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1. 发明授权

US06331237B1 Method of improving contact reliability for electroplating 失效
标题翻译：提高电镀接触可靠性的方法
公开(公告)号：US06331237B1
公开(公告)日：2001-12-18
申请号：US09387856
申请日：1999-09-01
申请人： Panayotis C. Andricacos , W. Jean Horkans , Keith T. Kwietniak , Peter S. Locke , Cyprian E. Uzoh
发明人： Panayotis C. Andricacos , W. Jean Horkans , Keith T. Kwietniak , Peter S. Locke , Cyprian E. Uzoh
IPC分类号： C25D2106
CPC分类号： C25D7/123 , C25D5/003 , C25D21/12 , C25D21/18
摘要： A method of reducing etching of a seed layer by a plating solution. Prior to introducing the semiconductor wafer with the seed layer into the plating solution, the etching power of the plating solution is diminished.
摘要翻译：通过电镀液减少种子层的蚀刻的方法。在将具有种子层的半导体晶片引入电镀液之前，电镀液的蚀刻功率降低。

2. 发明授权

US06797141B1 Removal of coagulates from a non-glare electroplating bath 有权
标题翻译：从非眩光电镀浴中去除凝结物
公开(公告)号：US06797141B1
公开(公告)日：2004-09-28
申请号：US10148090
申请日：2002-10-03
申请人： Ralf Wilhelm Ludwig , Gerd Schöngen , Elmar Tolls
发明人： Ralf Wilhelm Ludwig , Gerd Schöngen , Elmar Tolls
IPC分类号： C25D2106
CPC分类号： C25D21/06
摘要： The invention deals with the technical problem to devise a process for the extended use of electrolytes which economically ensures a high electrolyte quality without having to accept production interruptions for regeneration. Especially, it is envisaged to conduct the process for the precipitation of non-glaring metal coatings in such a manner that work can proceed in three shifts for five days per week, without encountering production interruptions due to coagulation of the fine dispersal phase, respectively, and without the additional operating cost of a heating/cooling circuit. The invention solves the problem in that during the extended use of an electrolyte a partial flow is split off which is filtered and, if applicable, regenerated by the addition of active substances and reintegrated in the operating cycle.
摘要翻译：本发明涉及技术问题，以设计延长使用电解质的方法，其经济地确保高电解质质量，而不必接受生产中断再生。特别地，设想以不显现金属涂层的沉淀的方式进行沉淀，使得工作可以每周三班进行五天，而不会由于分散相的凝结而遭遇生产中断。并且没有加热/冷却回路的额外操作成本。本发明解决了这样的问题，即在电解质的延长使用期间，将部分流分离出来，其被过滤，如果适用，通过加入活性物质再生并重新整合在操作循环中。

3. 发明授权

US06835294B2 Electrolytic copper plating method 有权
标题翻译：电解铜电镀法
公开(公告)号：US06835294B2
公开(公告)日：2004-12-28
申请号：US10165437
申请日：2002-06-07
申请人： Hideki Tsuchida , Masaru Kusaka , Shinjiro Hayashi
发明人： Hideki Tsuchida , Masaru Kusaka , Shinjiro Hayashi
IPC分类号： C25D2106
CPC分类号： C25D3/38 , C25D17/10 , C25D21/18 , H05K3/423
摘要： Electrolytic copper plating methods are provided, wherein copper is electrolytically deposited on a substrate, and the electrolytic copper plating solution supplied to the electrolytic copper plating is subjected to dummy electrolysis using an insoluble anode. The method described above can maintain and restore the electrolytic copper plating solution so as to maintain satisfactory appearance of plated copper, fineness of deposited copper film, and via-filling.
摘要翻译：提供电解铜电镀方法，其中将铜电解沉积在基板上，并将供应到电解铜电镀的电解铜电镀溶液用不溶性阳极进行虚拟电解。上述方法可以维持和恢复电解铜电镀溶液，以保持镀铜的良好外观，沉积铜膜的细度和通孔填充。

4. 发明授权

US06685815B2 Electroplating of semiconductor wafers 失效
标题翻译：半导体晶圆的电镀
公开(公告)号：US06685815B2
公开(公告)日：2004-02-03
申请号：US10047537
申请日：2002-01-14
申请人： Nicolay Kovarsky
发明人： Nicolay Kovarsky
IPC分类号： C25D2106
CPC分类号： C25D7/12 , C25D17/001
摘要： An electro-chemical deposition apparatus and method are generally provided. In one embodiment of the invention, an electro-chemical deposition apparatus includes a housing having a substrate support disposed therein and adapted to rotate a substrate. One or more electrical contact elements are disposed on the substrate support. A drive system is disposed proximate the housing. The drive system is magnetically coupled to and adapted to rotate the substrate support. In another embodiment, a method of plating a substrate includes the steps of covering a substrate supported within a housing with electrolyte, and displacing a portion of the electrolyte from the housing prior to electrically biasing the substrate, and electrically biasing the substrate.
摘要翻译：通常提供电化学沉积装置和方法。在本发明的一个实施例中，电化学沉积设备包括壳体，其具有设置在其中的衬底支撑件并且适于旋转衬底。一个或多个电接触元件设置在基板支撑件上。驱动系统设置在壳体附近。驱动系统磁耦合到并适于旋转衬底支撑件。在另一个实施例中，电镀衬底的方法包括以下步骤：用电解质覆盖支撑在壳体内的衬底，并且在电偏置衬底之前将电解质的一部分从壳体移位，并使衬底电偏置。

5. 发明授权

US06379521B1 Method of producing zinc oxide film, method of producing photovoltaic element, and method of producing semiconductor element substrate 有权
标题翻译：氧化锌膜的制造方法，光电元件的制造方法以及半导体元件基板的制造方法
公开(公告)号：US06379521B1
公开(公告)日：2002-04-30
申请号：US09222848
申请日：1998-12-30
申请人： Yutaka Nishio
发明人： Yutaka Nishio
IPC分类号： C25D2106
CPC分类号： C25D7/0614 , C25D9/08 , C25D21/02
摘要： The present invention provides a method of producing a zinc oxide film, which comprises applying current between a conductive base member immersed in an electrodepositing bath and a counter electrode immersed in the electrodepositing bath to form a zinc oxide film on the conductive base member, wherein the electrodepositing bath is maintained at a temperature of 50° C. or more and has a temperature profile such that the temperature of the electrodepositing bath is lower in the final stage of electrodeposition than in the initial of electrodeposition. By the present method, a zinc oxide film with the excellent effect of light containment is stably produced in a short time, thereby producing a solar cell with a high efficiency at low a cost.
摘要翻译：本发明提供一种氧化锌膜的制造方法，其特征在于，在浸渍在电沉积槽中的导电性基材与浸渍在电沉积槽中的对电极之间施加电流，在导电性基材上形成氧化锌膜，电沉积浴保持在50℃或更高的温度，并且具有温度分布，使得在电沉积的最后阶段中电沉积浴的温度低于电沉积初期的温度。通过本方法，在短时间内稳定地制造出具有优异的光保护效果的氧化锌膜，从而以低的成本制造高效率的太阳能电池。

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