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1. 发明授权

US07615870B2 Semiconductor device, manufacturing method thereof, and connection method of circuit board 失效
标题翻译：半导体装置及其制造方法以及电路基板的连接方法
公开(公告)号：US07615870B2
公开(公告)日：2009-11-10
申请号：US11412977
申请日：2006-04-28
申请人： Masanori Shibamoto , Masahiro Yamaguchi , Naoya Kanda
发明人： Masanori Shibamoto , Masahiro Yamaguchi , Naoya Kanda
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L25/0657 , H01L24/97 , H01L25/50 , H01L2224/32225 , H01L2225/06517 , H01L2225/0652 , H01L2225/06572 , H01L2225/06579 , H01L2924/15311
摘要： Cut pieces of a flexible tape respectively having positioning holes are superposed on a substrate having positioning holes, while positioning the substrate and the cut pieces by inserting a positioning pin into the positioning holes respectively, so that one side of the substrate faces one side of the cut pieces. Subsequently, internal terminals provided on the substrate are ultrasonically joined with internal terminals provided on the cut pieces by pressing an ultrasonic tool from the other side of the cut pieces. As a result, connection between these can be performed highly accurately. Further, since the internal terminals are ultrasonically joined with each other, operation time does not increase in proportion to the number of terminals, as in the connection using a bonding wire, and misregistration due to heat does not occur. Accordingly, connections between circuit boards are performed efficiently, highly accurately, and reliably.
摘要翻译：分别具有定位孔的柔性带的切片重叠在具有定位孔的基板上，同时通过将定位销分别插入定位孔来定位基板和切割片，使得基板的一侧面向切片。随后，通过从切割片的另一侧按压超声波工具，将设置在基板上的内部端子与设置在切割件上的内部端子超声波接合。结果，可以高精度地进行这些连接。此外，由于内部端子彼此超声波接合，与使用接合线的连接中的端子数不成比例地增加操作时间，并且不会发生由于热引起的不对准。因此，能够高效，高精度，可靠地进行电路基板的连接。

2. 发明申请

US20080197509A1 Semiconductor package having stacked semiconductor chips 审中-公开
标题翻译：具有层叠半导体芯片的半导体封装
公开(公告)号：US20080197509A1
公开(公告)日：2008-08-21
申请号：US12068485
申请日：2008-02-07
申请人： Masahiro Yamaguchi , Masanori Shibamoto
发明人： Masahiro Yamaguchi , Masanori Shibamoto
IPC分类号： H01L23/49
CPC分类号： H01L25/0657 , H01L24/05 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L2224/04026 , H01L2224/04042 , H01L2224/05553 , H01L2224/05556 , H01L2224/32145 , H01L2224/32225 , H01L2224/48095 , H01L2224/48227 , H01L2224/48465 , H01L2224/49052 , H01L2224/4909 , H01L2224/49175 , H01L2224/49431 , H01L2224/49433 , H01L2224/73265 , H01L2224/83136 , H01L2224/83192 , H01L2224/8385 , H01L2224/8592 , H01L2224/92247 , H01L2225/0651 , H01L2225/06575 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/07802 , H01L2924/10162 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A semiconductor package including: a package substrate on the surface of which plural connection terminals are provided; a semiconductor chip on the surface of which plural bonding pads are provided; plural bonding wires that connect between the plural connection terminals and the plural bonding pads; a resin formed to fill a gap between the bonding wires and the surface of the semiconductor chip; and a semiconductor chip provided on the bonding wires via a film-shaped resin, wherein at least three of the plural bonding wires are formed at substantially the same heights and higher than other bonding wires.
摘要翻译：一种半导体封装，包括：在其表面上设置有多个连接端子的封装基板; 在其表面上设置有多个接合焊盘的半导体芯片; 连接在多个连接端子和多个接合焊盘之间的多个接合线; 形成为填充所述接合线与所述半导体芯片的表面之间的间隙的树脂; 以及通过膜状树脂设置在所述接合线上的半导体芯片，其中所述多个接合线中的至少三个形成在与其它接合线基本相同的高度上。

