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1. 发明授权

US06965552B2 Mounting method for optical device and optical head equipment 有权
标题翻译：光学设备和光学头设备的安装方法
公开(公告)号：US06965552B2
公开(公告)日：2005-11-15
申请号：US10083395
申请日：2002-02-27
申请人： Masahide Tokuda , Kimio Tatsuno , Hirohisa Sano , Takeshi Shimano , Shigeharu Kimura
发明人： Masahide Tokuda , Kimio Tatsuno , Hirohisa Sano , Takeshi Shimano , Shigeharu Kimura
IPC分类号： G11B7/09 , G11B7/00 , G11B7/125 , G11B7/13 , G11B7/22 , H01S5/022 , H01S5/323 , H05K3/34
CPC分类号： G11B7/127 , G11B7/123 , G11B7/22 , G11B2007/0006 , H05K3/341 , H05K3/3436
摘要： A method of mounting an optical device having a step on the surface opposing to a mounting substrate favorably by face-down bonding which enables a decrease in the number of components or integrate additional components on one identical substrate and, accordingly, is useful for reducing the size and the thickness of an optical head using a light source, the method includes the step of making the volume of a solder pattern to the area ratio of each electrode different for every wiring electrode portions upon mounting the electrodes on the substrate for mounting the optical device, in which the optical device having the step can be mounted favorably to the substrate by the control for the height of solder upon melting.
摘要翻译：一种通过面朝下的粘合方式将具有台阶的光学装置安装在与安装基板相对的表面上的方法，其能够减少部件数量或将附加部件集成在一个相同的基板上，因此可用于减小尺寸和使用光源的光学头的厚度，该方法包括以下步骤：在将电极安装在用于安装光学的基板上的每个布线电极部分上使焊料图案的体积与每个电极的面积比不同装置，其中具有台阶的光学装置可以通过熔化时焊料高度的控制而有利地安装在基板上。

2. 发明授权

US06782018B2 Diode laser module and application equipment 失效
标题翻译：二极管激光模块及应用设备
公开(公告)号：US06782018B2
公开(公告)日：2004-08-24
申请号：US10082339
申请日：2002-02-26
申请人： Kimio Tatsuno , Masahide Tokuda , Shigeharu Kimura , Takeshi Shimano , Hirohisa Sano
发明人： Kimio Tatsuno , Masahide Tokuda , Shigeharu Kimura , Takeshi Shimano , Hirohisa Sano
IPC分类号： H01S300
CPC分类号： G11B7/127 , H01S5/02212 , H01S5/02228 , H01S5/02248 , H01S5/02292 , H01S5/02296
摘要： This invention is provided to reduce wavefront aberrations caused by the filling of a transparent resin intended to prevent degradation of a diode laser in a hermetically sealed package. A parallel-plane plate is arranged between a diode laser and an objective lens, and a transparent resin is filled into a space formed between the diode laser and the parallel-plane plate. With this invention, degradations of the diode lasers can be prevented and the wavefront aberrations can be reduced.
摘要翻译：提供本发明以减少由于填充透明树脂引起的波前像差，以防止密封封装中二极管激光器的劣化。在二极管激光器和物镜之间设置平行平板，并且将透明树脂填充到二极管激光器和平行平板之间形成的空间中。利用本发明，可以防止二极管激光器的劣化，并且可以减小波面像差。

3. 发明申请

US20050122880A1 Optical head with lasers and mirrors in a recess formed in a substrate 失效
标题翻译：具有在衬底中形成的凹部中的激光器和反射镜的光学头
公开(公告)号：US20050122880A1
公开(公告)日：2005-06-09
申请号：US11028325
申请日：2005-01-04
申请人： Kimio Tatsuno , Masahide Tokuda , Hirohisa Sano , Toshiaki Tanaka , Takeshi Shimano , Shigeru Nakamura , Takeshi Maeda , Akira Arimoto
发明人： Kimio Tatsuno , Masahide Tokuda , Hirohisa Sano , Toshiaki Tanaka , Takeshi Shimano , Shigeru Nakamura , Takeshi Maeda , Akira Arimoto
IPC分类号： G11B7/00 , G11B7/12 , G11B7/125 , G11B7/22 , G11B21/00 , H01S3/00 , H01S5/022 , H01S5/0683 , H01S5/40 , G11B3/00 , H01S5/00
CPC分类号： G11B7/22 , G11B7/123 , G11B7/1275 , G11B2007/0006 , H01S5/02216 , H01S5/02244 , H01S5/02252 , H01S5/02292 , H01S5/02296 , H01S5/0683 , H01S5/4087
摘要： An integrated optical head records and reproduces information to and from optical discs of different types, including CD and DVD, with use of a single information recording/reproducing apparatus. The optical head has a plurality of semiconductor lasers of different wavelengths integrated by index alignment onto a substrate formed with an optoelectric integrated circuit, photodetection patterns, and a reflecting mirror.
摘要翻译：集成光学头使用单个信息记录/再现装置将信息记录到不同类型的光盘（包括CD和DVD）上并从其中再现信息。该光头具有多个不同波长的半导体激光器，其通过索引对准而集成到形成有光电集成电路，光电检测图案和反射镜的基板上。

