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1. 发明申请

US20090016733A1 Optical waveguide holding member and optical transceiver 有权
公开(公告)号：US20090016733A1
公开(公告)日：2009-01-15
申请号：US12071177
申请日：2008-02-15
申请人： Masahiro Hamazaki , Osamu Daikuhara , Yuko Ohse
发明人： Masahiro Hamazaki , Osamu Daikuhara , Yuko Ohse
IPC分类号： H04B10/00 , G02B6/00
CPC分类号： G02B6/421 , G02B6/4246 , G02B6/4249 , G02B6/4292
摘要： An optical transceiver using an optical waveguide holding member is disclosed. The optical transceiver includes a printed circuit board and the optical waveguide holding member. Photoelectric conversion elements are formed in the printed circuit board. An optical waveguide including core members is formed in the optical waveguide holding member. The optical waveguide optically connects the photoelectric conversion elements to external optical fibers. An element side lens is formed at one end of the core member so as to face a light receiving and emitting section of the photoelectric conversion element. Flanges are formed on the corresponding side walls of the optical waveguide holding member. The fixed centers of the flanges and optical centers of the element side lenses are arrayed on the same straight line.

2. 发明授权

US07625138B2 Optical waveguide holding member and optical transceiver 有权
标题翻译：光波导保持构件和光收发器
公开(公告)号：US07625138B2
公开(公告)日：2009-12-01
申请号：US12071177
申请日：2008-02-15
申请人： Masahiro Hamazaki , Osamu Daikuhara , Yuko Ohse
发明人： Masahiro Hamazaki , Osamu Daikuhara , Yuko Ohse
IPC分类号： G02B6/36 , G02B6/26 , G02B6/42
CPC分类号： G02B6/421 , G02B6/4246 , G02B6/4249 , G02B6/4292
摘要： An optical transceiver using an optical waveguide holding member is disclosed. The optical transceiver includes a printed circuit board and the optical waveguide holding member. Photoelectric conversion elements are formed in the printed circuit board. An optical waveguide including core members is formed in the optical waveguide holding member. The optical waveguide optically connects the photoelectric conversion elements to external optical fibers. An element side lens is formed at one end of the core member so as to face a light receiving and emitting section of the photoelectric conversion element. Flanges are formed on the corresponding side walls of the optical waveguide holding member. The fixed centers of the flanges and optical centers of the element side lenses are arrayed on the same straight line.
摘要翻译：公开了一种使用光波导保持构件的光收发器。光收发器包括印刷电路板和光波导保持构件。光电转换元件形成在印刷电路板中。包括芯构件的光波导形成在光波导保持构件中。光波导将光电转换元件光连接到外部光纤。元件侧透镜形成在芯构件的一端，以面对光电转换元件的光接收和发射部分。法兰形成在光波导保持构件的相应侧壁上。元件侧透镜的凸缘和光学中心的固定中心排列在相同的直线上。

3. 发明申请

US20080007930A1 Photoelectric conversion module, assembling method thereof, high-speed transmission connector, and mounting system 有权
标题翻译：光电转换模块，其组装方法，高速传输连接器和安装系统
公开(公告)号：US20080007930A1
公开(公告)日：2008-01-10
申请号：US11700792
申请日：2007-02-01
申请人： Osamu Daikuhara , Yuko Ohse , Shigeyuki Takizawa , Toshio Hashi
发明人： Osamu Daikuhara , Yuko Ohse , Shigeyuki Takizawa , Toshio Hashi
IPC分类号： H05K7/02 , H04B10/00 , H05K13/04
CPC分类号： G02B6/4227 , G02B6/421 , G02B6/4214 , G02B6/4224 , G02B6/4246 , Y10T29/49137 , Y10T29/5313
摘要： A method of assembling a photoelectric conversion module is disclosed. The photoelectric conversion module includes a circuit board on which are mounted a light emitting element, a light receiving element, and an optical element optically connected to the light emitting element and the light receiving element. The light emitting element is positioned on the circuit board based on a positioning mark formed on the circuit board beforehand. The light receiving element and the optical element are positioned based on a position of a light emission point of the light emitting element.
摘要翻译：公开了组装光电转换模块的方法。光电转换模块包括电路板，其上安装有发光元件，光接收元件和与发光元件和光接收元件光学连接的光学元件。发光元件预先基于形成在电路板上的定位标记而位于电路板上。光接收元件和光学元件基于发光元件的发光点的位置而定位。