3. 发明申请

US20070273021A1 Semiconductor package 失效
标题翻译：半导体封装
公开(公告)号：US20070273021A1
公开(公告)日：2007-11-29
申请号：US11802888
申请日：2007-05-25
申请人： Fumiyuki Osanai , Atsushi Hiraishi , Toshio Sugano , Tsuyoshi Tomoyama , Satoshi Isa , Masahiro Yamaguchi , Masanori Shibamoto
发明人： Fumiyuki Osanai , Atsushi Hiraishi , Toshio Sugano , Tsuyoshi Tomoyama , Satoshi Isa , Masahiro Yamaguchi , Masanori Shibamoto
IPC分类号： H01L23/12
CPC分类号： H01L23/50 , H01L23/3128 , H01L23/49816 , H01L23/49838 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , H01L2924/19041 , H01L2924/3011 , H01L2924/00 , H01L2224/05599
摘要： A semiconductor package comprises a substrate, which has two surfaces and comprises first and second electrical paths. On one of the surfaces, a semiconductor chip is mounted. The semiconductor chip comprises a plurality of pads, which include a first pad to be supplied with a power supply and a second pad to be grounded. On the other surface, at least one bypass capacitor is mounted. The bypass capacitor comprises first and second terminals, which are connected to the first and the second pads through the first and the second electrical paths, respectively.
摘要翻译：半导体封装包括具有两个表面并且包括第一和第二电路径的衬底。在其中一个表面上安装了半导体芯片。半导体芯片包括多个焊盘，其包括要供应电源的第一焊盘和要接地的第二焊盘。在另一个表面上，安装至少一个旁路电容器。旁路电容器包括分别通过第一和第二电路连接到第一和第二焊盘的第一和第二端子。

4. 发明申请

US20060244121A1 Semiconductor device, manufacturing method thereof, and connection method of circuit board 失效
公开(公告)号：US20060244121A1
公开(公告)日：2006-11-02
申请号：US11412977
申请日：2006-04-28
申请人： Masanori Shibamoto , Masahiro Yamaguchi , Naoya Kanda
发明人： Masanori Shibamoto , Masahiro Yamaguchi , Naoya Kanda
IPC分类号： H01L23/48
CPC分类号： H01L25/0657 , H01L24/97 , H01L25/50 , H01L2224/32225 , H01L2225/06517 , H01L2225/0652 , H01L2225/06572 , H01L2225/06579 , H01L2924/15311
摘要： Cut pieces of a flexible tape respectively having positioning holes are superposed on a substrate having positioning holes, while positioning the substrate and the cut pieces by inserting a positioning pin into the positioning holes respectively, so that one side of the substrate faces one side of the cut pieces. Subsequently, internal terminals provided on the substrate are ultrasonically joined with internal terminals provided on the cut pieces by pressing an ultrasonic tool from the other side of the cut pieces. As a result, connection between these can be performed highly accurately. Further, since the internal terminals are ultrasonically joined with each other, operation time does not increase in proportion to the number of terminals, as in the connection using a bonding wire, and misregistration due to heat does not occur. Accordingly, connections between circuit boards are performed efficiently, highly accurately, and reliably.

5. 发明授权

US07667317B2 Semiconductor package with bypass capacitor 失效
标题翻译：带旁路电容器的半导体封装
公开(公告)号：US07667317B2
公开(公告)日：2010-02-23
申请号：US11802888
申请日：2007-05-25
申请人： Fumiyuki Osanai , Atsushi Hiraishi , Toshio Sugano , Tsuyoshi Tomoyama , Satoshi Isa , Masahiro Yamaguchi , Masanori Shibamoto
发明人： Fumiyuki Osanai , Atsushi Hiraishi , Toshio Sugano , Tsuyoshi Tomoyama , Satoshi Isa , Masahiro Yamaguchi , Masanori Shibamoto
IPC分类号： H01L23/055
CPC分类号： H01L23/50 , H01L23/3128 , H01L23/49816 , H01L23/49838 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , H01L2924/19041 , H01L2924/3011 , H01L2924/00 , H01L2224/05599
摘要： A semiconductor package comprises a substrate, which has two surfaces and comprises first and second electrical paths. On one of the surfaces, a semiconductor chip is mounted. The semiconductor chip comprises a plurality of pads, which include a first pad to be supplied with a power supply and a second pad to be grounded. On the other surface, at least one bypass capacitor is mounted. The bypass capacitor comprises first and second terminals, which are connected to the first and the second pads through the first and the second electrical paths, respectively.
摘要翻译：半导体封装包括具有两个表面并且包括第一和第二电路径的衬底。在其中一个表面上安装了半导体芯片。半导体芯片包括多个焊盘，其包括要供应电源的第一焊盘和要接地的第二焊盘。在另一个表面上，安装至少一个旁路电容器。旁路电容器包括分别通过第一和第二电路连接到第一和第二焊盘的第一和第二端子。