4. 发明授权

US07292519B2 Optical head with lasers and mirrors in a recess formed in a substrate 失效
标题翻译：具有在衬底中形成的凹部中的激光器和反射镜的光学头
公开(公告)号：US07292519B2
公开(公告)日：2007-11-06
申请号：US11028325
申请日：2005-01-04
申请人： Kimio Tatsuno , Masahide Tokuda , Hirohisa Sano , Toshiaki Tanaka , Takeshi Shimano , Shigeru Nakamura , Takeshi Maeda , Akira Arimoto
发明人： Kimio Tatsuno , Masahide Tokuda , Hirohisa Sano , Toshiaki Tanaka , Takeshi Shimano , Shigeru Nakamura , Takeshi Maeda , Akira Arimoto
IPC分类号： G11B7/00
CPC分类号： G11B7/22 , G11B7/123 , G11B7/1275 , G11B2007/0006 , H01S5/02216 , H01S5/02244 , H01S5/02252 , H01S5/02292 , H01S5/02296 , H01S5/0683 , H01S5/4087
摘要： An integrated optical head records and reproduces information to and from optical discs of different types, including CD and DVD, with use of a single information recording/reproducing apparatus. The optical head has a plurality of semiconductor lasers of different wavelengths integrated by index alignment onto a substrate formed with an optoelectric integrated circuit, photodetection patterns, and a reflecting mirror.
摘要翻译：集成光学头使用单个信息记录/再现装置将信息记录到不同类型的光盘（包括CD和DVD）上并从其中再现信息。该光头具有多个不同波长的半导体激光器，其通过索引对准而集成到形成有光电集成电路，光电检测图案和反射镜的基板上。

5. 发明授权

US4686606A Device for cooling integrated circuit chip 失效
标题翻译：集成电路芯片冷却装置
公开(公告)号：US4686606A
公开(公告)日：1987-08-11
申请号：US827613
申请日：1986-02-10
申请人： Minoru Yamada , Mitsuru Usui , Akira Masaki , Keiichirou Nakanishi , Masahide Tokuda
发明人： Minoru Yamada , Mitsuru Usui , Akira Masaki , Keiichirou Nakanishi , Masahide Tokuda
IPC分类号： H01L23/473 , H01L21/58 , H01L23/36 , H01L23/373 , H01L23/433 , H05K7/20
CPC分类号： H01L24/83 , H01L23/3736 , H01L23/4332 , H01L24/29 , H01L2224/16225 , H01L2224/29109 , H01L2224/29191 , H01L2224/73253 , H01L2224/8319 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/0133 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/15312 , H01L2924/16152
摘要： A cooling structure for cooling a multichip module for effectively removing heat generated from integrated circuit chips. A suction plate formed with minute grooves on one of its surfaces is disposed between each integrated circuit chip and an associated cooling block and is brought into contact at a grooved surface with the integrated circuit chip through a layer of a liquid such as silicone oil interposed therebetween, thereby producing negative hydrostatic pressure by capillary action of the minute grooves. The suction plate has a thickness small enough to be bent under influence of the negative hydrostatic pressure to follow a warping of the integrated circuit chip, so that the clearance between the opposing surfaces of the suction plate and the integrated circuit chip can be minimized. Thus, an integrated circuit chip cooling device of surface-to-surface contact type operable with a low thermal resistance is provided, which can improve the maintainability and reliability without sacrificing the cooling efficiency.
摘要翻译：一种用于冷却多芯片模块的冷却结构，用于有效地去除由集成电路芯片产生的热量。在其一个表面上形成有微小凹槽的吸盘设置在每个集成电路芯片和相关联的冷却块之间，并且在沟槽表面与集成电路芯片通过一层液体（例如插入其间的硅油）接触，从而通过微小凹槽的毛细管作用产生负静压。吸盘的厚度足够小以在负静压力的影响下弯曲，以跟随集成电路芯片的翘曲，使得吸板和集成电路芯片的相对表面之间的间隙可以最小化。因此，提供了以低热阻可操作的表面接触型的集成电路芯片冷却装置，这可以在不牺牲冷却效率的情况下提高可维护性和可靠性。

