会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Cleaning apparatus having a contact buffer apparatus
    • 具有接触缓冲装置的清洗装置
    • US4935981A
    • 1990-06-26
    • US294196
    • 1989-01-06
    • Masami OhtaniMasami Nishida
    • Masami OhtaniMasami Nishida
    • H01L39/24B01J19/12C23C14/34C30B29/22H01B13/00H01L21/00H01L21/203H01L21/683
    • H01L21/67046H01L21/6838
    • An improved swing type substrate cleaning apparatus comprises a substrate chuck for holding the substrate while rotating the same, a cleaning brush holding apparatus for holding a cleaning brush while rotating the same, a cleaning brush elevating apparatus for holding the cleaning brush holding apparatus in a manner enabling elevation and swing of the same, and a buffer apparatus for reducing the velocity at which the cleaning brush elevating apparatus lowers the cleaning brush holding apparatus when the cleaning brush is lowered to be in contact with the substrate. Since the velocity with which the cleaning brush is lowered is reduced to be lower than a prescribed value by means of the buffer apparatus, no significant shock is created when the cleaning brush is brought into contact with the substrate.
    • 一种改进的摆动式基板清洁装置,包括用于在旋转基板的同时保持基板的基板卡盘,用于在旋转清洁刷的同时保持清洁刷的清洁刷保持装置,用于以清洁刷保持装置保持的清洁刷升降装置 能够使其升降和摆动;以及缓冲装置,用于降低清洁刷升降装置降低清洁刷保持装置时的速度,当清洁刷降低以与基板接触时。 由于通过缓冲装置将清洁刷降低的速度降低到低于规定值,所以当清洁刷与基板接触时不会产生显着的冲击。
    • 2. 发明授权
    • Wafer transfer apparatus having an improved wafer transfer portion
    • 具有改进的晶片转印部分的晶片传送装置
    • US4923054A
    • 1990-05-08
    • US275525
    • 1988-11-22
    • Masami OhtaniMasami Nishida
    • Masami OhtaniMasami Nishida
    • B65G1/02B65G1/00B65G1/07B65G47/91B65H1/28B65H3/00B65H31/24H01L21/00H01L21/677H01L21/687
    • H01L21/67778H01L21/67775H01L21/68707Y10S414/137Y10S414/141
    • An apparatus for storing and transferring a wafer. The apparatus includes a wafer transfer portion having a path through which a wafer can be transferred; structure for storing the wafer, the structure for storing the wafer being removably attached to the wafer transfer portion; a first elevator for elevating and lowering the wafer transfer portion and the storing structure to a predetermined level; a holder for temporarily holding the wafer in the wafer transfer portion; and a second elevator for elevating and lowering the wafer holder, the second elevator being separate and independent from the first elevator. Since the wafer storing structure and the wafer transfer portion are elevated and lowered by different elevators, the wafer can be transported while the wafer transfer portion is stationary. Thus, the apparatus has a simplified construction and replacement of the storing structure can be automated.
    • 一种用于存储和转移晶片的装置。 该装置包括具有可以转移晶片的路径的晶片传送部分; 用于存储晶片的结构,用于存储晶片的结构,其可移除地附接到晶片传送部分; 第一电梯,用于将所述晶片转印部分和所述存储结构升高和降低到预定水平; 用于将晶片临时保持在晶片转移部分中的保持器; 以及用于升降所述晶片保持器的第二电梯,所述第二电梯与所述第一电梯分离并独立。 由于晶片存储结构和晶片传送部分被不同的电梯升高和降低,所以晶片可以在晶片传送部分静止的同时传输。 因此,该装置具有简化的结构,可以自动地更换存储结构。
    • 3. 发明申请
    • SUBSTRATE PROCESSING APPARATUS INCLUDING A SUBSTRATE REVERSING REGION
    • 基板加工装置,包括反向区域的基板
    • US20080196658A1
    • 2008-08-21
    • US12031674
    • 2008-02-14
    • Yoshiteru FukutomiMasami Ohtani
    • Yoshiteru FukutomiMasami Ohtani
    • B05C11/00B08B13/00
    • G11B23/0021G03F7/70525G03F7/70533G03F7/70916G03F7/70925H01L21/67051H01L21/67173H01L21/67178H01L21/68728H01L21/68764
    • A substrate processing apparatus that is arranged adjacent to an exposure device includes a processing section including a first processing unit and a second processing unit. The first processing unit includes a development region, a first cleaning region, and a first transport region. The development region and the first cleaning region are arranged opposite to each other with the first transport region interposed therebetween. The second processing unit includes a reversing region, a second cleaning region, and a second transport region. The reversing region and the second cleaning region are arranged opposite to each other with the second transport region interposed therebetween. The second processing unit is arranged between the first processing unit and the exposure device. The substrate processing apparatus also includes a transfer section coupled to the processing section and an interface configured to receive and transfer the substrate between the processing section and the exposure device.
