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    • 1. 发明申请
    • LIGHTING DEVICE AND SEMICONDUCTOR LIGHT SOURCE DEVICE
    • 照明设备和半导体光源设备
    • US20090302343A1
    • 2009-12-10
    • US12481537
    • 2009-06-09
    • Masanori SATOTakashi Ebisutani
    • Masanori SATOTakashi Ebisutani
    • H01L33/00
    • F21V7/0016F21S41/141F21S41/143F21S41/147F21Y2115/10H05K1/0274
    • A small-sized lighting device can achieve wider light distribution patterns. The lighting device can include a semiconductor light emitting element configured to emit light from a first face and a second face thereof. A mounting substrate can be provided on which the semiconductor light emitting element is mounted. Light emitted from the second face can transmit through the mounting substrate, and a first optical system can be provided and configured to impart a first light distribution pattern to the light emitted from the first face of the semiconductor light emitting element. A second optical system can be provided and configured to impart a second light distribution pattern to light emitted from the second face of the semiconductor light emitting element.
    • 小型照明装置可以实现更宽的配光模式。 照明装置可以包括被配置为从第一面和第二面发光的半导体发光元件。 可以提供安装基板,其上安装有半导体发光元件。 从第二面发​​射的光可以透过安装基板,第一光学系统可以被设置和配置成赋予从半导体发光元件的第一面发射的光的第一配光图案。 第二光学系统可以被提供和配置为将第二配光图案赋予从半导体发光元件的第二面发射的光。
    • 2. 发明授权
    • Lighting device and semiconductor light source device
    • 照明装置和半导体光源装置
    • US08258527B2
    • 2012-09-04
    • US12481537
    • 2009-06-09
    • Masanori SatoTakashi Ebisutani
    • Masanori SatoTakashi Ebisutani
    • H01L33/00
    • F21V7/0016F21S41/141F21S41/143F21S41/147F21Y2115/10H05K1/0274
    • A small-sized lighting device can achieve wider light distribution patterns. The lighting device can include a semiconductor light emitting element configured to emit light from a first face and a second face thereof. A mounting substrate can be provided on which the semiconductor light emitting element is mounted. Light emitted from the second face can transmit through the mounting substrate, and a first optical system can be provided and configured to impart a first light distribution pattern to the light emitted from the first face of the semiconductor light emitting element. A second optical system can be provided and configured to impart a second light distribution pattern to light emitted from the second face of the semiconductor light emitting element.
    • 小型照明装置可以实现更宽的配光模式。 照明装置可以包括被配置为从第一面和第二面发光的半导体发光元件。 可以提供安装基板,其上安装有半导体发光元件。 从第二面发​​射的光可以透过安装基板,第一光学系统可以被设置和配置成赋予从半导体发光元件的第一面发射的光的第一配光图案。 第二光学系统可以被提供和配置为将第二配光图案赋予从半导体发光元件的第二面发射的光。
    • 4. 发明授权
    • Semiconductor light emitting apparatus
    • 半导体发光装置
    • US07859001B2
    • 2010-12-28
    • US12187570
    • 2008-08-07
    • Wakako NiinoMasami KumeiToshimi KamikawaTakashi Ebisutani
    • Wakako NiinoMasami KumeiToshimi KamikawaTakashi Ebisutani
    • H01L33/00
    • H01L33/54H01L33/508H01L33/60H01L2224/48091H01L2224/48247Y10S257/918H01L2924/00014
    • A semiconductor light emitting apparatus can include a housing filled with a wavelength conversion material-containing resin material which seals a semiconductor light emitting device inside the recess of the housing. A transparent resin material can be charged on the wavelength conversion material-containing resin material, and can be configured to prevent the resin materials from being detached from each other or from other portions, such as a housing. Furthermore, such a semiconductor light emitting apparatus can emit light with less color unevenness. The housing can include a first recessed portion and a second recessed portion. The second recessed portion can have a larger diameter than the first recessed portion so as to form a stepped area at the boundary therebetween. The first recessed portion is filled with the wavelength conversion material-containing resin material as a first resin. The first resin extends along from an inner surface of the first recessed portion up to an inner surface of the second recessed portion to cover the inner surface of the second recessed portion. Accordingly, the first resin is recessed at its center area toward the semiconductor light emitting device to form a curved upper surface, and the second resin on the first resin is not in contact with the housing.
    • 半导体发光装置可以包括填充有包含波长转换材料的树脂材料的壳体,该树脂材料在壳体的凹部内密封半导体发光器件。 可以在含波长转换材料的树脂材料上填充透明树脂材料,并且可以构造为防止树脂材料彼此分离或者与壳体等其它部分分离。 此外,这种半导体发光装置可以发出较少颜色不均匀的光。 壳体可以包括第一凹部和第二凹部。 第二凹部可以具有比第一凹部更大的直径,以便在它们之间的边界处形成台阶区域。 第一凹部填充有含波长转换材料的树脂材料作为第一树脂。 第一树脂从第一凹部的内表面延伸到第二凹部的内表面,以覆盖第二凹部的内表面。 因此,第一树脂在其中心区域朝向半导体发光器件凹陷以形成弯曲的上表面,并且第一树脂上的第二树脂不与壳体接触。
    • 6. 发明申请
    • SEMICONDUCTOR LIGHT EMITTING APPARATUS
    • 半导体发光装置
    • US20100084675A1
    • 2010-04-08
    • US12573397
    • 2009-10-05
    • Kazuhiko UenoTakashi Ebisutani
    • Kazuhiko UenoTakashi Ebisutani
    • H01L33/00
    • H01L33/508H01L33/145H01L33/20H01L33/38H01L2224/48091H01L2224/8592H01L2924/3025H01L2933/0016H01L2924/00014H01L2924/00
    • A semiconductor light emitting apparatus for emitting a desired colored light by coating the top surface thereof with a wavelength conversion member prevents the color unevenness from occurring due to the unevenness of the coating thickness of the wavelength conversion member. The semiconductor light emitting apparatus can include a semiconductor layer having a light emitting layer with a light emitting surface having at least one corner area, a supporting substrate configured to support the semiconductor layer, and a wavelength conversion material layer formed on top of the semiconductor layer, the wavelength conversion layer having a thickness thinner from a center portion of the semiconductor layer to an outer peripheral portion. The at least one corner area can include a non-emitting portion where light cannot be projected. The non-emitting portion can be a light shielding portion, a non-light emission portion or a current confined portion.
