专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US4096822A Gaseous atmosphere control apparatus for a semiconductor manufacturing system 失效
标题翻译：用于半导体制造系统的气体气氛控制装置
公开(公告)号：US4096822A
公开(公告)日：1978-06-27
申请号：US727772
申请日：1976-09-29
申请人： Masao Yamawaki , Katsuo Aoki , Yoshio Oka , Takao Suzuki , Osamu Ina , Kunihiko Hara
发明人： Masao Yamawaki , Katsuo Aoki , Yoshio Oka , Takao Suzuki , Osamu Ina , Kunihiko Hara
IPC分类号： H01L21/31 , C23C16/44 , C23C16/455 , C30B31/16 , H01L21/22 , C23C11/00
CPC分类号： C30B31/16 , C23C16/455 , C23C16/45578
摘要： A gaseous atmosphere control apparatus for heat-treating semiconductors in a uniform gaseous atmosphere condition is disclosed. The control apparatus is provided with a reaction pipe through which semiconductor wafers are transferred to be heat-treated. A gas distribution pipe is fixed to the inside wall of the reaction pipe for guiding the transfer of the wafers and supplying heat-treating gas in the reaction pipe. The distribution pipe is provided with a plurality of blow-off holes, the diameter thereof being made wider as the pipe extends longitudinally, to thereby control the gaseous atmosphere condition in the reaction pipe to be uniform.
摘要翻译：公开了一种用于均匀气氛条件下热处理半导体的气体气氛控制装置。控制装置设置有反应管，半导体晶片通过该反应管被转印以进行热处理。气体分配管固定到反应管的内壁，用于引导晶片的转移并在反应管中供应热处理气体。分配管设置有多个排气孔，其管道纵向延伸时，其直径变宽，从而控制反应管中的气态气体状态均匀。

2. 发明授权

US4075972A Apparatus for thermal diffusion of semiconductor devices 失效
标题翻译：半导体器件的热扩散装置
公开(公告)号：US4075972A
公开(公告)日：1978-02-28
申请号：US714806
申请日：1976-08-16
申请人： Masao Yamawaki , Katsuo Aoki , Osamu Ina , Takao Suzuki , Yoshio Oka , Kunihiko Hara
发明人： Masao Yamawaki , Katsuo Aoki , Osamu Ina , Takao Suzuki , Yoshio Oka , Kunihiko Hara
IPC分类号： C30B31/06 , C30B31/10 , C23C13/12
CPC分类号： C30B31/06 , C30B31/106 , Y10S414/14
摘要： The invention discloses an apparatus for thermal diffusion of semiconductor devices, wherein a plurality of wafer boats each made of a refractory material and adapted to carry a predetermined number of wafers to be processed are sequentially fed into a furnace tube containing a high temperature, diffusion gas atmosphere and continuously transported at a predetermined speed through the furnace tube so that each wafer may have substantially the same thermal treatment and high productivity may be attained.
摘要翻译：本发明公开了一种用于半导体器件的热扩散的装置，其中由耐火材料制成并适于承载预定数量待处理的晶片的多个晶片舟片依次送入含有高温扩散气体通过炉管以预定速度连续输送，使得每个晶片可以具有基本上相同的热处理，并且可以获得高生产率。

3. 发明授权

US4069009A Apparatus for transferring semiconductor wafers 失效
标题翻译：用于转移半导体晶圆的装置
公开(公告)号：US4069009A
公开(公告)日：1978-01-17
申请号：US730720
申请日：1976-10-08
申请人： Masao Yamawaki , Katsuo Aoki , Yoshio Oka , Takao Suzuki , Osamu Ina , Kinihiko Hara
发明人： Masao Yamawaki , Katsuo Aoki , Yoshio Oka , Takao Suzuki , Osamu Ina , Kinihiko Hara
IPC分类号： B65G35/00 , H01L21/50 , H01L21/677 , F27B9/14
CPC分类号： H01L21/67712 , B65G35/00 , H01L21/6773
摘要： An apparatus for automatically transferring semiconductor wafers is disclosed. Semiconductor wafers are loaded on a boat which is placed on a pair of first supporting bars. A pair of second supporting bars are driven by a motor to repeat circular motion between the first supporting bars. The second supporting bars, circularly moving in parallel with the first supporting bars, forwardly transfer the boat. The boat is kept uplifted over the first supporting bars during the forward transfer thereof. Repetition of the circular motion of the second supporting bars makes the automatic transfer of the semiconductor wafers to be heat-treated in a semiconductor manufacturing system.
摘要翻译：公开了一种用于自动转移半导体晶片的设备。将半导体晶片装载在放置在一对第一支撑杆上的船上。一对第二支撑杆由马达驱动以在第一支撑杆之间重复圆周运动。与第一支撑杆平行移动的第二支撑杆向前移动船。在向前转移期间，船在第一支撑杆上保持隆起。第二支撑杆的圆周运动的重复使半导体制造系统中半导体晶片的自动转印被热处理。