6. 发明授权

US5251100A Semiconductor integrated circuit device with cooling system and manufacturing method therefor 失效
标题翻译：具有冷却系统的半导体集成电路器件及其制造方法
公开(公告)号：US5251100A
公开(公告)日：1993-10-05
申请号：US934330
申请日：1992-08-25
申请人： Yuuji Fujita , Masahide Tokuda
发明人： Yuuji Fujita , Masahide Tokuda
IPC分类号： H01L23/36 , H01L23/40 , H01L23/473 , H05K7/20
CPC分类号： H01L23/4006 , H01L23/473 , H01L2023/4043 , H01L2224/16225
摘要： A semiconductor integrated circuit device is equipped with a cooling system which serves to cool a plurality of integrated circuit chips mounted on a circuit board. The cooling system is kept in contact with the upper surfaces of the plurality of integrated circuit chips. A chip surface arranging plate of uniform thickness is formed with apertures smaller than the integrated circuit chips mounted on the circuit board. The cooling system is fixed on the chip surface arranging plate. The upper surfaces of the integrated circuit chips are substantially kept flush by the chip surface arranging plate. Further, the integrated circuit chips are thermally joined to the cooling system so that heat generated by the integrated circuit chips is removed by the cooling system. The plurality of integrated circuit chips are joined to the chip surface arranging plate by applying a vacuum that causes suction of air through the apertures formed in the chip surface arranging plate. Thereafter, the cooling system is fixed to the chip surface arranging plate.
摘要翻译：半导体集成电路器件配备有用于冷却安装在电路板上的多个集成电路芯片的冷却系统。冷却系统与多个集成电路芯片的上表面保持接触。具有均匀厚度的芯片表面布置板形成有小于安装在电路板上的集成电路芯片的孔。冷却系统固定在芯片表面布置板上。集成电路芯片的上表面通过芯片表面布置板基本保持齐平。此外，集成电路芯片被热接合到冷却系统，使得由集成电路芯片产生的热量被冷却系统去除。多个集成电路芯片通过施加通过形成在芯片表面布置板中的孔的空气吸引的真空而接合到芯片表面布置板。此后，将冷却系统固定到芯片表面布置板。

7. 发明授权

US5870289A Chip connection structure having diret through-hole connections through adhesive film and wiring substrate 失效
标题翻译：芯片连接结构具有通过粘合膜和布线基板的直通通孔连接
公开(公告)号：US5870289A
公开(公告)日：1999-02-09
申请号：US572747
申请日：1995-12-14
申请人： Masahide Tokuda , Takeshi Kato , Hiroyuki Itoh , Masayoshi Yagyu , Yuuji Fujita , Mitsuo Usami
发明人： Masahide Tokuda , Takeshi Kato , Hiroyuki Itoh , Masayoshi Yagyu , Yuuji Fujita , Mitsuo Usami
IPC分类号： H01L21/60 , H01L21/68 , H01L21/98 , H01L23/12 , H01L23/28 , H01L23/29 , H01L23/31 , H01L23/538 , H01L25/065 , H01L25/07 , H01L25/10 , H01L25/11 , H01L25/18 , H05K1/11 , H05K1/18 , H05K3/30 , H05K3/32 , H05K3/40 , H05K1/14 , H05K1/16 , H05K7/02 , H05K7/06
CPC分类号： H01L21/6836 , H01L21/6835 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/97 , H01L25/0655 , H01L25/0657 , H01L25/50 , H01L2221/68327 , H01L2221/68354 , H01L2224/0401 , H01L2224/04105 , H01L2224/16 , H01L2224/16235 , H01L2224/20 , H01L2224/24227 , H01L2224/451 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/4518 , H01L2224/45184 , H01L2224/48091 , H01L2224/48227 , H01L2224/83192 , H01L2224/9202 , H01L2224/92144 , H01L2224/97 , H01L2225/06517 , H01L2225/0652 , H01L2225/06541 , H01L2225/06572 , H01L2225/06582 , H01L2225/06586 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/351 , H05K1/112 , H05K3/303 , H05K3/4007
摘要： A structure for connecting an integrated circuit chip to a wiring substrate which implements high-density packaging, high-density connection, high-speed signal transmission, and low cost. An integrated circuit is connected to a wiring substrate by means of flip-chip die bonding using an adhesive film. A direct through-hole connection is formed directly below a connecting pad so as to pass through the adhesive film and the wiring substrate. This direct through-hole connection directly connects the connecting pad to the wire. As a result of reduced area and thickness of the chip, the chip is mounted in high density, and high-density inputs and outputs are implemented by means of minute two-dimensional connections. Short wire connections directly connected to the chip permit high speed signal transmission, and high reliability is ensured by the dispersion of stress. Low-cost packaging can be effected by simple processes and facilities.
摘要翻译：用于将集成电路芯片连接到实现高密度封装，高密度连接，高速信号传输和低成本的布线基板的结构。集成电路通过使用粘合膜的倒装芯片贴片连接到布线基板。直接通孔连接形成在连接焊盘的正下方，以穿过粘合膜和布线基板。这种直接通孔连接将连接垫直接连接到电线。由于芯片的面积和厚度减小，芯片以高密度安装，高密度输入和输出通过微小的二维连接来实现。直接连接到芯片的短线连接允许高速信号传输，并且通过应力分散来确保高可靠性。低成本的包装可以通过简单的工艺和设施来实现。

