材料，其通过使树脂基材的表面进行离子交换基团导入处理，用含有金属离子的液体处理所述树脂基材的表面，以及然后还原所述金属离子，其中上述复合材料树脂的特征在于所述复合材料的树脂基材和金属被热压。所述复合材料相对于通过化学镀获得的复合材料，树脂基材和金属之间的粘合强度差，具有优异的粘结强度。此外，所述复合材料容易制造，因为可以使用热压法来形成所述复合材料。

7. 发明授权

US06899781B2 Method for forming resin composite material 失效
标题翻译：树脂复合材料成型方法
公开(公告)号：US06899781B2
公开(公告)日：2005-05-31
申请号：US10286607
申请日：2002-11-01
申请人： Masaru Seita , Hideki Tsuchida , Masaaki Imanari , Koichi Yomogida , Hidemi Nawafune
发明人： Masaru Seita , Hideki Tsuchida , Masaaki Imanari , Koichi Yomogida , Hidemi Nawafune
IPC分类号： C23C28/00 , B32B15/08 , B32B15/088 , B32B15/20 , B32B37/12 , B32B38/00 , B32B38/10 , H05K3/00 , H05K3/02 , B44C1/165
CPC分类号： H05K3/025 , B32B15/08 , B32B37/025 , B32B37/12 , B32B38/0008 , B32B38/10 , B32B2311/00 , B32B2311/12 , B32B2375/00 , B32B2379/08 , B32B2457/00 , Y10T428/31678
摘要： This invention offers a method for forming a resin composite material, containing the steps of: (1) treating the surface of a carrier resin to treatment introduce ion exchange groups, (2) introducing metal ions to treat the carrier resin surface by treating the surface of said carrier resin with a solution containing metal ions, (3) converting said metal ions to a component containing a metal element, (4) forming a metal foil on top of said component containing a metal element, and (5) transferring said metal foil to a resin substrate by heating said metal foil. This method provides a carrier resin substrate having a metal foil of any desired thickness laminated or cast onto it. In this way a carrier resin containing a metal foil, particularly a copper foil, having a thickness, such as 8 μm or less, can be prepared that is otherwise difficult to prepare using conventional methods.
摘要翻译：本发明提供一种形成树脂复合材料的方法，包括以下步骤：（1）处理载体树脂的表面以处理引入离子交换基团，（2）通过处理表面来引入金属离子以处理载体树脂表面所述载体树脂与含有金属离子的溶液，（3）将所述金属离子转化成含有金属元素的成分，（4）在包含金属元素的所述成分的顶部上形成金属箔，和（5）转移所述金属通过加热所述金属箔对树脂基板箔。该方法提供了具有层压或铸造到其上的任何所需厚度的金属箔的载体树脂基板。以这种方式，可以制备含有诸如8μm或更小的厚度的金属箔，特别是铜箔的载体树脂，否则难以使用常规方法制备。

8. 发明授权

US06881319B2 Electrolytic copper plating solution and method for controlling the same 失效
标题翻译：电解铜电镀液及其控制方法
公开(公告)号：US06881319B2
公开(公告)日：2005-04-19
申请号：US10027919
申请日：2001-12-20
申请人： Masaru Seita , Hideki Tsuchida , Shinjiro Hayashi
发明人： Masaru Seita , Hideki Tsuchida , Shinjiro Hayashi
IPC分类号： C25D3/02 , C25D3/38 , C25D7/12 , H05K3/42 , C23C16/00 , C25D21/18
CPC分类号： C25D3/38 , C25D7/12 , H05K3/423
摘要： Disclosed are an electrolytic copper plating solution containing a specific sulfur-containing compound and a thiol-reactive compound, and an electrolytic copper plating process using such an electrolytic copper plating solution. The present invention can prevent the copper layer on the resulting composite material from forming aggregation and, when the plating is intended to fill vias, make it possible to achieve the via-filling without voids. The present invention also relates to a method for controlling the electrolytic copper plating solution by using an amount of a specific decomposition product of the sulfur-containing compound as an index.
摘要翻译：公开了含有特定含硫化合物和硫醇反应性化合物的电解铜电镀溶液和使用这种电解镀铜溶液的电解铜电镀工艺。本发明可以防止所得复合材料上的铜层形成聚集，并且当电镀用于填充通孔时，可以实现无空隙的通孔填充。本发明还涉及通过使用一定量的含硫化合物的特定分解产物作为指标来控制电解铜电镀溶液的方法。