4. 发明授权

US4147432A Apparatus for thermal diffusion by high frequency induction heating of semiconductor substrates 失效
标题翻译：用于通过半导体衬底的高频感应加热进行热扩散的装置
公开(公告)号：US4147432A
公开(公告)日：1979-04-03
申请号：US744049
申请日：1976-11-22
申请人： Masao Yamawaki , Katsuo Aoki , Yoshio Oka , Takao Suzuki , Masahiko Amano , Hideki Ozaki , Osamu Ishihara
发明人： Masao Yamawaki , Katsuo Aoki , Yoshio Oka , Takao Suzuki , Masahiko Amano , Hideki Ozaki , Osamu Ishihara
IPC分类号： C30B31/06 , B65G49/07 , C30B31/10 , C30B31/12 , H01L21/00 , H01L21/205 , H01L21/22 , H01L21/677 , C23C13/08
CPC分类号： H01L21/67103 , C30B31/106 , C30B31/12 , Y10S414/135
摘要： This invention relates to an apparatus for thermal diffusion by means of high frequency induction heating suitable for mass production of semiconductor substrates of uniform quality; wherein a plurality of heating bases, each made of a material having good electric conductivity, and carrying semiconductor substrates, are continuously fed through a furnace tube where the bases are heated by means of high frequency wave excitation in order that each semiconductor substrate receives substantially the same thermal treatment.
摘要翻译：本发明涉及一种适用于批量生产质量均匀的半导体衬底的高频感应加热热扩散装置。其中，由导电性良好的材料构成的多个加热基底和载持半导体基板的加热基板通过高频波激励而被加热的炉管连续供给，以使得每个半导体基板基本上接收同样的热处理。

5. 发明授权

US08309853B2 Flexible printed wiring board 有权
标题翻译：柔性印刷线路板
公开(公告)号：US08309853B2
公开(公告)日：2012-11-13
申请号：US12526917
申请日：2008-02-15
申请人： Yoshio Oka , Takashi Kasuga , Jinjoo Park , Kouki Nakama
发明人： Yoshio Oka , Takashi Kasuga , Jinjoo Park , Kouki Nakama
IPC分类号： H05K1/00
CPC分类号： H05K3/4685 , H05K1/0393 , H05K1/095 , H05K1/118 , H05K3/281 , H05K3/4069 , H05K3/4664 , H05K2201/0394 , H05K2201/10363 , H05K2203/1581
摘要： A flexible printed wiring board includes a substrate, conductor wirings, a coverlay film, a jumper wiring, and through holes. The conductor wirings are disposed on a first surface of the substrate. The coverlay film covers at least part of the conductor wirings. The jumper wiring electrically connects the conductor wirings to each other. The through holes are formed in the substrate and respectively open to the surfaces of the conductor wirings. The jumper wiring is composed of a hardened material of a conductive paste and is formed so that a second surface of the substrate is continuous with respective surfaces of the conductor wirings to which the through holes open.
摘要翻译：柔性印刷电路板包括基板，导体布线，覆盖膜，跳线布线和通孔。导体布线设置在基板的第一表面上。覆盖膜覆盖导体布线的至少一部分。跳线将导体布线彼此电连接。通孔形成在基板中并分别向导体配线的表面开口。跳线布线由导电浆料的硬化材料构成，并且形成为使得基板的第二表面与通孔打开的导体布线的各个表面连续。