4. 发明授权

US09075208B2 Method for assembling a photoelectric conversion module 有权
标题翻译：组装光电转换模块的方法
公开(公告)号：US09075208B2
公开(公告)日：2015-07-07
申请号：US11700792
申请日：2007-02-01
申请人： Osamu Daikuhara , Yuko Ohse , Shigeyuki Takizawa , Toshio Hashi
发明人： Osamu Daikuhara , Yuko Ohse , Shigeyuki Takizawa , Toshio Hashi
IPC分类号： H05K3/30 , G02B6/42
CPC分类号： G02B6/4227 , G02B6/421 , G02B6/4214 , G02B6/4224 , G02B6/4246 , Y10T29/49137 , Y10T29/5313
摘要： A method of assembling a photoelectric conversion module is disclosed. The photoelectric conversion module includes a circuit board on which are mounted a light emitting element, a light receiving element, and an optical element optically connected to the light emitting element and the light receiving element. The light emitting element is positioned on the circuit board based on a positioning mark formed on the circuit board beforehand. The light receiving element and the optical element are positioned based on a position of a light emission point of the light emitting element.
摘要翻译：公开了组装光电转换模块的方法。光电转换模块包括电路板，其上安装有发光元件，光接收元件和与发光元件和光接收元件光学连接的光学元件。发光元件预先基于形成在电路板上的定位标记而位于电路板上。光接收元件和光学元件基于发光元件的发光点的位置而定位。

5. 发明申请

US20080150163A1 Mounting structure for semiconductor element 有权
标题翻译：半导体元件的安装结构
公开(公告)号：US20080150163A1
公开(公告)日：2008-06-26
申请号：US11797883
申请日：2007-05-08
申请人： Yuko Ohse , Osamu Daikuhara , Hideki Takauchi
发明人： Yuko Ohse , Osamu Daikuhara , Hideki Takauchi
IPC分类号： H01L23/48
CPC分类号： H01L23/49513 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/83 , H01L24/85 , H01L2224/05554 , H01L2224/26175 , H01L2224/27013 , H01L2224/29101 , H01L2224/2919 , H01L2224/29339 , H01L2224/32057 , H01L2224/32225 , H01L2224/45144 , H01L2224/48011 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/83051 , H01L2224/83192 , H01L2224/83385 , H01L2224/83855 , H01L2224/85 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/00014 , H01L2924/2065 , H01L2924/00 , H01L2924/00012
摘要： A mounting structure for a semiconductor element is disclosed. The semiconductor element is bonded to a die pad through an adhesive film, which is formed by applying a predetermined amount of a paste adhesive onto the surface of the die pad and placing the semiconductor element on the die pad so as to press and spread the adhesive between the lower surface of the semiconductor element and the die pad. A wire extends between the semiconductor element and a terminal pad disposed around the die pad. The die pad includes plural grooves in the surface thereof. Each of the grooves extends from the center of the die pad toward a peripheral edge of the die pad and ends at the inner side of the peripheral edge of the die pad.
摘要翻译：公开了一种用于半导体元件的安装结构。半导体元件通过粘合剂膜粘合到芯片焊盘上，粘合剂膜通过将预定量的糊状粘合剂施加到芯片焊盘的表面上并将半导体元件放置在芯片焊盘上而使其粘合在半导体元件的下表面和芯片焊盘之间。导线延伸在半导体元件和设置在管芯焊盘周围的端子焊盘之间。芯片焊盘在其表面上包括多个凹槽。每个凹槽从芯片焊盘的中心朝向芯片焊盘的周边边缘延伸，并在芯片焊盘的周缘的内侧终止。