9. 发明授权

US5653779A Method for manufacturing quartz glass components and molding frame therefor 失效
标题翻译：制造石英玻璃部件及其成型框架的方法
公开(公告)号：US5653779A
公开(公告)日：1997-08-05
申请号：US492848
申请日：1995-06-20
申请人： Makoto Saito , Hideki Tsuchida , Eiichi Shinomiya , Hiroyuki Kimura , Kimikazu Taniyama , Norikazu Fujii
发明人： Makoto Saito , Hideki Tsuchida , Eiichi Shinomiya , Hiroyuki Kimura , Kimikazu Taniyama , Norikazu Fujii
IPC分类号： C03B11/08 , C03B9/00 , C03B11/00 , C03B13/00 , C03B15/00
CPC分类号： C03B11/084 , C03B11/08 , C03B2215/07 , C03B2215/40 , Y02P40/57 , Y10S65/08
摘要： A quartz glass component having a projection on a flat face is manufactured by molding a quartz glass body at a high temperature and under high pressure. The heating temperature is set to a range of from 1800.degree. to 2000.degree. C. and slight pressure is applied by the female die which forms the projection, or pressure in a direction against gravity. The molding die includes a graphite frame surrounding a molding space formed by a female die and a receiving die sandwiching the quartz glass body in the graphite frame. The space between the receiving die and the female die is width-reducible, the compositions of the graphite frame and the two graphite dies are made to differ, the female die and receiving die contacting the quartz glass body during pressure molding have a plurality of gas-permeable micropores such as in sintered graphite for example and are formed by a high-purity graphite material having air permeability.
摘要翻译：通过在高温和高压下成型石英玻璃体来制造在平坦表面上具有突起的石英玻璃部件。加热温度设定在1800〜2000℃的范围内，并且通过形成突起的阴模施加轻微的压力，或者在反重力方向施加压力。成型模具包括围绕由阴模形成的模制空间的石墨框架和将石英玻璃体夹在石墨框架中的接收模具。接收管芯和阴模之间的空间是可宽度减小的，石墨框架和两个石墨模具的组成不同，在加压模制期间与石英玻璃体接触的阴模和接收模具具有多个气体例如在烧结石墨中的不透气微孔，并且由具有透气性的高纯度石墨材料形成。

10. 发明授权

US06821556B2 Process for producing heat sensitive recording material 失效
标题翻译：生产热敏记录材料的方法
公开(公告)号：US06821556B2
公开(公告)日：2004-11-23
申请号：US10111852
申请日：2002-04-30
申请人： Koichi Ishida , Kazuo Watanabe , Hideki Tsuchida , Yutaka Isu
发明人： Koichi Ishida , Kazuo Watanabe , Hideki Tsuchida , Yutaka Isu
IPC分类号： B41M520
CPC分类号： B41M5/44 , Y10S430/162
摘要： Disclosed are a heat-sensitive recording material comprising a support, a heat-sensitive recording layer comprising a leuco dye and a developer, and a protective layer comprising a resin in the form of a film, the protective layer being obtained by coating the heat-sensitive recording layer with a protective layer aqueous coating composition comprising at least resin particles having a core/shell structure and then drying the coating, wherein the resin in the form of a film formed of said resin particles having a core/shell structure is present in an amount of not less than 80 mass % of the total solids of the protective layer, and the protective layer having a gloss (based on JIS P 8142) of not less than 80%, a heat-sensitive recording material comprising an interlayer between the heat-sensitive recording layer and the support of the heat-sensitive recording material, as well as processes for preparing these heat-sensitive recording materials.
摘要翻译：公开了一种热敏记录材料，其包括载体，包含无色染料和显影剂的热敏记录层，以及包含薄膜形式的树脂的保护层，所述保护层通过涂覆热敏记录材料，具有至少包含具有核/壳结构的树脂颗粒，然后干燥涂层的保护层水性涂料组合物的敏感记录层，其中由具有核/壳结构的所述树脂颗粒形成的膜形式的树脂存在于保护层总固体量不小于80质量％的量，保护层具有不低于80％的光泽度（基于JIS P 8142），不高于80％的热敏记录材料包括：热敏记录层和热敏记录材料的支撑体，以及制备这些热敏记录材料的方法。

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