    • 布置在曝光装置附近的基板处理装置包括具有第一处理单元和第二处理单元的处理部。 第一处理单元包括显影区域,第一清洁区域和第一输送区域。 显影区域和第一清洁区域彼此相对设置,其间插入有第一输送区域。 第二处理单元包括反转区域,第二清洁区域和第二输送区域。 反转区域和第二清洁区域彼此相对布置,其间插入第二输送区域。 第二处理单元布置在第一处理单元和曝光装置之间。 基板处理装置还包括耦合到处理部分的传送部分和被配置为在处理部分和曝光装置之间接收和传送基板的接口。
    • 5. 发明授权
    • Method and apparatus for the development of films in a photographic film
processor
    • 用于在摄影胶片处理器中发展胶片的方法和装置
    • US4312586A
    • 1982-01-26
    • US155089
    • 1980-06-02
    • Masami Ohtani
    • Masami Ohtani
    • G03D3/06G03D3/13
    • G03D3/06G03D3/132Y10T137/85954Y10T137/86196
    • This invention is concerned with a method and apparatus for the development of photographic films in a photographic film processor in which the films are developed when the exposed films pass through a developing tank containing developer. The object of said invention is to attain uniform development with a simple method, that is, to make the change of the activity of the developer during the development of the films to be treated very small from the leading end to the trailing end of the film. The said invention makes the influence of the momentarily changing activity of the developer in contact with the films as small as possible by compensating for the decrease of the activity due to the exhaustion of the developer by gradually increasing the immersion time of the films in the developer from the leading end toward the trailing end of the photographic films by gradually changing the relative level of the liquid surface when the films are fed into the developer.
    • 本发明涉及用于在照相胶片处理器中开发照相胶片的方法和装置,其中当曝光的胶片通过含有显影剂的显影槽时,显影胶片。 本发明的目的是通过简单的方法来实现均匀显影,即,使得待处理的膜的显影期间显影剂的活性从薄膜的前端到尾端变化很小 。 所述发明通过逐渐增加膜在显影剂中的浸渍时间来补偿由于显影剂耗尽而导致的活性降低,使得显影剂与膜接触的瞬时变化的影响尽可能小 通过在将膜馈送到显影剂中时逐渐改变液面的相对水平,从照相胶卷的前端到尾端。
    • 6. 发明授权
    • Vehicle air conditioning apparatus
    • 车用空调机
    • US4250956A
    • 1981-02-17
    • US075482
    • 1979-09-14
    • Masami Ohtani
    • Masami Ohtani
    • B60H1/00F24F11/02G05D23/24G05D23/00B60H3/04F25B29/00
    • B60H1/00828G05D23/1931G05D23/24
    • A temperature control door (27) controls air flow through a duct (12) and is positioned in accordance with the output of a sensor (41), (42). A slider (74) of a potentiometer (72) is connected to the door (27) so that the slider (74) is in a central position when the temperature control door (27) is in a central position. A switch (86) connects the slider (74) to one end of a resistance element (73) of the potentiometer (72) when the temperature control door (27) is on one side of the central position and the apparatus (11) is in a cooling mode and to the other end of the resistance element (73) of the potentiometer (72) when the temperature control door (27) is on the other side of the central position and the apparatus (11) is in a heating mode. The speed of a blower (16) which forces air through the duct (12) is controlled in accordance with the resistance of the potentiometer (72). A switch (87) controls the blower (16) to run a maximum speed when the apparatus (11) is in a maximum cooling mode.
    • 温度控制门(27)控制通过管道(12)的空气流并且根据传感器(41)的输出(42)定位。 电位器(72)的滑块(74)连接到门(27),使得当温度控制门(27)处于中心位置时,滑块(74)处于中心位置。 当温度控制门(27)位于中心位置的一侧时,开关(86)将滑块(74)连接到电位器(72)的电阻元件(73)的一端,并且设备(11)是 在温度控制门(27)处于中心位置的另一侧并且装置(11)处于加热模式时,处于冷却模式和电位计(72)的电阻元件(73)的另一端 。 根据电位器(72)的阻力来控制迫使空气通过管道(12)的鼓风机(16)的速度。 当设备(11)处于最大冷却模式时,开关(87)控制鼓风机(16)运行最大速度。
    • 9. 发明授权
    • Substrate processing apparatus, substrate inspection method and substrate processing system
    • 基板加工装置,基板检查方法及基板处理系统
    • US06790287B2
    • 2004-09-14
    • US09942153
    • 2001-08-29
    • Masayoshi ShigaKenji HashinokiMasami OhtaniJoichi Nishimura
    • Masayoshi ShigaKenji HashinokiMasami OhtaniJoichi Nishimura
    • C23C1600
    • H01L21/67207H01L21/67253
    • An inspection unit is provided in a substrate processing apparatus performing resist coating processing and development processing on a substrate. In the inspection unit, a film thickness measuring device, a line width measuring device, an overlay measuring device and a macro defect inspection device are successively stacked and arranged from below. The inspection unit is provided on an intermediate portion of a substrate transport path formed in the substrate processing apparatus. The substrate processed in the substrate processing apparatus is selectively introduced into each inspection part. Therefore, the apparatus can properly inspect the substrate at need while suppressing reduction of the throughput. Thus provided are a substrate processing apparatus and a substrate inspection method capable of properly inspecting a substrate while suppressing reduction of the throughput.
    • 在基板上进行抗蚀剂涂布处理和显影处理的基板处理装置中设置有检查单元。 在检查单元中,从下方依次堆叠并布置膜厚测量装置,线宽测量装置,覆盖测量装置和宏观缺陷检查装置。 检查单元设置在形成在基板处理装置中的基板输送路径的中间部。 将在基板处理装置中处理的基板选择性地导入各检查部。 因此,能够在抑制生产量的降低的同时适当地检查需要的基板。 这样提供了能够在抑制生产量降低的同时适当地检查基板的基板处理装置和基板检查方法。