6. 发明申请

US20080037934A1 Optical connector 审中-公开
标题翻译：光连接器
公开(公告)号：US20080037934A1
公开(公告)日：2008-02-14
申请号：US11711035
申请日：2007-02-27
申请人： Osamu Daikuhara , Yuko Ohse , Shigeyuki Takizawa , Toshio Hashi , Hideo Miyazawa
发明人： Osamu Daikuhara , Yuko Ohse , Shigeyuki Takizawa , Toshio Hashi , Hideo Miyazawa
IPC分类号： G02B6/42
CPC分类号： G02B6/3825 , G02B6/3879 , G02B6/3885 , G02B6/4214 , G02B6/4246 , G02B6/4249 , G02B6/4292
摘要： An optical connector is disclosed. The optical connector includes a first waveguide member that includes a first waveguide, a first lens disposed at one end surface of the first waveguide, and a second lens disposed at the other end surface of the first waveguide.
摘要翻译：公开了一种光连接器。光连接器包括：第一波导构件，其包括第一波导，设置在第一波导的一个端面处的第一透镜，以及设置在第一波导的另一端面的第二透镜。

7. 发明授权

US07948091B2 Mounting structure for semiconductor element 有权
标题翻译：半导体元件的安装结构
公开(公告)号：US07948091B2
公开(公告)日：2011-05-24
申请号：US11797883
申请日：2007-05-08
申请人： Yuko Ohse , Osamu Daikuhara , Hideki Takauchi
发明人： Yuko Ohse , Osamu Daikuhara , Hideki Takauchi
IPC分类号： H01L23/50 , H01L23/12 , H01L23/48 , H01L23/495 , H01L23/28
CPC分类号： H01L23/49513 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/83 , H01L24/85 , H01L2224/05554 , H01L2224/26175 , H01L2224/27013 , H01L2224/29101 , H01L2224/2919 , H01L2224/29339 , H01L2224/32057 , H01L2224/32225 , H01L2224/45144 , H01L2224/48011 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/83051 , H01L2224/83192 , H01L2224/83385 , H01L2224/83855 , H01L2224/85 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/00014 , H01L2924/2065 , H01L2924/00 , H01L2924/00012
摘要： A mounting structure for a semiconductor element is disclosed. The semiconductor element is bonded to a die pad through an adhesive film, which is formed by applying a predetermined amount of a paste adhesive onto the surface of the die pad and placing the semiconductor element on the die pad so as to press and spread the adhesive between the lower surface of the semiconductor element and the die pad. A wire extends between the semiconductor element and a terminal pad disposed around the die pad. The die pad includes plural grooves in the surface thereof. Each of the grooves extends from the center of the die pad toward a peripheral edge of the die pad and ends at the inner side of the peripheral edge of the die pad.
摘要翻译：公开了一种用于半导体元件的安装结构。半导体元件通过粘合剂膜粘合到芯片焊盘上，粘合剂膜通过将预定量的糊状粘合剂施加到芯片焊盘的表面上并将半导体元件放置在芯片焊盘上而使其粘合在半导体元件的下表面和芯片焊盘之间。导线在半导体元件和设置在管芯焊盘周围的端子焊盘之间延伸。芯片焊盘在其表面上包括多个凹槽。每个凹槽从芯片焊盘的中心朝向芯片焊盘的周边边缘延伸，并在芯片焊盘的周缘的内侧终止。

8. 发明授权

US08288661B2 Printed circuit board and manufacturing method therefor 失效
标题翻译：印刷电路板及其制造方法
公开(公告)号：US08288661B2
公开(公告)日：2012-10-16
申请号：US12617191
申请日：2009-11-12
申请人： Osamu Daikuhara , Toshihiro Kusagaya , Toru Yamakami , Takahiro Kondou
发明人： Osamu Daikuhara , Toshihiro Kusagaya , Toru Yamakami , Takahiro Kondou
IPC分类号： H05K1/11
CPC分类号： H05K3/242 , H05K1/117 , H05K3/0047 , H05K3/429 , H05K2201/0919 , H05K2201/0949 , H05K2203/0207 , H05K2203/175 , Y10T29/49117 , Y10T29/49155 , Y10T29/49165
摘要： A printed circuit board of a card edge connector type includes interconnections formed on a surface of a substrate to be electrically coupled to respective connecting terminals formed by electrolytic plating on an edge of the substrate, and connecting terminal-forming wirings being respectively in connection with the interconnections, when the connecting terminals are formed by the electrolytic plating. The interconnections are electrically isolated from the connecting terminal-forming wirings by process openings formed in the substrate.
摘要翻译：卡边缘连接器类型的印刷电路板包括形成在基板的表面上的互连，该互连电连接到在基板的边缘上由电解电镀形成的各个连接端子，以及连接端子形成布线分别与当连接端子由电解电镀形成时，互连。互连通过形成在基板中的工艺开口与连接端子形成布线电隔离。

