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    • 1. 发明授权
    • System and method of load balancing for ethernet link aggregation
    • 以太网链路聚合的负载均衡的系统和方法
    • US09237091B2
    • 2016-01-12
    • US13529371
    • 2012-06-21
    • Masakazu SatoSatoshi NakajimaKazunari Suzuki
    • Masakazu SatoSatoshi NakajimaKazunari Suzuki
    • H04L12/931H04L12/709H04L29/12H04W84/18H04L12/413H04L12/741H04L29/06
    • H04L45/245H04L12/413H04L45/745H04L49/351H04L61/2092H04L69/22H04W84/18Y02D50/30
    • A system and method of transmitting data across a first link aggregation formed by an intermediate switch and a downstream switch, the intermediate switch adopting a Media-Access Card (MAC)-address-based load sharing algorithm for distributing traffic among links to the downstream switch interfaced with a final destination device. The method comprises: receiving a packet having a MAC header and an IP header at an input port of an upstream switch for transmission from the upstream switch to the intermediate switch, the upstream switch and intermediate switch forming a second link aggregation; re-writing, at the upstream switch, the source MAC address of the received packet to a different source address; sending the packet through the second link aggregation to the intermediate switch, the intermediate switch implementing the load sharing algorithm for sending the packet to the downstream switch along a link through the first link aggregation to the destination device.
    • 一种通过中间交换机和下游交换机形成的第一链路聚合发送数据的系统和方法,所述中间交换机采用基于媒体接入卡(MAC)地址的负载分担算法,用于在下游交换机的链路之间分配业务 与最终目的地设备连接。 该方法包括:在上游交换机的输入端口接收具有MAC报头和IP报头的分组,从上游交换机向中间交换机发送,上游交换机和中间交换机形成第二链路聚合; 在上游交换机上重新写入接收到的数据包的源MAC地址到不同的源地址; 将所述分组通过所述第二链路聚合发送到所述中间交换机,所述中间交换机实现负载分担算法,用于通过所述第一链路聚合向所述目的设备沿着链路向所述下游交换机发送所述分组。
    • 3. 发明授权
    • Ethernet link aggregation
    • 以太网链路聚合
    • US08274980B2
    • 2012-09-25
    • US12393727
    • 2009-02-26
    • Masakazu SatoSatoshi NakajimaKazunari Suzuki
    • Masakazu SatoSatoshi NakajimaKazunari Suzuki
    • H04L12/56
    • H04L45/245H04L12/413H04L45/745H04L49/351H04L61/2092H04L69/22H04W84/18Y02D50/30
    • A system and method of transmitting data across a link aggregation group, the method comprises: receiving a packet sourced from a client having a MAC header and an IP header at an input port of a first upstream switch for transmission from the first upstream switch along a link aggregation and at least two down stream switches to a server, said MAC header having a Destination MAC address and a Source MAC address, and the IP header having a Source IP address and a Destination IP address; changing the destination MAC address from a down stream destination to another down stream destination; sending the packet through a first link aggregation to a first down stream switch; using a hash calculation for changing the Source MAC address of the packet in the first down stream switch to a new address; sending the packet through a second link aggregation to a second down stream switch having an address; and sending the packet from the second down stream switch to a server having a server address.
    • 一种通过链路聚合组发送数据的系统和方法,所述方法包括:从第一上游交换机的输入端口接收来自具有MAC报头和IP报头的客户端的分组,以从第一上游交换机沿着 链路聚合和至少两个下行切换到服务器,所述MAC报头具有目的地MAC地址和源MAC地址,所述IP报头具有源IP地址和目的地IP地址; 将目的MAC地址从下行目的地改变到另一下行目的地; 通过第一链路聚合将分组发送到第一下行链路交换机; 使用哈希计算来将第一下行切换中的分组的源MAC地址改变为新的地址; 通过第二链路聚合将分组发送到具有地址的第二下行交换机; 并将分组从第二下行交换机发送到具有服务器地址的服务器。
    • 5. 发明申请
    • SLIDING ASSIST MECHANISM
    • 滑动辅助机构
    • US20110138579A1
    • 2011-06-16
    • US12737014
    • 2009-06-05
    • Masakazu Sato
    • Masakazu Sato
    • E05F1/16E05C1/08
    • E05F1/16E05F5/003E05Y2201/412E05Y2201/488E05Y2800/00E05Y2800/174E05Y2800/73Y10T16/37Y10T292/097
    • A sliding assist mechanism includes a case (1) attached to one of a main body (7) and a mobile body (A); a latch (4) movably disposed in the case and switched between a standby state in which the latch is locked in the case and a retracted state in which the locking is released; a biasing device (3) for biasing the latches in one direction; and an operation member (8) attached to the other of the main body (7) and the mobile body. When the latch (4) is switched.from the standby state to the retracted state, the sliding assist mechanism allows the mobile body to move from a first position to a second position on a main body side through the operation member (8) by biasing force accumulated in the biasing means (3). Essential parts of the mechanism include an engagement portion (42) at a normal time when the latches (4) engage the operation members (8) by interlocking the switching from the standby state to the retracted state, and an auxiliary engagement device (47) releasably engages the operation members (8) when the latch comes to the retracted state in a non-engaged state of the operation member relative to the engagement portion. A repairing structure can be further simplified by such sliding assist mechanism.