6. 发明授权

US5830603A Separator film for a storage battery 失效
标题翻译：蓄电池隔膜
公开(公告)号：US5830603A
公开(公告)日：1998-11-03
申请号：US785881
申请日：1997-01-21
申请人： Yoshio Oka , Takafumi Uemiya , Takeshi Sakamoto , Akira Harada
发明人： Yoshio Oka , Takafumi Uemiya , Takeshi Sakamoto , Akira Harada
IPC分类号： H01M2/14 , H01M2/16 , H01M2/18
CPC分类号： H01M2/145 , H01M2/1653 , H01M2/1686 , H01M2/18
摘要： A separator film for a battery is formed as a hydrophilized porous biaxially oriented film. The porous biaxially oriented film has a porosity of at least about 70%, a thickness in the range of about 10 to about 500 .mu.m, and a pore size in the range of about 0.01 to about 20 .mu.m. The porous film is made of hydrophobic resin, and a hydrophilic high polymer which is fixed in the pores of the film. The hydrophilic high polymer may be heterogeneously distributed in the porous film, so that the separator film has a hydrophilic portion and a hydrophobic portion. The porosity and/or the pore size of the porous film can be varied in the direction of film thickness. The separator film is applied in an alkaline storage battery or a nonaqueous electrolyte battery such as a lithium battery.
摘要翻译：形成电池用隔膜作为亲水化多孔双轴取向膜。多孔双轴取向膜具有至少约70％的孔隙率，约10至约500μm范围内的厚度和约0.01至约20μm的孔径。该多孔膜由疏水性树脂制成，并且该亲水性高分子固定在膜的孔中。亲水性高分子可以非均匀地分布在多孔膜中，使得隔膜具有亲水部分和疏水部分。多孔膜的孔隙率和/或孔径可以在膜厚度方向上变化。隔膜用于碱性蓄电池或锂电池等非水电解质电池中。

7. 发明授权

US5083632A Saddle type off-road vehicle having a storage receptacle 失效
标题翻译：鞍式越野车具有存放容器
公开(公告)号：US5083632A
公开(公告)日：1992-01-28
申请号：US336829
申请日：1989-04-12
申请人： Kazuhiko Saito , Yoshio Oka
发明人： Kazuhiko Saito , Yoshio Oka
IPC分类号： B62J9/00 , B62K5/00
CPC分类号： B62K19/46 , B62J9/00 , B62K5/01
摘要： A saddle type, off-road vehicle, comprising a frame, an engine supported by the frame, at least one front wheel, a pair of rear wheels disposed on opposite sides of the frame, a seat supported on an upper portion of the frame, and a storage receptacle provided above the rear frame. The storage receptacle includes an element for reinforcing the strength and rigidity of an inner surface thereof and a partition for dividing the receptacle into a plurality of storage sections.
摘要翻译：一种鞍式越野车，包括框架，由框架支撑的发动机，至少一个前轮，设置在框架的相对侧上的一对后轮，支撑在框架的上部的座椅，以及设置在后框架上方的存储容器。存储容器包括用于增强其内表面的强度和刚度的元件和用于将容器分成多个存储部分的隔板。

8. 发明申请

US20100116525A1 FLEXIBLE PRINTED WIRING BOARD 有权
标题翻译：柔性印刷接线板
公开(公告)号：US20100116525A1
公开(公告)日：2010-05-13
申请号：US12526917
申请日：2008-02-15
申请人： Yoshio Oka , Takashi Kasuga , Jinjoo Park , Kouki Nakama
发明人： Yoshio Oka , Takashi Kasuga , Jinjoo Park , Kouki Nakama
IPC分类号： H05K1/02
CPC分类号： H05K3/4685 , H05K1/0393 , H05K1/095 , H05K1/118 , H05K3/281 , H05K3/4069 , H05K3/4664 , H05K2201/0394 , H05K2201/10363 , H05K2203/1581
摘要： A flexible printed wiring board includes a substrate, conductor wirings, a coverlay film, a jumper wiring, and through holes. The conductor wirings are disposed on a first surface of the substrate. The coverlay film covers at least part of the conductor wirings. The jumper wiring electrically connects the conductor wirings to each other. The through holes are formed in the substrate and respectively open to the surfaces of the conductor wirings. The jumper wiring is composed of a hardened material of a conductive paste and is formed so that a second surface of the substrate is continuous with respective surfaces of the conductor wirings which the through holes open.
摘要翻译：柔性印刷电路板包括基板，导体布线，覆盖膜，跳线布线和通孔。导体布线设置在基板的第一表面上。覆盖膜覆盖导体布线的至少一部分。跳线将导体布线彼此电连接。通孔形成在基板中并分别向导体配线的表面开口。跳线布线由导电膏的硬化材料构成，并且形成为使得基板的第二表面与通孔打开的导体布线的各个表面连续。

