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    • 2. 发明授权
    • Mounting assemblies for a plurality of transistor integrated circuit
chips
    • 用于多个晶体管集成电路芯片的安装组件
    • US3972062A
    • 1976-07-27
    • US551941
    • 1975-02-21
    • Gene P. Hopp
    • Gene P. Hopp
    • H01L21/60H01L23/36H01L23/488H01L23/492H01L23/48H01L23/02H01L25/04H01L29/44
    • H01L23/492H01L23/36H01L23/488H01L24/81H01L2224/16H01L2224/73153H01L2224/81801H01L2924/01029H01L2924/01033H01L2924/014H01L2924/14
    • A mounting assembly for a power transistor integrated circuit chip having a pair of electrodes on one surface thereof comprising base and emitter connections and a third electrode on the opposite surface thereof comprising the collector connection, is fabricated by the method including the steps of providing an electrically conductive strip having a central cavity extending the length thereof, the depth of the cavity being substantially equal to the height of the chip and the strip also including arms extending outwardly at opposite sides of the cavity; tinning the strip with solder; placing transistor chips in the cavity adjacent each other with the collector electrodes thereof being in contacting engagement with the strip; heating the strip with the chips therein to reflow the solder for connecting the chips thereto at the collector electrode; and severing the strip transverse the length thereof between chips to provide individual power transistor chip mounting assemblies each having a pair of outwardly extending support feet formed from the severed arms of the strip. The mounting assembly can be mounted to printed circuit conductors which are in-line by soldering the support feet to predetermined ones of the conductors and the base and emitter electrodes to others of the conductors.
    • 一种用于功率晶体管集成电路芯片的安装组件,其在其一个表面上具有包括基极和发射极连接的一对电极和在其相对表面上的包括集电极连接的第三电极,通过该方法制造,该方法包括以下步骤: 导电带具有延伸其长度的中心腔,空腔的深度基本上等于芯片的高度,并且条带还包括在空腔的相对侧向外延伸的臂; 用锡焊锡条; 将晶体管芯片放置在彼此相邻的腔中,其集电极与条带接触接合; 用芯片加热带材以回收焊料,以在集电极处将芯片连接到其上; 并且切断条带横向于芯片之间的长度以提供单独的功率晶体管芯片安装组件,每个功率晶体管芯片安装组件具有由条带的切断臂形成的一对向外延伸的支撑脚。 安装组件可以通过将支撑脚焊接到导体的预定导体,将基极和发射极焊接到导线的其它部分,将其安装在线上的印刷电路导体上。
    • 3. 发明授权
    • Calibrator for timing meter
    • 计时器校准器
    • US4503509A
    • 1985-03-05
    • US402843
    • 1982-07-29
    • Thomas P. BeckerChristopher B. StoutGene P. Hopp
    • Thomas P. BeckerChristopher B. StoutGene P. Hopp
    • F02P17/02F02P17/04G01P21/02G05B23/02G01P3/481G01P21/00
    • G01P21/02F02P17/02F02P17/04F02P2017/003
    • An oscillator provides a series of pulses to the first of a plurality of cascaded counters. The BCD outputs of each counter provide a particular digit in the number of pulses counted during selected intervals. At least two AND means are coupled to respective sets of the counter outputs to provide speed signals when the corresponding numbers of pulses have been counted. A selected one of such signals resets the counters and also provides an inductive output for the magnetic probe of a timing meter. Additional AND means are respectively coupled to different sets of the counter outputs and provide timing signals when their respective numbers of pulses have been counted. A selected one of the timing signals energizes an LED which produces a light flash for the luminosity probe of the timing meter.
    • 振荡器向多个级联计数器中的第一个提供一系列脉冲。 每个计数器的BCD输出提供在选定间隔期间计数的脉冲数的特定数字。 当相应数量的脉冲被计数时,至少两个AND装置耦合到相应的计数器输出组。 所选择的一个这样的信号复位计数器,并且还为定时计的磁探针提供感应输出。 附加的和装置分别耦合到不同的计数器输出集合,并且当它们各自的脉冲数已被计数时提供定时信号。 所选择的一个定时信号激励LED,该LED产生用于定时计的发光度探针的闪光。
    • 4. 发明授权
    • Method for providing mounting assemblies for a plurality of transistor
integrated circuit chips
    • 用于为多个晶体管集成电路芯片提供安装组件的方法
    • US3936928A
    • 1976-02-10
    • US570297
    • 1975-04-21
    • Gene P. Hopp
    • Gene P. Hopp
    • H01L21/60H01L23/36H01L23/488B01J17/00
    • H01L24/81H01L23/36H01L23/488H01L2224/16H01L2224/81801H01L2924/01029H01L2924/01033H01L2924/014H01L2924/14Y10T29/49144
    • A mounting assembly for a power transistor integrated circuit chip having a pair of electrodes on one surface thereof comprising base and emitter connections and a third electrode on the opposite surface thereof comprising the collector connection, is fabricated by the method including the steps of providing an electrically conductive strip having a central cavity extending the length thereof, the depth of the cavity being substantially equal to the height of the chip and the strip also including arms extending outwardly at opposite sides of the cavity; tinning the strip with solder; placing transistor chips in the cavity adjacent each other with the collector electrodes thereof being in contacting engagement with the strip; heating the strip with the chips therein to reflow the solder for connecting the chips thereto at the collector electrode; and severing the strip transverse the length thereof between chips to provide individual power transistor chip mounting assemblies each having a pair of outwardly extending support feet formed from the severed arms of the strip. The mounting assembly can be mounted to printed circuit conductors which are in-line by soldering the support feet to predetermined ones of the conductors and the base and emitter electrodes to others of the conductors.
    • 一种用于功率晶体管集成电路芯片的安装组件,其在其一个表面上具有包括基极和发射极连接的一对电极和在其相对表面上的包括集电极连接的第三电极,通过该方法制造,该方法包括以下步骤: 导电带具有延伸其长度的中心空腔,空腔的深度基本上等于芯片的高度,并且条带还包括在空腔的相对侧向外延伸的臂; 用锡焊锡条; 将晶体管芯片放置在彼此相邻的腔中,其集电极与条带接触接合; 用芯片加热带材以回收焊料,以在集电极处将芯片连接到其上; 并且切断条带横向于芯片之间的长度以提供单独的功率晶体管芯片安装组件,每个功率晶体管芯片安装组件具有由条带的切断臂形成的一对向外延伸的支撑脚。 安装组件可以通过将支撑脚焊接到导体的预定导体,将基极和发射极焊接到导线的其它部分,将其安装在线上的印刷电路导体上。