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    • 2. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE
    • 半导体存储器件
    • US20130234222A1
    • 2013-09-12
    • US13598748
    • 2012-08-30
    • Naoki YASUDAMasaaki HiguchiKatsuyuki SekineMasao Shingu
    • Naoki YASUDAMasaaki HiguchiKatsuyuki SekineMasao Shingu
    • H01L29/78
    • H01L27/11582G11C16/0483
    • A semiconductor memory device includes a substrate, a structure body, a semiconductor layer, and a memory film. The memory film is provided between the semiconductor layer and the plurality of electrode films. The memory film includes a charge storage film, a block film, and a tunnel film. The block film is provided between the charge storage film and the plurality of electrode films. The tunnel film is provided between the charge storage film and the semiconductor layer. The tunnel film includes a first film containing silicon oxide, a second film containing silicon oxide, and a third film provided between the first film and the second film and containing silicon oxynitride. When a composition of the silicon oxynitride contained in the third film is expressed by a ratio x of silicon oxide and a ratio (1−x) of silicon nitride, 0.5≦x
    • 半导体存储器件包括衬底,结构体,半导体层和存储膜。 存储膜设置在半导体层和多个电极膜之间。 存储膜包括电荷存储膜,块膜和隧道膜。 阻挡膜设置在电荷存储膜和多个电极膜之间。 隧道膜设置在电荷存储膜和半导体层之间。 隧道膜包括含有氧化硅的第一膜,含有氧化硅的第二膜和设置在第一膜和第二膜之间并含有氮氧化硅的第三膜。 当第三膜中所含的氮氧化硅的组成由氧化硅的比率x和氮化硅的比例(1-x)表示时,0.5×x≤1。
    • 4. 发明申请
    • NONVOLATILE SEMICONDUCTOR MEMORY DEVICE
    • 非易失性半导体存储器件
    • US20120319077A1
    • 2012-12-20
    • US13560557
    • 2012-07-27
    • Naoki YASUDADaisuke MATSUSHITAKoichi MURAOKA
    • Naoki YASUDADaisuke MATSUSHITAKoichi MURAOKA
    • H01L47/00
    • H01L27/101H01L27/1021H01L27/2418H01L27/2481
    • According to one embodiment, a nonvolatile semiconductor memory device includes a plurality of first interconnections arranged parallel, a plurality of second interconnections arranged parallel to intersect the first interconnections, and memory cell portions respectively arranged at intersecting portions between the first and second interconnections and each configured by laminating a variable-resistance element and a diode element. The diode element has a laminated structure having a first insulating film, a conductive fine grain layer and a second insulating film. The physical film thickness of the second insulating film is greater than the first insulating film and the dielectric constant of the second insulating film is greater than the first insulating film.
    • 根据一个实施例,非易失性半导体存储器件包括平行布置的多个第一互连,并行布置成与第一互连相交的多个第二互连,以及分别布置在第一和第二互连之间的相交部分处的每个配置的存储单元部分 通过层叠可变电阻元件和二极管元件。 二极管元件具有具有第一绝缘膜,导电细晶粒层和第二绝缘膜的层叠结构。 第二绝缘膜的物理膜厚度大于第一绝缘膜,并且第二绝缘膜的介电常数大于第一绝缘膜。
    • 6. 发明申请
    • NONVOLATILE SEMICONDUCTOR STORAGE DEVICE
    • 非易失性半导体存储器件
    • US20120205735A1
    • 2012-08-16
    • US13404073
    • 2012-02-24
    • Naoki YASUDAJun Fujiki
    • Naoki YASUDAJun Fujiki
    • H01L27/115
    • H01L21/28282H01L27/1157H01L29/66833H01L29/792
    • In one embodiment, there is provided a nonvolatile semiconductor storage device. The device includes: a plurality of nonvolatile memory cells. Each of the nonvolatile memory cells includes: a first semiconductor layer including a first source region, a first drain region, and a first channel region; a block insulating film formed on the first channel region; a charge storage layer formed on the block insulating film; a tunnel insulating film formed on the charge storage layer; a second semiconductor layer formed on the tunnel insulating film and including a second source region, a second drain region, and a second channel region. The second channel region is formed on the tunnel insulating film such that the tunnel insulating film is located between the second source region and the second drain region. A dopant impurity concentration of the first channel region is higher than that of the second channel region.