6. 发明授权

US08245648B2 Guided vehicle transportation system 有权
标题翻译：引导车辆运输系统
公开(公告)号：US08245648B2
公开(公告)日：2012-08-21
申请号：US12295530
申请日：2007-10-31
申请人： Shunji Morichika , Katsuaki Morita , Masahiro Yamaguchi , Kosuke Katahira , Yasuhiro Nagamichi
发明人： Shunji Morichika , Katsuaki Morita , Masahiro Yamaguchi , Kosuke Katahira , Yasuhiro Nagamichi
IPC分类号： B61F9/00
CPC分类号： B61B10/04
摘要： A guided vehicle transportation system is described in the application. The system includes guard wheels and a guard rail positioned along a center line of a guide track. The guard rail has a groove in which the guard wheels are received with a predetermined clearance between the periphery of the guard wheels and side walls of the groove. The guard rail has a flange extending toward the groove at the top of each side wall. The vehicle has first arms extending in longitudinal direction and being attached rotatably at a central part of an axle provided for suspending each pair of front wheels and rear wheels, and the guard wheels are attached rotatably and directly to the both end parts of the first arms or attached rotatably to both end parts of second arms each of which is attached to a corresponding end part of the first arms.
摘要翻译：在本申请中描述了导向车辆运输系统。该系统包括保护轮和沿导轨的中心线定位的护栏。护栏具有凹槽，其中保护轮在防护轮的周边和槽的侧壁之间以预定的间隙被接收。护栏具有在每个侧壁的顶部朝向凹槽延伸的凸缘。车辆具有沿纵向延伸的第一臂，并且可旋转地安装在设置用于悬挂每对前轮和后轮的轴的中心部分处，并且保护轮可旋转地并直接地附接到第一臂的两个端部或者可旋转地连接到第二臂的两个端部，每个第二臂附接到第一臂的对应的端部。

7. 发明申请

US20120049354A1 SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME 审中-公开
标题翻译：半导体器件及其形成方法
公开(公告)号：US20120049354A1
公开(公告)日：2012-03-01
申请号：US13219155
申请日：2011-08-26
申请人： Emi SAWAYAMA , Masahiro Yamaguchi
发明人： Emi SAWAYAMA , Masahiro Yamaguchi
IPC分类号： H01L23/498 , H01L23/48
CPC分类号： H01L21/561 , H01L21/568 , H01L21/6836 , H01L23/3135 , H01L23/49816 , H01L24/05 , H01L24/13 , H01L24/75 , H01L24/81 , H01L24/97 , H01L25/0657 , H01L25/18 , H01L25/50 , H01L2221/68327 , H01L2224/0332 , H01L2224/0401 , H01L2224/05017 , H01L2224/05023 , H01L2224/05025 , H01L2224/05147 , H01L2224/05564 , H01L2224/05611 , H01L2224/05655 , H01L2224/1132 , H01L2224/11849 , H01L2224/13018 , H01L2224/13025 , H01L2224/131 , H01L2224/13247 , H01L2224/13564 , H01L2224/13611 , H01L2224/13655 , H01L2224/16145 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/81193 , H01L2224/81205 , H01L2224/81385 , H01L2224/83192 , H01L2224/92125 , H01L2224/92143 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1431 , H01L2924/1434 , H01L2924/1436 , H01L2924/15311 , H01L2924/15313 , H01L2924/181 , H01L2924/3511 , H01L2224/81 , H01L2224/83 , H01L2924/01047 , H01L2924/00 , H01L2224/05552 , H01L2924/00012
摘要： A semiconductor device includes a wiring board, a first semiconductor chip disposed over the wiring board, a stack of second semiconductor chips disposed over the first semiconductor chip; and a first connection structure connecting the first semiconductor chip and the stack of second semiconductor chips. The first connection structure includes first and second connection electrodes disposed on the first semiconductor chip and a closest second semiconductor chip of the stack, respectively. The closest second semiconductor chip is closest to the first semiconductor chip. A bonding material bonds the first and second connection electrodes.
摘要翻译：半导体器件包括布线板，设置在布线板上的第一半导体芯片，布置在第一半导体芯片上的第二半导体芯片堆叠; 以及连接第一半导体芯片和第二半导体芯片堆叠的第一连接结构。第一连接结构包括分别设置在第一半导体芯片上的第一和第二连接电极和堆叠的最靠近的第二半导体芯片。最靠近的第二半导体芯片最靠近第一半导体芯片。接合材料结合第一和第二连接电极。