9. 发明申请

US20100044094A1 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：印刷线路板及其制造方法
公开(公告)号：US20100044094A1
公开(公告)日：2010-02-25
申请号：US12518398
申请日：2008-01-16
申请人： Yoshio Oka , Jinjoo Park , Kazuyuki Maeda , Narito Yagi , Tetsuya Shimomura , Junichiro Nishikawa
发明人： Yoshio Oka , Jinjoo Park , Kazuyuki Maeda , Narito Yagi , Tetsuya Shimomura , Junichiro Nishikawa
IPC分类号： H05K1/11 , H05K3/10
CPC分类号： H05K3/44 , H01B1/22 , H05K1/056 , H05K1/097 , H05K3/4069 , H05K2201/09554 , H05K2203/0315 , H05K2203/105 , H05K2203/1136 , Y10T29/49128 , Y10T29/49165
摘要： The printed wiring board 1 includes the metallic substrate 2, the insulating layer 3 provided on the surface of the metallic substrate 2, and the conductive layer 4 formed on the surface of the insulating layer 3. The conductive layer 4 is electrically connected to the metallic substrate 2. A bottomed via hole or a through hole 6 is formed in the insulating layer 3 and the conducive layer 4. The via hole has a bottom in the metallic substrate 2, and has a wall surface in the insulating layer 3 and in the conductive layer 4. The through hole 6 extends through the insulating layer 3, the conductive layer 4, and the metallic substrate 2. Conductive paste 7 fills the bottomed via hole or the through hole 6 to electrically connect the metallic substrate 2 and the conductive layer 4 with each other. The printed wiring board 1 is subjected to a process in which current is applied to the interface between the metallic substrate 2 and the conductive paste 7.
摘要翻译：印刷电路板1包括金属基板2，设置在金属基板2的表面上的绝缘层3和形成在绝缘层3的表面上的导电层4.导电层4电连接到金属基板2.在绝缘层3和导电层4中形成有底的通孔或通孔6.通孔在金属基板2中具有底部，并且在绝缘层3中具有壁表面通孔6延伸穿过绝缘层3，导电层4和金属基底2.导电浆料7填充有底的通孔或通孔6，以将金属基底2和导电层 4与彼此。对印刷布线板1进行电流施加到金属基板2和导电浆料7之间的界面的处理。

10. 发明申请

US20080063792A1 Board for printed wiring, printed wiring board, and method for manufacturing them 有权
标题翻译：印刷电路板，印刷线路板及其制造方法
公开(公告)号：US20080063792A1
公开(公告)日：2008-03-13
申请号：US11976490
申请日：2007-10-25
申请人： Noriki Hayashi , Yoshio Oka , Masahiko Kanda , Narito Yagi , Kenji Miyazaki , Kyouichirou Nakatsugi
发明人： Noriki Hayashi , Yoshio Oka , Masahiko Kanda , Narito Yagi , Kenji Miyazaki , Kyouichirou Nakatsugi
IPC分类号： H05K3/00
CPC分类号： H05K3/246 , H05K1/095 , H05K3/108 , H05K3/12 , H05K3/1216 , H05K3/16 , H05K3/381 , H05K3/388 , H05K2201/0347 , H05K2201/035 , H05K2203/072 , H05K2203/095 , Y10T29/49126
摘要： A novel board for printed wiring comprising a fine conductor wiring having a clear and favorable boundary line and fabricated by an ordinal printing method such as screen printing, a printed wiring board using the same, and methods for manufacturing them. A board for printed wiring and a method for manufacturing the same are characterized in that the surface of a board is subjected to one of the surface treatments: (a) roughening, (2) plasma treatment, (3) roughening and then plasma treatment, and (4) roughening and then forming of a metal film coating by sputtering. A printed wiring board and a method for manufacturing the same is characterize in that a conductor wiring is fabricated by printing using a conductive paste containing metal particles the average particle diameter of which is 4 μm or less and the maximum particle diameter of which is 15 μm or less. Another printed wiring board and a method for manufacturing the same is characterized in that the surface of a conductor wiring fabricated using a conductive paste containing metal particles M and a binder B at a volume ratio of M/B of 1/1 to 1.9/1 is etched, a plating coating is formed on the surface.
摘要翻译：一种用于印刷布线的新型印刷电路板，包括具有透明且有利的边界线的精细导体布线，并通过诸如丝网印刷的顺序印刷法，使用其的印刷线路板及其制造方法制造。印刷电路板及其制造方法的特征在于，对板的表面进行表面处理之一：（a）粗糙化，（2）等离子体处理，（3）粗糙化，然后进行等离子体处理，和（4）通过溅射粗化然后形成金属膜涂层。印刷电路板及其制造方法的特征在于，使用含有平均粒径为4μm以下，最大粒径为15μm的金属粒子的导电糊进行印刷，制造导体布线或更少。另一种印刷线路板及其制造方法的特征在于，使用含有金属粒子M和粘合剂B的M / B的体积比为1/1〜1.9 / 1的导电性糊剂制造的导体布线的表面被蚀刻，在表面上形成镀覆层。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式