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    • 4. 发明授权
    • Apparatus for heat treating semiconductor wafers
    • 用于热处理半导体晶片的设备
    • US4098223A
    • 1978-07-04
    • US738675
    • 1976-11-04
    • Wilhelm ErtlHelmut GuckelHugo RuchardtFritz Schneckenaichner
    • Wilhelm ErtlHelmut GuckelHugo RuchardtFritz Schneckenaichner
    • B65G33/06C30B31/10C30B31/14H01L21/324C23C11/00B05C13/02
    • H01L21/324B65G33/06C30B31/106C30B31/14
    • Method of heat treating semiconductor wafers in a continuous operation wherein the wafers are initially introduced into a tube where they are subjected to a heat treatment and then removed from the tube. The wafers are transported through the tube by a pair of horizontally disposed rods on which they are carried and by an additional guide rod which is located above the horizontal plane of the first rods. All three rods have a groove in the form of a screw thread into which the wafers may be seated. All three rods are caused to rotate in the same direction and the frictional contact of the wafers with the walls of each groove causes the wafers to rotate in the opposite direction from the rods while at the same time causing them to advance through the tube while being heated. If it is desired to have the entry speed and the exit speed to be faster or slower than that through the main body of the tube, the pitch of the screw thread may be increased or decreased, respectively, at the entrance and exit of the tube. The rods are preferably made of the same semiconductor material as the wafers.
    • 在连续操作中对半导体晶片进行热处理的方法,其中晶片最初被引入管中,在其中它们经受热处理,然后从管中取出。 晶片通过一对水平布置的杆被运送通过管子,它们被承载在该管上,并且通过位于第一杆的水平面上方的附加导杆。 所有三个杆具有螺纹形式的凹槽,晶片可以放在其中。 导致所有三个杆在相同的方向上旋转,并且晶片与每个槽的壁的摩擦接触导致晶片沿着与杆相反的方向旋转,同时使它们通过管前进,同时 加热。 如果希望入口速度和出口速度比通过管的主体更快或更慢,则螺纹的间距可以分别在管的入口和出口处增加或减小 。 杆优选由与晶片相同的半导体材料制成。