8. 发明授权

US07986125B2 Feeder-lineless traffic system and charging method therefor 有权
标题翻译：无馈线交通系统及其收费方式
公开(公告)号：US07986125B2
公开(公告)日：2011-07-26
申请号：US12225883
申请日：2008-02-20
申请人： Masaya Mitake , Katsuaki Morita , Masahiro Yamaguchi , Hiroshi Yamashita , Masaomi Yamada , Kousuke Katahira
发明人： Masaya Mitake , Katsuaki Morita , Masahiro Yamaguchi , Hiroshi Yamashita , Masaomi Yamada , Kousuke Katahira
IPC分类号： H02J7/00
CPC分类号： B60L5/42 , B60L9/00 , B60L11/1816 , B60L11/1824 , B60L11/1837 , B60L11/185 , B60L2200/26 , B60L2230/30 , B60M1/36 , Y02T10/7005 , Y02T10/7088 , Y02T90/121 , Y02T90/128 , Y02T90/14
摘要： Provided is a railway type feeder-lineless traffic system in which the weight of a vehicle is reduced while the structure of the vehicle is simplified, and it is possible to carry out a quick charge during a brief stopping time at a station or the like. A charging method in a feeder-lineless traffic system in which a vehicle mounted thereon with an electric storage unit runs on a predetermined pathway with the use of a power, and the electric storage unit in the vehicle is charged from a charger set up on the pathway, wherein a contact charging way in which a power feeder 24 connected to the charger 21 set up on the ground is made into contact with a power receiver 6 mounted on a vehicle 1 is carried out when the vehicle 1 comes to a stop, and a commercial electric power is converted by the charger and a charge control unit of the charger into a DC power which is chargeable direct into the electric storage unit 1, and the DC power is quickly charged into the electric storage unit through the intermediary of the power feeder and the power receiver while a current value of the DC power is controlled.
摘要翻译：提供了一种在车辆的结构简化的同时减轻车辆重量的铁路式无馈线交通系统，并且可以在车站等的短暂停止时间期间进行快速充电。一种无馈线交通系统中的充电方法，其中安装有蓄电单元的车辆通过使用电力在预定路径上行驶，并且车辆中的蓄电单元从设置在车辆上的充电器充电路径，其中，当车辆1停止时，执行其中连接到设置在地面上的充电器21的馈电器24与安装在车辆1上的电力接收器6接触的接触充电方式，商用电力由充电器和充电器的充电控制单元转换成可直接充电到蓄电单元1中的直流电力，并且直流电力通过电力中继被快速充电到蓄电单元馈电器和电源接收器，同时控制直流电源的当前值。