9. 发明授权

US07894691B2 Mounting configuration and method of optical waveguide holding member 有权
标题翻译：光波导保持构件的安装结构和方法
公开(公告)号：US07894691B2
公开(公告)日：2011-02-22
申请号：US12426321
申请日：2009-04-20
申请人： Yuko Ikeda , Toshihiro Kusagaya , Osamu Daikuhara
发明人： Yuko Ikeda , Toshihiro Kusagaya , Osamu Daikuhara
IPC分类号： G02B6/12 , G02B6/36
CPC分类号： G02B6/4239 , B29C65/1406 , B29C65/4845 , B29C65/485 , B29C65/76 , B29C66/1122 , B29C66/474 , B29C66/71 , B29C66/712 , B29C66/73111 , B29C66/73112 , B29C66/73161 , B29C66/863 , B29C2035/0827 , B29K2023/00 , B29K2063/00 , B29K2105/06 , B29K2309/08 , B29K2995/0029 , B29L2031/3425 , G02B6/4204 , G02B6/423 , G02B6/4246 , G02B6/4249 , G02B6/43 , B29C65/00
摘要： An article of manufacture is applied to an optical waveguide holding member including a contact surface on the bottom face, which is to be in contact with a printed circuit board; a connection surface on the back face; an optical waveguide connecting the contact surface and the connection surface; and a lens unit disposed at an end of the optical waveguide. A light curing adhesive is applied to a part of the contact surface, adjacent to the lens unit so that the part is bonded to the printed circuit board. A two-component mixed adhesive is applied to, along peripheries of the contact surface in contact with the printed circuit board, outer edges of lateral-side peripheries adjacent to the lens unit and an outer edge of a back-side periphery close to the back face so that the lateral-side peripheries and the back-side periphery are bonded to the printed circuit board.
摘要翻译：将制造物品应用于包括与印刷电路板接触的底面上的接触面的光波导保持部件; 背面上的连接表面; 连接所述接触面和所述连接面的光波导; 以及设置在光波导的端部的透镜单元。将光固化粘合剂施加到接触表面的与透镜单元相邻的部分，使得该部分结合到印刷电路板。沿着与印刷电路板接触的接触表面的周边，将双组分混合粘合剂施加到与透镜单元相邻的侧面周边的外边缘和靠近背面的背侧外周的外边缘使得侧面周边和背面周边接合到印刷电路板。

10. 发明授权

US07297028B2 Cable connector type transceiver module 失效
标题翻译：电缆连接器型收发模块
公开(公告)号：US07297028B2
公开(公告)日：2007-11-20
申请号：US11489482
申请日：2006-07-20
申请人： Osamu Daikuhara , Koichi Kiryu , Toshihiro Kusagaya , Tohru Yamakami , Shigeyuki Takizawa , Yasuyuki Miki
发明人： Osamu Daikuhara , Koichi Kiryu , Toshihiro Kusagaya , Tohru Yamakami , Shigeyuki Takizawa , Yasuyuki Miki
IPC分类号： H01R9/03
CPC分类号： G02B6/4246
摘要： A cable connector type transceiver module is disclosed. Pads for wire soldering are disposed near a card edge connecting section of the tip of a printed circuit board on the printed circuit board. Pairs of wires of a cable for balanced transmission are extended in the direction of the card edge connecting section over a control IC package. Signal wires at the tips of insulation covered signal wires of the pairs of wires are soldered to the pads for wire soldering at the position near the card edge connecting section rather than near the control IC package.
摘要翻译：公开了一种电缆连接器型收发器模块。用于焊锡的焊盘设置在印刷电路板上的印刷电路板的尖端的卡缘连接部分附近。用于平衡传输的电缆的电线对通过控制IC封装在卡缘连接部分的方向上延伸。电线对绝缘覆盖信号线的信号线焊接到靠近卡边缘连接部分位置而不是控制IC封装附近的焊盘焊盘。

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