    • 通过用波长转换构件涂覆其顶表面来发射所需的着色光的半导体发光装置防止由于波长转换构件的涂层厚度的不均匀性而发生颜色不均匀。 半导体发光装置可以包括具有发光层的发光层的半导体层,具有至少一个拐角区域的发光表面,被配置为支撑半导体层的支撑衬底和形成在半导体层的顶部上的波长转换材料层 ,所述波长转换层的厚度从所述半导体层的中心部分到外周部分的厚度较薄。 至少一个角区域可以包括不能投射光的不发射部分。 非发光部分可以是遮光部分,非发光部分或电流限制部分。
    • 7. 发明授权
    • Semiconductor light emitting device having first and second resins
    • 具有第一和第二树脂的半导体发光器件
    • US07605405B2
    • 2009-10-20
    • US11076138
    • 2005-03-10
    • Mitsunori HaradaKazuhiko UenoTakashi EbisutaniMasao AoyamaKaori Tachibana
    • Mitsunori HaradaKazuhiko UenoTakashi EbisutaniMasao AoyamaKaori Tachibana
    • H01L33/00
    • H01L33/44H01L33/507H01L33/56H01L2933/0041
    • A semiconductor light emitting device and method of manufacturing the same can provide a light source that has less variation in color and brightness and can reduce radiation of light that is possibly harmful to humans. The device can include a casing that has a first cavity having an oblique surface with a reflective surface formed thereon and a second cavity having an almost vertical side. A reflective frame having an oblique surface with a third reflective surface formed thereon can be formed on the casing. A semiconductor light emitting element can be mounted on the bottom in the first cavity. A first resin composed of a light-transmissive resin can be filled in the first cavity and then cured. Further, a second resin containing a fluorescent material dispersed in a light-transmissive resin can be filled in the second cavity and then cured while the casing is turned upside down to form a high-density fluorescent material layer near the surface of the second resin.
    • 半导体发光器件及其制造方法可以提供颜色和亮度变化较小的光源,并且可以减少可能对人类有害的光的辐射。 该装置可以包括具有第一空腔的壳体,该第一空腔具有形成在其上的反射表面的倾斜表面和具有几乎垂直侧的第二腔。 可以在壳体上形成具有其上形成有第三反射表面的倾斜表面的反射框架。 半导体发光元件可以安装在第一腔中的底部上。 由透光性树脂构成的第一树脂可以填充到第一空腔中,然后固化。 此外,包含分散在透光树脂中的荧光材料的第二树脂可以填充在第二空腔中,然后在壳体翻转的同时固化,以在第二树脂的表面附近形成高密度荧光材料层。
    • 9. 发明申请
    • SEMICONDUCTOR LIGHT EMITTING APPARATUS
    • 半导体发光装置
    • US20090039369A1
    • 2009-02-12
    • US12187570
    • 2008-08-07
    • Wakako NiinoMasami KumeiToshimi KamikawaTakashi Ebisutani
    • Wakako NiinoMasami KumeiToshimi KamikawaTakashi Ebisutani
    • H01L33/00
    • H01L33/54H01L33/508H01L33/60H01L2224/48091H01L2224/48247Y10S257/918H01L2924/00014
    • A semiconductor light emitting apparatus can include a housing filled with a wavelength conversion material-containing resin material which seals a semiconductor light emitting device inside the recess of the housing. A transparent resin material can be charged on the wavelength conversion material-containing resin material, and can be configured to prevent the resin materials from being detached from each other or from other portions, such as a housing. Furthermore, such a semiconductor light emitting apparatus can emit light with less color unevenness. The housing can include a first recessed portion and a second recessed portion. The second recessed portion can have a larger diameter than the first recessed portion so as to form a stepped area at the boundary therebetween. The first recessed portion is filled with the wavelength conversion material-containing resin material as a first resin. The first resin extends along from an inner surface of the first recessed portion up to an inner surface of the second recessed portion to cover the inner surface of the second recessed portion. Accordingly, the first resin is recessed at its center area toward the semiconductor light emitting device to form a curved upper surface, and the second resin on the first resin is not in contact with the housing.
    • 半导体发光装置可以包括填充有包含波长转换材料的树脂材料的壳体,该树脂材料在壳体的凹部内密封半导体发光器件。 可以在含波长转换材料的树脂材料上填充透明树脂材料,并且可以构造为防止树脂材料彼此分离或者与壳体等其它部分分离。 此外,这种半导体发光装置可以发出较少颜色不均匀的光。 壳体可以包括第一凹部和第二凹部。 第二凹部可以具有比第一凹部更大的直径,以便在它们之间的边界处形成台阶区域。 第一凹部填充有含波长转换材料的树脂材料作为第一树脂。 第一树脂从第一凹部的内表面延伸到第二凹部的内表面,以覆盖第二凹部的内表面。 因此,第一树脂在其中心区域朝向半导体发光器件凹陷以形成弯曲的上表面,并且第一树脂上的第二树脂不与壳体接触。