9. 发明申请

US20100052133A1 STACK TYPE SEMICONDUCTOR DEVICE WITH REINFORCING RESIN 审中-公开
标题翻译：具有增强树脂的堆叠型半导体器件
公开(公告)号：US20100052133A1
公开(公告)日：2010-03-04
申请号：US12496066
申请日：2009-07-01
申请人： Hisashi TANIE , Hiroshi Moriya , Masahiro Yamaguchi , Emi Sawayama
发明人： Hisashi TANIE , Hiroshi Moriya , Masahiro Yamaguchi , Emi Sawayama
IPC分类号： H01L23/52 , H01L21/50 , H01L21/607
CPC分类号： H01L24/86 , H01L23/5385 , H01L23/5387 , H01L24/29 , H01L24/50 , H01L25/0657 , H01L25/50 , H01L2224/13144 , H01L2225/06572 , H01L2225/06579 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/30105 , H01L2924/3512 , H01L2924/00 , H01L2224/48 , H01L2224/0401
摘要： A semiconductor device includes a plurality of semiconductor packages each with a semiconductor element and a flexible board. The flexible board is wider than the semiconductor element and is electrically connected to the semiconductor element. The plurality of semiconductor packages are stacked on one surface of a mother board. The semiconductor element is positioned between the flexible boards of the semiconductor packages in adjacent layers. The flexible boards in the adjacent layers are joined together at junction portions positioned at a part of the flexible boards which sticks out from an area in which the semiconductor elements and the flexible boards overlap. A reinforcing resin is provided in at least a part of the area between the flexible boards in the adjacent layers and between the junction portion of the flexible boards and the corresponding semiconductor element. The reinforcing resin contacts at least a part of the adjacent flexible board.
摘要翻译：半导体器件包括多个半导体封装，每个半导体封装均具有半导体元件和柔性板。柔性板比半导体元件宽，并与半导体元件电连接。多个半导体封装堆叠在母板的一个表面上。半导体元件位于相邻层中的半导体封装的柔性板之间。相邻层中的柔性板在位于柔性板的从半导体元件和柔性板重叠的区域伸出的部分的接合部处接合在一起。在相邻层中的柔性板之间的区域的至少一部分之间以及柔性板的接合部分和相应的半导体元件之间设置增强树脂。增强树脂与相邻柔性板的至少一部分接触。

10. 发明申请

US20090301342A1 GUIDED VEHICLE TRANSPORTATION SYSTEM 有权
标题翻译：指导车辆运输系统
公开(公告)号：US20090301342A1
公开(公告)日：2009-12-10
申请号：US12295530
申请日：2007-10-31
申请人： Shunji Morichika , Katsuaki Morita , Masahiro Yamaguchi , Kosuke Katahira , Yasuhiro Nagamichi
发明人： Shunji Morichika , Katsuaki Morita , Masahiro Yamaguchi , Kosuke Katahira , Yasuhiro Nagamichi
IPC分类号： B61F9/00 , B61F5/50 , E01B5/18
CPC分类号： B61B10/04
摘要： A guided vehicle transportation system is provided with which toppling down of the vehicle is prevented even when strong lateral external force exerts on the vehicle. The fail-safe mechanism of the system is composed such that a guard rail 31 having a flange 34 extending horizontally at the upper part of each of its vertical guide surfaces for guiding guard wheels 22, 23 provided to the vehicle is laid down on a guide track 3 (depression 10) along the center lone thereof, the vehicle is provided with automatic steering mechanisms 09 and actuators 06 for steering front and rear traveling wheels, and said guard wheels are provided to the vehicle rotatable in a lateral plane and received in the groove of the guard rail 31. A subsidiary guard wheel 33, which is smaller in diameter than that of the guard wheel 22(23), is provided thereon to be rotatable together with the guard wheel 22(23). When the vehicle is moved laterally by strong lateral external force due to a gust of cross wind, the subsidiary guard wheel 33 comes under the flange 34 of the guard rail 31 and heeling over and toppling down of the vehicle can be prevented.
摘要翻译：提供了一种导向车辆运输系统，即使当强大的侧向外力施加在车辆上时，也可以防止车辆倒塌。系统的故障保护机构构成为，具有在其每个垂直引导表面的上部水平延伸的用于引导车辆的保护轮22,23的凸缘34的护栏31被放置在导轨轨道3（凹陷10）沿着其中心孤立，车辆设置有自动转向机构09和用于转向前后行进轮的致动器06，并且所述保护轮设置在车辆中可在横向平面内旋转并被接收在护栏33的直径小于防护轮22（23）直径的辅助防护轮33设置在其上，与保护轮22（23）一起旋转。当车辆由于横风而横向受到强烈的侧向外力移动时，辅助防护轮33进入保护轨31的凸缘34的下方，并且能够防止车辆倾倒并向下倾斜。

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