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    • 5. 发明授权
    • Image forming method and apparatus having a semiconductive intermediate
transfer member
    • 具有半导体中间转印构件的图像形成方法和装置
    • US5729799A
    • 1998-03-17
    • US730760
    • 1996-10-15
    • Kazunori NumaoNoriaki KojimaMasao OkuboNobukazu Takahashi
    • Kazunori NumaoNoriaki KojimaMasao OkuboNobukazu Takahashi
    • G03G15/00G03G15/16G03G21/06G03G21/08G03G21/10G03G21/00
    • G03G21/06
    • An image forming apparatus of such a type as is provided with a photosensitive member having a semi-conductive intermediate transfer member disposed opposite the photosensitive member. A charger electrically charges the photosensitive member. An exposure device forms an electrostatic latent image on the photosensitive member and developer visualizes the electrostatic latent image using toner identical in polarity to the photosensitive member. A primary transfer device transfers the toner image to the intermediate transfer member by applying a bias opposite in polarity to the photosensitive member, and a secondary transfer apparatus transfers the toner image on the intermediate transfer member to a transfer material. An optical charge-eliminator optically removes the electrical charge from the photosensitive member. A contact charge-eliminator is provided between the optical charge-eliminator and the primary transfer device so as to completely eliminate the electric charge injected into the photosensitive member at the time of the primary transfer.
    • 这种类型的图像形成装置设置有具有与感光构件相对设置的半导体中间转印构件的感光构件。 充电器使感光元件充电。 曝光装置在感光构件上形成静电潜像,并且显影剂使用与感光构件极性相同的调色剂使静电潜像显现。 一次转印装置通过施加与感光构件极性相反的偏压将调色剂图像转印到中间转印部件,二次转印装置将中间转印部件上的调色剂图像转印到转印材料上。 光学电荷消除器从光敏元件光学去除电荷。 在光学电荷消除器和一次转印装置之间提供接触电荷消除器,以便完全消除在一次转印时注入到感光构件中的电荷。
    • 10. 发明授权
    • Probe for testing a semiconductor integrated circuit
    • 用于测试半导体集成电路的探头
    • US06294922B1
    • 2001-09-25
    • US08773252
    • 1996-12-23
    • Masao OkuboKazumasa OkuboHiroshi Iwata
    • Masao OkuboKazumasa OkuboHiroshi Iwata
    • G01R3102
    • G01R3/00G01R1/07357
    • A first assembly configuration features in including: a plurality of probes having a buckling portion to buckle, upon a contact by an end of a contact portion onto an electrode of semiconductor integrated circuit; a first board provided with a first wiring pattern connected with a connecting portion of the probe; a second board removably fastened with the first board and provided with a second wiring pattern connected with the first wiring pattern; housing members mounted with the second board for holding the contact portion of the probe. Next configuration features in including: two kinds of probes; measurement probes and connection probes anew, and a plurality of connection probes include buckling portions to buckle, upon a contact by an end of contact portion onto the wiring pattern provided with the first board when inserted into holes provided with the a second board; wherein through holes provided with the second board are positioned to align to the arrangement of wiring pattern provided with the first board. Thereby, undesirable deviation of contact point by the probe is avoided and a suitable contact pressure is preferably kept, and further convenience in the work of exchanging damaged probes is brought about.
    • 第一组装构造的特征在于包括:多个探针,其在接触部分的端部接触到半导体集成电路的电极上时具有弯曲部分以弯曲; 第一板,其设置有与所述探针的连接部分连接的第一布线图案; 第二板,其与所述第一板可移除地紧固并设置有与所述第一布线图形连接的第二布线图案; 安装有第二板的壳体构件用于保持探针的接触部分。 下一个配置功能包括:两种探头; 重新测量探针和连接探针,并且当插入设置有第二板的孔中时,接触部分的端部与设置有第一板的布线图案接触时,多个连接探针包括弯曲部分以弯曲; 其中设置有第二板的通孔被定位成与设置有第一板的布线图案的布置对准。 因此,避免了由探针引起的接触点的不期望的偏差,并且优选地保持适当的接触压力,并且进一步方便了更换损坏的探针的工作。