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1. 发明授权

US06558227B1 Method for polishing a work and an apparatus for polishing a work 失效
标题翻译：抛光工件的方法和抛光工件的装置
公开(公告)号：US06558227B1
公开(公告)日：2003-05-06
申请号：US09869146
申请日：2001-06-26
申请人： Masao Kodaira , Mikio Nakamura , Takahiro Kida
发明人： Masao Kodaira , Mikio Nakamura , Takahiro Kida
IPC分类号： B24B100
CPC分类号： B24B37/042 , B24B37/04
摘要： There is disclosed a method for polishing a work wherein polishing liquid is supplied to a polishing pad, and a relative movement is carried out between the work and the polishing pad with pressing the work on the polishing pad, wherein the work of which press pressure was set to 0 to terminate polishing is released from the polishing pad within 45 seconds after the termination of polishing. When plural works are simultaneously polished, preferably only the work to which press pressure was set to 0 to terminate polishing is released from the polishing pad, and polishing of the other works is continued, which are released from the polishing pad after press pressure thereto is set 0 one by one. In the resultant work, corrosion on the surface of the work due to the polishing liquid can be suppressed, an amount of the cleaning liquid used in a cleaning process can be reduced, particles can be removed efficiently in a short time, almost no pits are formed on the surface after polishing, only few amounts of particles are adhered, and there is almost no deviation in the works.
摘要翻译：公开了一种抛光工件的方法，其中抛光液被供给到抛光垫，并且通过在抛光垫上按压工件在工件和抛光垫之间进行相对运动，其中压力为设置为0以终止抛光在抛光结束后45秒内从抛光垫释放。当多个工件同时抛光时，优选仅将压力设定为0的工件终止抛光从抛光垫释放，并且继续对其它工件进行抛光，这些工件在压制压力之后从抛光垫释放逐个设置0。在所得到的工作中，可以抑制由于抛光液引起的工件表面的腐蚀，可以减少清洗过程中使用的清洗液的量，能够在短时间内有效地除去颗粒，几乎没有凹坑在抛光后在表面形成，只有少量的颗粒被粘附，并且在工程中几乎没有偏差。

2. 发明授权

US4388140A Apparatus for wet treatment of wafer materials 失效
标题翻译：用于湿处理晶片材料的设备
公开(公告)号：US4388140A
公开(公告)日：1983-06-14
申请号：US279314
申请日：1981-07-01
申请人： Yasuaki Nakazato , Yasushi Miyazaki , Makoto Osuga , Masao Kodaira
发明人： Yasuaki Nakazato , Yasushi Miyazaki , Makoto Osuga , Masao Kodaira
IPC分类号： C23F1/08 , H01L21/00 , H01L21/306 , B44C1/22 , C03C15/00 , C03C25/06
CPC分类号： H01L21/67086 , H01L21/67075
摘要： The invention provides a novel apparatus for the wet treatment, e.g. chemical etching treatment, of a plural number of wafer materials such as wafers of high purity silicon semiconductors. The apparatus comprises a liquid tub for containing the treatment liquid, e.g. etching solution, a pair of screw shafts horizontally held in the liquid tub in parallel with each other to be rotatable in the same direction at the same velocity to serve as a kind of screw conveyor and a traveling drum carriage mounted on the screw shafts as engaged with the threads of the shafts at the circular end plates so as to be rotated and transferred in the treatment liquid simultaneously as the screw shafts rotate. The traveling drum carriage holds a wafer basket containing a plural number of the wafer materials perpendicularly to the axis so that the wafer materials are also rotated together with the rotation of the carriage and the surfaces of them are always in contact with the treatment liquid during traveling from one end of the screw shafts to the other.
摘要翻译：本发明提供了用于湿处理的新颖设备，例如，化学蚀刻处理，多个晶片材料，例如高纯度硅半导体的晶片。该装置包括用于容纳处理液体的液体桶。水平地保持在液槽中的一对螺杆轴彼此平行地以相同的速度在相同的方向上旋转，以用作一种螺旋输送机和安装在螺杆轴上的行进滚筒架，作为啮合轴的螺纹在圆形端板处，以便当螺杆轴旋转时同时旋转并转移到处理液中。移动滚筒架保持包含垂直于轴线的多个晶片材料的晶片篮，使得晶片材料也随着滑架的旋转而一起旋转，并且它们的表面在行进期间总是与处理液体接触从螺杆轴的一端到另一端。

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