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    • 1. 发明授权
    • Mask-to-wafer alignment utilizing zone plates
    • 使用区域的掩模到晶片对准
    • US4614433A
    • 1986-09-30
    • US629056
    • 1984-07-09
    • Martin FeldmanPeter A. HeimannWilliam A. JohnsonTheodore F. Retajczyk, Jr.Donald L. White
    • Martin FeldmanPeter A. HeimannWilliam A. JohnsonTheodore F. Retajczyk, Jr.Donald L. White
    • G01B11/24G03F1/00G03F9/00H01L21/027H01L21/30G01B11/27
    • G03F9/7076G03F9/7023
    • Mask-to-wafer alignment in X-ray lithography is advantageously carried out utilizing zone plate marks formed on the mask and wafer. In practice, it has been observed that the intensity and in some cases even the location of the centroid of the light spot formed by a zone plate mask can vary during alignment as the mask-to-wafer spacing is changed.The present invention is based on the discovery and analysis of the causes of such variations. Based thereon, applicants have devised a modified mask structure which, when used with a wafer in a zone plate alignment system, enables mask-to-wafer alignment to be made more easily and more reliably than was possible heretofore. The modified mask structure includes a localized blocking layer over each zone plate on the mask. This layer allows only a negligible portion of the light employed to illuminate the zone plates on the mask to propagate into the mask-to-wafer space. Also, the modified mask structure includes an antireflection layer that reduces interference effects between light spots imaged by the wafer zone plates and light reflected from the mask. Further, one layer of the modified mask structure is designed to have a quarter-wavelength thickness thereby minimizing interfering light reflected from that layer.
    • 利用在掩模和晶片上形成的区域板标记有利地进行X射线光刻中的掩模到晶片对准。 在实践中,已经观察到,随着掩模到晶片间隔的改变,强度以及在某些情况下甚至由区域板掩模形成的光斑的质心的位置可以在对准期间变化。 本发明基于对这种变化的原因的发现和分析。 基于此,申请人已经设计了改进的掩模结构,当与区板对准系统中的晶片一起使用时,能够使得掩模到晶片对准比以前更容易和更可靠地进行。 修改的掩模结构包括在掩模上的每个区域板上的局部阻挡层。 该层仅允许用于照射掩模上的区域板的光的可忽略部分传播到掩模到晶片空间。 此外,修改的掩模结构包括减少由晶片区域板成像的光点和从掩模反射的光线之间的干涉效应的抗反射层。 此外,修改的掩模结构的一层被设计为具有四分之一波长厚度,从而使从该层反射的干扰光最小化。
    • 9. 发明授权
    • Adaptive lithography membrane masks
    • 自适应光刻膜面膜
    • US06404481B1
    • 2002-06-11
    • US09578573
    • 2000-05-25
    • Martin FeldmanHenry I. SmithKen-Ichi MurookaMichael H. Lim
    • Martin FeldmanHenry I. SmithKen-Ichi MurookaMichael H. Lim
    • G03B2768
    • G03F7/70433G03F1/20G03F1/22G03F7/70633G03F7/70875
    • Techniques are disclosed to compensate for distortions in lithography by locally heating the membrane in a lithographic mask. The techniques may be used both to shrink and to expand areas of the mask locally, in order to adjust for varying magnitudes and signs of distortion. In one embodiment the correction method comprises two steps: (1) A send-ahead wafer is exposed and measured by conventional means to determine the overlay errors at several points throughout the field. (2) During exposure of subsequent wafers, calibrated beams of light are focused on the mask. The heating from the absorbed light produces displacements that compensate for the overlay errors measured with the send-ahead wafer. Any source of distortion may be corrected—for example, distortion appearing on the mask initially, distortion that only develops on the mask over time, or distortion on the wafer. In another embodiment, a reference pattern is formed on the membrane as a means of measuring mask distortion, and the heat input distribution needed to correct distortion is determined by subsequent measurements of the reference pattern. In this alternative embodiment, any source of distortion in the mask may be corrected.
    • 公开了通过局部加热光刻掩模中的膜来补偿光刻中的变形的技术。 这些技术可以同时用于收缩和局部扩大掩模的区域,以便调整变化的幅度和失真的迹象。 在一个实施例中,校正方法包括两个步骤:(1)通过传统手段对发射晶片进行曝光和测量,以确定整个场中的几个点处的覆盖误差。 (2)在后续晶片曝光期间,校准光束聚焦在掩模上。 来自吸收光的加热产生位移,补偿由发射晶片测量的重叠误差。 可以校正任何失真源 - 例如,最初出现在掩模上的失真,仅在掩模上随时间发生的失真或晶片上的失真。 在另一个实施例中,作为测量掩模失真的手段在膜上形成参考图案,并且通过参考图案的后续测量来确定校正失真所需的热输入分布。 在该替代实施例中,可以校正掩模中的任何失真源。