    • 在一个实施例中,提供了一种非易失性半导体存储装置。 该装置包括:多个非易失性存储单元。 每个非易失性存储单元包括:第一半导体层,包括第一源极区,第一漏极区和第一沟道区; 形成在所述第一沟道区上的块绝缘膜; 形成在所述块绝缘膜上的电荷存储层; 形成在电荷存储层上的隧道绝缘膜; 形成在所述隧道绝缘膜上并且包括第二源极区域,第二漏极区域和第二沟道区域的第二半导体层。 第二沟道区形成在隧道绝缘膜上,使得隧道绝缘膜位于第二源区和第二漏区之间。 第一沟道区的掺杂剂杂质浓度高于第二沟道区的掺杂剂杂质浓度。
    • 7. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20110254049A1
    • 2011-10-20
    • US13160204
    • 2011-06-14
    • Kazuhiro SHIMIZUHajime AKIYAMANaoki YASUDA
    • Kazuhiro SHIMIZUHajime AKIYAMANaoki YASUDA
    • H01L29/739H01L23/48H01L23/60H01L21/66
    • H01L21/67271H01L21/67282H01L2924/0002H01L2924/00
    • A semiconductor device manufacturing apparatus is provided with a drawing pattern printing part having a print head which injects a conductive solvent, an insulative solvent and an interface treatment solution. The print head is formed in such a way that desired circuit drawing pattern can be printed on a wafer based on information on the drawing pattern from a wafer testing part, information on the wafer from a storage part and coordinate information from a chip coordinate recognition part. In a semiconductor device manufacturing method according to the present invention, a semiconductor device is manufactured by using the semiconductor device manufacturing apparatus in such a manner that desired circuits are formed through printing process. In the semiconductor device, pad electrodes and so on are formed in such a way that trimming process can be conducted by printing circuit drawing patterns.
    • 半导体器件制造装置具备:具有喷射导电性溶剂的印刷头,绝缘性溶剂和界面处理液的图形印刷部。 打印头形成为使得可以基于来自晶片测试部件的绘图图案的信息,从存储部分获得关于晶片的信息和来自芯片坐标识别部分的坐标信息,将期望的电路图形图案印刷在晶片上 。 在根据本发明的半导体器件制造方法中,通过使用半导体器件制造设备以通过印刷处理形成期望的电路的方式制造半导体器件。 在半导体器件中,焊盘电极等以能够通过打印电路图形进行修整处理的方式形成。
    • 8. 发明申请
    • RESISTANCE CHANGE MEMORY
    • 电阻变化记忆
    • US20120061639A1
    • 2012-03-15
    • US13226974
    • 2011-09-07
    • Naoki YASUDA
    • Naoki YASUDA
    • H01L45/00
    • H01L27/2463G11C13/0002G11C13/0004G11C13/0007G11C13/003G11C2213/72H01L27/2409
    • According to one embodiment, a resistance change memory includes a memory cell unit. The memory cell unit is configured to stack a resistance change element and a diode element having non-ohmic properties, and the diode element is configured to stack in order to a semiconductor layer having a first conductivity type, a semiconductor layer having a second conductivity type, and a semiconductor layer having the first conductivity type from the first interconnect layer side. An area density of dopant impurities in the semiconductor layer having the second conductivity type is larger than a sum total of area densities of dopant impurities in the two semiconductor layers having the first conductivity type, and smaller than double an area density of an electric flux number associated with a threshold electric field of an interband tunneling current of a material includes the semiconductor layer having the second conductivity type.
    • 根据一个实施例,电阻变化存储器包括存储单元单元。 存储单元单元被配置为堆叠具有非欧姆特性的电阻变化元件和二极管元件,并且二极管元件被配置为堆叠以便具有第一导电类型的半导体层,具有第二导电类型的半导体层 以及具有来自第一互连层侧的第一导电类型的半导体层。 具有第二导电类型的半导体层中的掺杂剂杂质的面积密度大于具有第一导电类型的两个半导体层中的掺杂剂杂质的面积密度的总和,并且小于电通量的面积密度的两倍 与材料的带间隧穿电流的阈值电场相关联,包括具有第二导电类型的半导体层。