    • 滑动辅助机构包括安装在主体(7)和移动体(A)之一上的壳体(1)。 可移动地设置在壳体中并且在闩锁被锁定在壳体中的待机状态和其中释放锁定的缩回状态之间切换的闩锁(4) 偏置装置(3),用于沿一个方向偏置闩锁; 以及安装在主体(7)和移动体的另一个上的操作构件(8)。 当闩锁(4)从待机状态切换到缩回状态时,滑动辅助机构允许移动体通过操作构件(8)从主体侧的第一位置移动到第二位置 累积在偏压装置(3)中的力。 该机构的主要部件包括:当闩锁(4)通过将从待机状态的切换联动到缩回状态而啮合操作构件(8)时的正常时间处的接合部分(42)和辅助接合装置(47) 当闩锁在操作构件相对于接合部分的非接合状态中到达缩回状态时,可释放地接合操作构件(8)。 这种滑动辅助机构可以进一步简化修理结构。
    • 8. 发明申请
    • Semiconductor device having gate electrode connection to wiring layer
    • 具有栅电极连接到布线层的半导体器件
    • US20080203527A1
    • 2008-08-28
    • US12081960
    • 2008-04-24
    • Kazuhisa ItoiMasakazu SatoTatsuya Ito
    • Kazuhisa ItoiMasakazu SatoTatsuya Ito
    • H01L29/00
    • H01L28/10Y10T29/49117
    • A semiconductor device includes a semiconductor substrate having an electrode formed above a surface thereof; a first insulating resin layer that is provided over the semiconductor substrate and has a first opening defined at a position corresponding to the electrode; a first wiring layer that is provided on the first insulating resin layer and is connected to the electrode through the first opening; a second insulating resin layer provided over the first insulating resin layer and the first wiring layer, the second insulating resin layer having a second opening that is defined at a position different from the position of the first opening in a direction of the surface of the semiconductor substrate; and a second wiring layer that is provided on the second insulating resin layer and is connected to the first wiring layer through the second opening, wherein the second wiring layer includes an induction element, and a sum of a thickness of the first insulating resin layer and a thickness of the second insulating resin layer is not less than 5 μm and not more than 60 μm.
    • 半导体器件包括其表面上形成有电极的半导体衬底; 第一绝缘树脂层,设置在所述半导体衬底上并且具有限定在对应于所述电极的位置的第一开口; 第一布线层,设置在第一绝缘树脂层上,并通过第一开口连接到电极; 设置在所述第一绝缘树脂层和所述第一布线层上的第二绝缘树脂层,所述第二绝缘树脂层具有限定在与所述第一开口的位置不同的位置的第二开口,所述第二开口沿所述半导体的表面的方向 基质; 以及第二布线层,其设置在所述第二绝缘树脂层上并且通过所述第二开口连接到所述第一布线层,其中所述第二布线层包括感应元件,并且所述第一绝缘树脂层和 第二绝缘树脂层的厚度为5μm以上且60μm以下。
    • 10. 发明授权
    • Semiconductor pressure sensor and process for fabricating the same
    • 半导体压力传感器及其制造方法
    • US07284443B2
    • 2007-10-23
    • US10543493
    • 2004-01-29
    • Masakazu SatoTatsuya ItoHideto Noguchi
    • Masakazu SatoTatsuya ItoHideto Noguchi
    • G01L9/00
    • G01L9/0054G01L19/0069
    • This invention aims to realize reduction in size without impairing measurement accuracy or connection reliability in a semiconductor pressure sensor in which a glass substrate is adhered to a rear-surface side of a pressure-sensitive chip in which piezoresistive pressure-sensitive gauges have been formed on a front surface of a diaphragm formed of a silicon single crystal to form a space between a rear surface of the diaphragm and the glass substrate, for measuring a pressure applied to the front surface of the diaphragm with reference to a pressure of the first space as a standard pressure. In order to achieve this object, the semiconductor pressure sensor includes resinous projections formed on pressure-sensitive gauge electrodes disposed on a front surface of the pressure-sensitive chip or on wiring from the pressure-sensitive gauge electrodes and bumps formed so as to partially or entirely cover the resinous projections.
    • 本发明的目的是在不损害其中玻璃基板粘附在其上形成有压阻压力计的压敏片的背面侧的半导体压力传感器中实现尺寸的减小而不损害测量精度或连接可靠性 由硅单晶形成的隔膜的前表面,以在隔膜的后表面和玻璃基板之间形成空间,用于参照第一空间的压力测量施加到隔膜前表面的压力 标准压力。 为了实现该目的,半导体压力传感器包括形成在压敏表电极上的树脂突起,所述压敏电极设置在压敏芯片的前表面上,或者布置在压敏表电极和凸起上,凸起形成为局部或 完全覆盖树脂突起。