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1. 发明授权

US07859001B2 Semiconductor light emitting apparatus 有权
标题翻译：半导体发光装置
公开(公告)号：US07859001B2
公开(公告)日：2010-12-28
申请号：US12187570
申请日：2008-08-07
申请人： Wakako Niino , Masami Kumei , Toshimi Kamikawa , Takashi Ebisutani
发明人： Wakako Niino , Masami Kumei , Toshimi Kamikawa , Takashi Ebisutani
IPC分类号： H01L33/00
CPC分类号： H01L33/54 , H01L33/508 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , Y10S257/918 , H01L2924/00014
摘要： A semiconductor light emitting apparatus can include a housing filled with a wavelength conversion material-containing resin material which seals a semiconductor light emitting device inside the recess of the housing. A transparent resin material can be charged on the wavelength conversion material-containing resin material, and can be configured to prevent the resin materials from being detached from each other or from other portions, such as a housing. Furthermore, such a semiconductor light emitting apparatus can emit light with less color unevenness. The housing can include a first recessed portion and a second recessed portion. The second recessed portion can have a larger diameter than the first recessed portion so as to form a stepped area at the boundary therebetween. The first recessed portion is filled with the wavelength conversion material-containing resin material as a first resin. The first resin extends along from an inner surface of the first recessed portion up to an inner surface of the second recessed portion to cover the inner surface of the second recessed portion. Accordingly, the first resin is recessed at its center area toward the semiconductor light emitting device to form a curved upper surface, and the second resin on the first resin is not in contact with the housing.
摘要翻译：半导体发光装置可以包括填充有包含波长转换材料的树脂材料的壳体，该树脂材料在壳体的凹部内密封半导体发光器件。可以在含波长转换材料的树脂材料上填充透明树脂材料，并且可以构造为防止树脂材料彼此分离或者与壳体等其它部分分离。此外，这种半导体发光装置可以发出较少颜色不均匀的光。壳体可以包括第一凹部和第二凹部。第二凹部可以具有比第一凹部更大的直径，以便在它们之间的边界处形成台阶区域。第一凹部填充有含波长转换材料的树脂材料作为第一树脂。第一树脂从第一凹部的内表面延伸到第二凹部的内表面，以覆盖第二凹部的内表面。因此，第一树脂在其中心区域朝向半导体发光器件凹陷以形成弯曲的上表面，并且第一树脂上的第二树脂不与壳体接触。

2. 发明申请

US20090039369A1 SEMICONDUCTOR LIGHT EMITTING APPARATUS 有权
标题翻译：半导体发光装置
公开(公告)号：US20090039369A1
公开(公告)日：2009-02-12
申请号：US12187570
申请日：2008-08-07
申请人： Wakako Niino , Masami Kumei , Toshimi Kamikawa , Takashi Ebisutani
发明人： Wakako Niino , Masami Kumei , Toshimi Kamikawa , Takashi Ebisutani
IPC分类号： H01L33/00
CPC分类号： H01L33/54 , H01L33/508 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , Y10S257/918 , H01L2924/00014
摘要： A semiconductor light emitting apparatus can include a housing filled with a wavelength conversion material-containing resin material which seals a semiconductor light emitting device inside the recess of the housing. A transparent resin material can be charged on the wavelength conversion material-containing resin material, and can be configured to prevent the resin materials from being detached from each other or from other portions, such as a housing. Furthermore, such a semiconductor light emitting apparatus can emit light with less color unevenness. The housing can include a first recessed portion and a second recessed portion. The second recessed portion can have a larger diameter than the first recessed portion so as to form a stepped area at the boundary therebetween. The first recessed portion is filled with the wavelength conversion material-containing resin material as a first resin. The first resin extends along from an inner surface of the first recessed portion up to an inner surface of the second recessed portion to cover the inner surface of the second recessed portion. Accordingly, the first resin is recessed at its center area toward the semiconductor light emitting device to form a curved upper surface, and the second resin on the first resin is not in contact with the housing.
摘要翻译：半导体发光装置可以包括填充有包含波长转换材料的树脂材料的壳体，该树脂材料在壳体的凹部内密封半导体发光器件。可以在含波长转换材料的树脂材料上填充透明树脂材料，并且可以构造为防止树脂材料彼此分离或者与壳体等其它部分分离。此外，这种半导体发光装置可以发出较少颜色不均匀的光。壳体可以包括第一凹部和第二凹部。第二凹部可以具有比第一凹部更大的直径，以便在它们之间的边界处形成台阶区域。第一凹部填充有含波长转换材料的树脂材料作为第一树脂。第一树脂从第一凹部的内表面延伸到第二凹部的内表面，以覆盖第二凹部的内表面。因此，第一树脂在其中心区域朝向半导体发光器件凹陷以形成弯曲的上表面，并且第一树脂上的第二树脂不与壳体接触。

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