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    • 3. 发明授权
    • Semiconductor laser array
    • 半导体激光阵列
    • US06829265B2
    • 2004-12-07
    • US10145022
    • 2002-05-15
    • Shinichi NakatsukaSusumu SaitoJunshin SakamotoKazuo SakakiMasahide Tokuda
    • Shinichi NakatsukaSusumu SaitoJunshin SakamotoKazuo SakakiMasahide Tokuda
    • H01S304
    • H01S5/4031H01L2224/13H01S5/0224H01S5/02272H01S5/02276
    • The subject of the disclosed art is to prevent a short circuit between plural electrodes caused by soldering in the assembling process for a semiconductor laser element. The constitution for improving the subject is as follows. A semiconductor laser device comprises a semiconductor laser chip having a first electrode and a laser sustaining material, in which the laser sustaining material has electrodes and solder layers connected electrically therewith on the surface where the semiconductor laser chip is mounted, the first electrode of the semiconductor laser chip is connected with the solder layer of the laser sustaining material and at least the solder layer of the laser sustaining material extends from at least one end face in the longitudinal direction of an optical resonator of the semiconductor laser chip to the outside of the optical resonator.
    • 所公开的技术的主题是为了防止在半导体激光元件的组装过程中由焊接引起的多个电极之间的短路。 改进主题的宪法如下。 半导体激光器件包括具有第一电极和激光维持材料的半导体激光器芯片,其中激光维持材料具有在其上安装半导体激光器芯片的表面上与其电连接的电极和焊料层,半导体的第一电极 激光芯片与激光维持材料的焊料层连接,并且至少激光维持材料的焊料层从半导体激光器芯片的光学谐振器的纵向方向上的至少一个端面延伸到光学器件的外部 谐振器。