8. 发明授权

US4819857A Method for fabricating composite structure 失效
标题翻译：复合结构制作方法
公开(公告)号：US4819857A
公开(公告)日：1989-04-11
申请号：US109449
申请日：1987-10-19
申请人： Kenichi Mizuishi , Masahide Tokuda , Katuaki Chiba
发明人： Kenichi Mizuishi , Masahide Tokuda , Katuaki Chiba
IPC分类号： B23K35/14 , H01L21/60 , H01L23/433
CPC分类号： H01L24/83 , H01L23/4332 , H01L24/29 , H01L24/32 , H01L2224/13111 , H01L2224/29011 , H01L2224/29101 , H01L2224/29111 , H01L2224/29116 , H01L2224/73253 , H01L2224/73257 , H01L2224/83101 , H01L2224/83194 , H01L2224/83801 , H01L2224/83805 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01023 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/157 , H01L2924/15787
摘要： A method for fabricating a composite structure, in which an intermediate member is sandwiched between first and second members, is disclosed. In this method, the intermediate member is disposed along the periphery of a spatial region formed between facing surfaces of the first and second members so that the spatial region is enclosed by the intermediate member, the fluidity of the intermediate member is enhanced under an atmosphere having a predetermined pressure, and then the pressure of the atmosphere is increased to make the intermediate member flow into the spatial region.
摘要翻译：公开了一种制造复合结构的方法，其中中间构件夹在第一和第二构件之间。在该方法中，中间构件沿着形成在第一和第二构件的相对表面之间的空间区域的周边设置，使得空间区域被中间构件包围，中间构件的流动性在具有预定压力，然后增加气氛的压力，使中间部件流入空间区域。

9. 发明授权

US06829265B2 Semiconductor laser array 失效
标题翻译：半导体激光阵列
公开(公告)号：US06829265B2
公开(公告)日：2004-12-07
申请号：US10145022
申请日：2002-05-15
申请人： Shinichi Nakatsuka , Susumu Saito , Junshin Sakamoto , Kazuo Sakaki , Masahide Tokuda
发明人： Shinichi Nakatsuka , Susumu Saito , Junshin Sakamoto , Kazuo Sakaki , Masahide Tokuda
IPC分类号： H01S304
CPC分类号： H01S5/4031 , H01L2224/13 , H01S5/0224 , H01S5/02272 , H01S5/02276
摘要： The subject of the disclosed art is to prevent a short circuit between plural electrodes caused by soldering in the assembling process for a semiconductor laser element. The constitution for improving the subject is as follows. A semiconductor laser device comprises a semiconductor laser chip having a first electrode and a laser sustaining material, in which the laser sustaining material has electrodes and solder layers connected electrically therewith on the surface where the semiconductor laser chip is mounted, the first electrode of the semiconductor laser chip is connected with the solder layer of the laser sustaining material and at least the solder layer of the laser sustaining material extends from at least one end face in the longitudinal direction of an optical resonator of the semiconductor laser chip to the outside of the optical resonator.
摘要翻译：所公开的技术的主题是为了防止在半导体激光元件的组装过程中由焊接引起的多个电极之间的短路。改进主题的宪法如下。半导体激光器件包括具有第一电极和激光维持材料的半导体激光器芯片，其中激光维持材料具有在其上安装半导体激光器芯片的表面上与其电连接的电极和焊料层，半导体的第一电极激光芯片与激光维持材料的焊料层连接，并且至少激光维持材料的焊料层从半导体激光器芯片的光学谐振器的纵向方向上的至少一个端面延伸到光学器件的外部谐振器。

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